SEMI 3D16 - Specification for Glass Base Material for Semiconductor Packaging

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1910 products

P04600 - SEMI P46 - XMLによるフォトマスクのCD計測情報データの仕様
SEMI P46 - XMLによるフォトマスクのCD計測情報データの仕様 Sale priceMember Price: ₩135
Non-Member Price: ₩347,000
E18600 - SEMI E186 - Specification for Location and Dimensions for Power Connectors and Ethercat Ports in Mass Flow Controllers and Mass Flow Meters
SEMI E186 - Specification for Location and Dimensions for Power Connectors and Ethercat Ports in Mass Flow Controllers and Mass Flow Meters Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
G00100 - SEMI G1 - Specification for Cerdip Package Constructions
SEMI G1 - Specification for Cerdip Package Constructions Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
E18400 - SEMI E184 - Specification for 300 mm Tape Frame FOUP Load Port
SEMI E184 - Specification for 300 mm Tape Frame FOUP Load Port Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
Global Smart MedTech Symposium July (ON DEMAND) 2021
Global Smart MedTech Symposium July (ON DEMAND) 2021 Sale priceMember Price: ₩199
Non-Member Price: ₩329,000
T01000 - SEMI T10 - 二次元データマトリクス直接マーク品質を評価する試験方法
SEMI T10 - 二次元データマトリクス直接マーク品質を評価する試験方法 Sale priceMember Price: ₩135
Non-Member Price: ₩347,000
G01900 - SEMI G19 - エッチングにより製造されるDIPリードフレームのための仕様
SEMI G19 - エッチングにより製造されるDIPリードフレームのための仕様 Sale priceMember Price: ₩135
Non-Member Price: ₩271,000
E18800 - SEMI E188 - Specification for Malware Free Equipment Integration
SEMI E188 - Specification for Malware Free Equipment Integration Sale priceMember Price: ₩113
Non-Member Price: ₩571,000
G00600 - SEMI G6 - 検査方法　封止リング平坦度
SEMI G6 - 検査方法　封止リング平坦度 Sale priceMember Price: ₩135
Non-Member Price: ₩271,000
E18000 - SEMI E180 - Test Method for Measuring Surface Metal Contamination Through ICP-MS of Critical Chamber Components Used in Semiconductor Wafer Processing
SEMI E180 - Test Method for Measuring Surface Metal Contamination Through ICP-MS of Critical Chamber Components Used in Semiconductor Wafer Processing Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
HB01200 - SEMI HB12 - Specification for Dry-Etched Patterned Sapphire Substrates (DPSS)
SEMI HB12 - Specification for Dry-Etched Patterned Sapphire Substrates (DPSS) Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
PV09800 - SEMI PV99 - Classification of Building Integrated Photovoltaic (BIPV)
SEMI PV99 - Classification of Building Integrated Photovoltaic (BIPV) Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
T00600 - SEMI T6 - Procedure and Format for Reporting of Test Results by Electronic Data Interchange (EDI)
SEMI T6 - Procedure and Format for Reporting of Test Results by Electronic Data Interchange (EDI) Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
G03500 - SEMI G35 - Specification for Test Methods for Lead Finishes on Semiconductor (Active) Devices
SEMI G35 - Specification for Test Methods for Lead Finishes on Semiconductor (Active) Devices Sale priceMember Price: ₩113
Non-Member Price: ₩226,000
G01600 - SEMI G16 - Specification for Dimensions and Tolerances Used to Manufacture Plastic Chip Carrier Tooling
SEMI G16 - Specification for Dimensions and Tolerances Used to Manufacture Plastic Chip Carrier Tooling Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
P00500 - SEMI P5 - ペリクルの仕様
SEMI P5 - ペリクルの仕様 Sale priceMember Price: ₩135
Non-Member Price: ₩347,000
G00200 - SEMI G2 - CERDIPパッケージ用金属リードフレームの仕様
SEMI G2 - CERDIPパッケージ用金属リードフレームの仕様 Sale priceMember Price: ₩135
Non-Member Price: ₩347,000
A00500 - SEMI A5 - Specification for Factory Operation Extension for SEMI A2 SMASH (SMASH-FOX)
SEMI A5 - Specification for Factory Operation Extension for SEMI A2 SMASH (SMASH-FOX) Sale priceFrom ₩290,000 KRW
AUX00500 - SEMI AUX005 - Comparison Matrix Between SEMI S2-93A and S2-0200
SEMI AUX005 - Comparison Matrix Between SEMI S2-93A and S2-0200 Sale priceMember Price: ₩113
Non-Member Price: ₩256,000
P03700 - SEMI P37 - 極紫外線リソグラフィマスク基板の仕様
SEMI P37 - 極紫外線リソグラフィマスク基板の仕様 Sale priceMember Price: ₩135
Non-Member Price: ₩347,000
E18700 - SEMI E187 - Specification for Cybersecurity of Fab Equipment
SEMI E187 - Specification for Cybersecurity of Fab Equipment Sale priceMember Price: ₩113
Non-Member Price: ₩571,000
E18500 - SEMI E185 - Specification for 300 mm Tape Frame FOUP
SEMI E185 - Specification for 300 mm Tape Frame FOUP Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
PV09300 - SEMI PV93 - Test Method for Accelerated Cell Level Testing for Light And Elevated Temperature Induced Degradation (LeTID) Susceptibility of Solar Cells
SEMI PV93 - Test Method for Accelerated Cell Level Testing for Light And Elevated Temperature Induced Degradation (LeTID) Susceptibility of Solar Cells Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
G03600 - SEMI G36 - Specification for Dimensions and Tolerances Used to Manufacture Plastic Molded High Density Tab Quad Semiconductor Package Tooling
SEMI G36 - Specification for Dimensions and Tolerances Used to Manufacture Plastic Molded High Density Tab Quad Semiconductor Package Tooling Sale priceMember Price: ₩113
Non-Member Price: ₩226,000