SEMI 3D8 - Guide for Describing Silicon Wafers for Use as 300 mm Carrier Wafers in a 3DS-IC Temporary Bond-Debond (TBDB) Process

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1910 products

MS01300 - SEMI MS13 - Guide for Use of Test Patterns for Characterizing a Deep Reactive Ion Etching (DRIE) Process
SEMI MS13 - Guide for Use of Test Patterns for Characterizing a Deep Reactive Ion Etching (DRIE) Process Sale priceMember Price: ₩113
Non-Member Price: ₩291,000
A00400 - SEMI A4 - Specification for the Automated Test Equipment Tester Event Messaging for Semiconductors (TEMS)
SEMI A4 - Specification for the Automated Test Equipment Tester Event Messaging for Semiconductors (TEMS) Sale priceMember Price: ₩113
Non-Member Price: ₩291,000
Electronic Design Market Data (EDMD) - Subscription Edition
Electronic Design Market Data (EDMD) Subscription Edition Sale priceMember Price: ₩5,750
Non-Member Price: ₩16,385,000
D07900 - SEMI D79 - Test Method for Local and Overall Flicker of Flexible Displays
SEMI D79 - Test Method for Local and Overall Flicker of Flexible Displays Sale priceMember Price: ₩113
Non-Member Price: ₩291,000
D08000 - SEMI D80 - Test Method for Measurement of Water Vapor Transmission Rate for High Gas Barrier Plastic Film in a Short Time
SEMI D80 - Test Method for Measurement of Water Vapor Transmission Rate for High Gas Barrier Plastic Film in a Short Time Sale priceMember Price: ₩113
Non-Member Price: ₩291,000
G00300 - SEMI G3 - Specification for Sidebrazed Laminates
SEMI G3 - Specification for Sidebrazed Laminates Sale priceMember Price: ₩113
Non-Member Price: ₩291,000
PV05000 - SEMI PV50 - Specification for Impurities in Polyethylene Packaging Materials for Polysilicon Feedstock
SEMI PV50 - Specification for Impurities in Polyethylene Packaging Materials for Polysilicon Feedstock Sale priceMember Price: ₩113
Non-Member Price: ₩291,000
F11500 - SEMI F115 - Test Method for the Determination of Metallic Elements Present on Wetted Surfaces of Ultra High Purity Chemical Delivery Systems and Components
SEMI F115 - Test Method for the Determination of Metallic Elements Present on Wetted Surfaces of Ultra High Purity Chemical Delivery Systems and Components Sale priceMember Price: ₩113
Non-Member Price: ₩291,000
G05300 - SEMI G53 - Specification for Metal Lid/Preform Assembly
SEMI G53 - Specification for Metal Lid/Preform Assembly Sale priceMember Price: ₩113
Non-Member Price: ₩291,000
Electronic Design Market Data (EDMD) - Single Edition
Electronic Design Market Data (EDMD) Single Edition Sale priceMember Price: ₩2,750
Non-Member Price: ₩7,817,000
Flex Electronics Webinar Master Class: October 2020 (On Demand)
Flex Electronics Webinar Master Class: October 2020 (On Demand) Sale priceMember Price: ₩25
Non-Member Price: ₩74,000
Flex Electronics Webinar Master Class: August 2020 (On Demand)
Flex Electronics Webinar Master Class: August 2020 (On Demand) Sale priceMember Price: ₩25
Non-Member Price: ₩74,000
G03900 - SEMI G39 - Specification for Brazed Lead Flatpack Constructions, Including Leadframes, Suitable for Automated Assembly
SEMI G39 - Specification for Brazed Lead Flatpack Constructions, Including Leadframes, Suitable for Automated Assembly Sale priceMember Price: ₩113
Non-Member Price: ₩226,000
Flex Electronics Webinar Master Class: April 2021 (on demand)
Flex Electronics Webinar Master Class: April 2021 (on demand) Sale priceMember Price: ₩49
Non-Member Price: ₩149,000
P04000 - SEMI P40 - 極紫外線リソグラフィマスクの取り付けに関する要求条件およびアライメント基準位置の仕様
SEMI P40 - 極紫外線リソグラフィマスクの取り付けに関する要求条件およびアライメント基準位置の仕様 Sale priceMember Price: ₩135
Non-Member Price: ₩348,000