SEMI 3D8 - Guide for Describing Silicon Wafers for Use as 300 mm Carrier Wafers in a 3DS-IC Temporary Bond-Debond (TBDB) Process

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1910 products

F11600 - SEMI F116 - Guide for Drain Segregation for Semiconductor Manufacturing Tools to Support Site Water Reuse
SEMI F116 - Guide for Drain Segregation for Semiconductor Manufacturing Tools to Support Site Water Reuse Sale priceMember Price: ₩113
Non-Member Price: ₩291,000
C09900 - SEMI C99 - Test Method for Determining Conductivity of Chemical Mechanical Planarization (CMP) Slurries and Related Chemicals
SEMI C99 - Test Method for Determining Conductivity of Chemical Mechanical Planarization (CMP) Slurries and Related Chemicals Sale priceMember Price: ₩113
Non-Member Price: ₩291,000
G00300 - SEMI G3 - 仕様　側面ろう付け積層板
SEMI G3 - 仕様　側面ろう付け積層板 Sale priceMember Price: ₩135
Non-Member Price: ₩348,000
T01600 - SEMI T16 - 極紫外線マスク自動識別用データマトリクス記号法適用の仕様
SEMI T16 - 極紫外線マスク自動識別用データマトリクス記号法適用の仕様 Sale priceMember Price: ₩135
Non-Member Price: ₩348,000
P03600 - SEMI P36 - 測長走査型電子顕微鏡（CD-SEM）用倍率標準試料のガイド
SEMI P36 - 測長走査型電子顕微鏡（CD-SEM）用倍率標準試料のガイド Sale priceMember Price: ₩135
Non-Member Price: ₩348,000
HB01300 - SEMI HB13 - Specification of Susceptors for HB-LED MOCVD Equipment Communication Interface
SEMI HB13 - Specification of Susceptors for HB-LED MOCVD Equipment Communication Interface Sale priceMember Price: ₩113
Non-Member Price: ₩291,000
G06100 - SEMI G61 - Specification for Cofired Ceramic Packages
SEMI G61 - Specification for Cofired Ceramic Packages Sale priceMember Price: ₩113
Non-Member Price: ₩226,000
C09800 - SEMI C98 - Guide for Chemical Mechanical Planarization (CMP) Particle Size Distribution (PSD) Measurement and Reporting Used in Semiconductor Manufacturing
SEMI C98 - Guide for Chemical Mechanical Planarization (CMP) Particle Size Distribution (PSD) Measurement and Reporting Used in Semiconductor Manufacturing Sale priceMember Price: ₩113
Non-Member Price: ₩291,000
Flex Electronics Webinar Master Class: July 2020 (On Demand)
Flex Electronics Webinar Master Class: July 2020 (On Demand) Sale priceMember Price: ₩25
Non-Member Price: ₩74,000
G00900 - SEMI G9 - 仕様　スタンピングによる半導体プラスチックDIPパッケージ用リードフレーム
SEMI G9 - 仕様　スタンピングによる半導体プラスチックDIPパッケージ用リードフレーム Sale priceMember Price: ₩135
Non-Member Price: ₩271,000
P04500 - SEMI P45 - マスク装置向けジョブデック・データフォーマットの仕様
SEMI P45 - マスク装置向けジョブデック・データフォーマットの仕様 Sale priceMember Price: ₩135
Non-Member Price: ₩348,000
E17700 - SEMI E177 - Specification for Transmission Electron Microscope (TEM) Lamella Carriers Used in Electron Microscopy Workflows
SEMI E177 - Specification for Transmission Electron Microscope (TEM) Lamella Carriers Used in Electron Microscopy Workflows Sale priceMember Price: ₩113
Non-Member Price: ₩291,000
T01200 - SEMI T12 - Specification for Tracing Jigs and Implements
SEMI T12 - Specification for Tracing Jigs and Implements Sale priceMember Price: ₩225
Non-Member Price: ₩572,000
E18300 - SEMI E183 - Specification for Rich Interactive Test Database (RITdb)
SEMI E183 - Specification for Rich Interactive Test Database (RITdb) Sale priceMember Price: ₩113
Non-Member Price: ₩291,000
G04800 - SEMI G48 - Specification for Measurement Method for Molded Plastic Package Tooling
SEMI G48 - Specification for Measurement Method for Molded Plastic Package Tooling Sale priceMember Price: ₩113
Non-Member Price: ₩226,000