SEMI 3D8 - Guide for Describing Silicon Wafers for Use as 300 mm Carrier Wafers in a 3DS-IC Temporary Bond-Debond (TBDB) Process

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1910 products

T01500 - SEMI T15 - 治具IDの一般仕様 （コンセプト）
SEMI T15 - 治具IDの一般仕様 （コンセプト） Sale priceMember Price: ₩135
Non-Member Price: ₩348,000
F11900 - SEMI F119 - Test Method for Determining the Critical Pitting Temperature of Stainless Steel Surfaces Used in Corrosive Gas Systems by Use of a Ferric Chloride Solution
SEMI F119 - Test Method for Determining the Critical Pitting Temperature of Stainless Steel Surfaces Used in Corrosive Gas Systems by Use of a Ferric Chloride Solution Sale priceMember Price: ₩113
Non-Member Price: ₩291,000
D08100 - SEMI D81 - Test Method for Dimming Properties of Flat Panel Displays
SEMI D81 - Test Method for Dimming Properties of Flat Panel Displays Sale priceMember Price: ₩113
Non-Member Price: ₩291,000
PV02300 - SEMI PV23 - 結晶シリコン太陽電池（PV）モジュールの輸送環境におけるメカニカル振動試験の方法
SEMI PV23 - 結晶シリコン太陽電池（PV）モジュールの輸送環境におけるメカニカル振動試験の方法 Sale priceMember Price: ₩135
Non-Member Price: ₩348,000
T01300 - SEMI T13 - Specification for Device Tracking: Concepts, Behavior, and Services
SEMI T13 - Specification for Device Tracking: Concepts, Behavior, and Services Sale priceMember Price: ₩225
Non-Member Price: ₩572,000
G02700 - SEMI G27 - Specification for Leadframes for Plastic Leaded Chip Carrier (PLCC) Packages
SEMI G27 - Specification for Leadframes for Plastic Leaded Chip Carrier (PLCC) Packages Sale priceMember Price: ₩113
Non-Member Price: ₩226,000
Flex Electronics Webinar Master Class: October 2021 (on demand)
Flex Electronics Webinar Master Class: October 2021 (on demand) Sale priceMember Price: ₩49
Non-Member Price: ₩149,000
A00300 - SEMI A3 - Specification for Printed Circuit Board Equipment Communication Interfaces (PCBECI)
SEMI A3 - Specification for Printed Circuit Board Equipment Communication Interfaces (PCBECI) Sale priceMember Price: ₩225
Non-Member Price: ₩572,000
G02200 - SEMI G22 - Specification for Ceramic Pin Grid Array Packages
SEMI G22 - Specification for Ceramic Pin Grid Array Packages Sale priceMember Price: ₩113
Non-Member Price: ₩226,000
D08200 - SEMI D82 - Test Method for Viewing Angle of Flat Panel Displays
SEMI D82 - Test Method for Viewing Angle of Flat Panel Displays Sale priceMember Price: ₩113
Non-Member Price: ₩291,000
C10200 - SEMI C102 - Guide for Reporting Density and Porosity of Chemical Mechanical Planarization (CMP) Polishing Pads Used in Semiconductor Manufacturing
SEMI C102 - Guide for Reporting Density and Porosity of Chemical Mechanical Planarization (CMP) Polishing Pads Used in Semiconductor Manufacturing Sale priceMember Price: ₩113
Non-Member Price: ₩291,000
PV04700 - SEMI PV47 - 晶体硅光伏组件用减反射镀膜玻璃技术规范
SEMI PV47 - 晶体硅光伏组件用减反射镀膜玻璃技术规范 Sale priceMember Price: ₩113
Non-Member Price: ₩291,000
G00500 - SEMI G5 - Standard for Ceramic Chip Carriers
SEMI G5 - Standard for Ceramic Chip Carriers Sale priceMember Price: ₩113
Non-Member Price: ₩291,000
S00600 - SEMI S6 - 半導体製造装置の排気換気に関する環境，健康，安全のためのガイドライン
SEMI S6 - 半導体製造装置の排気換気に関する環境，健康，安全のためのガイドライン Sale priceMember Price: ₩225
Non-Member Price: ₩687,000
P03900 - SEMI P39 - OASISTM – オープン・アートワーク・システム・インターチェンジ・スタンダード（OPEN ARTWORK SYSTEM INTERCHANGE STANDARD）
SEMI P39 - OASISTM – オープン・アートワーク・システム・インターチェンジ・スタンダード（OPEN ARTWORK SYSTEM INTERCHANGE STANDARD） Sale priceMember Price: ₩135
Non-Member Price: ₩348,000