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Flex Electronics Webinar Master Class: September 2020 (On Demand)
Flex Electronics Webinar Master Class: September 2020 (On Demand) Sale priceMember Price: ₩25
Non-Member Price: ₩74,000
Flex Electronics Webinar Master Class: September 2021 (On Demand)
Flex Electronics Webinar Master Class: September 2021 (On Demand) Sale priceMember Price: ₩49
Non-Member Price: ₩149,000
Flexible & Printed Electronics Bundle
Flexible & Printed Electronics Bundle Sale priceMember Price:
Non-Member Price: ₩871,000
Foundry Market Monitor Report – Annual Subscription (Single User)
Foundry Market Monitor Report – Annual Subscription (Single User) Regular price₩27,022,000 KRW Sale price₩1,352,000 KRW
Foundry Market Monitor Report – Single Edition (Single User)
Foundry Market Monitor Report – Single Edition (Single User) Sale priceMember Price: ₩4,000
Non-Member Price: ₩9,008,000
From Wafer to Chip - The Basics of Semiconductor Manufacturing 7/9
From Wafer to Chip The Basics of Semiconductor Manufacturing 7/9 Sale priceMember Price:
Non-Member Price: ₩269,000
Front of Line Assembly
Front of Line Assembly Sale priceMember Price:
Non-Member Price: ₩179,000
Fundamentals of ALD, ALE, and Precursors Chemistries 6/16
Fundamentals of ALD, ALE, and Precursors Chemistries 6/16 Sale priceMember Price:
Non-Member Price: ₩1,269,000
G00100 - SEMI G1 - Specification for Cerdip Package Constructions
SEMI G1 - Specification for Cerdip Package Constructions Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
G00100 - SEMI G1 - 仕様Cer-DIPパッケージ構造
SEMI G1 - 仕様Cer-DIPパッケージ構造 Sale priceMember Price: ₩135
Non-Member Price: ₩347,000
G00200 - SEMI G2 - CERDIPパッケージ用金属リードフレームの仕様
SEMI G2 - CERDIPパッケージ用金属リードフレームの仕様 Sale priceMember Price: ₩135
Non-Member Price: ₩347,000
G00200 - SEMI G2 - Specification for Metallic Leadframes for CerDIP Packages
SEMI G2 - Specification for Metallic Leadframes for CerDIP Packages Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
G00300 - SEMI G3 - Specification for Sidebrazed Laminates
SEMI G3 - Specification for Sidebrazed Laminates Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
G00300 - SEMI G3 - 仕様　側面ろう付け積層板
SEMI G3 - 仕様　側面ろう付け積層板 Sale priceMember Price: ₩135
Non-Member Price: ₩347,000
G00400 - SEMI G4 - Specification for Integrated Circuit Leadframe Materials Used in the Production of Stamped Leadframes
SEMI G4 - Specification for Integrated Circuit Leadframe Materials Used in the Production of Stamped Leadframes Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
G00400 - SEMI G4 - スタンピングリードフレーム製品で使用されるICリードフレーム材料の仕様
SEMI G4 - スタンピングリードフレーム製品で使用されるICリードフレーム材料の仕様 Sale priceMember Price: ₩135
Non-Member Price: ₩347,000
G00500 - SEMI G5 - Standard for Ceramic Chip Carriers
SEMI G5 - Standard for Ceramic Chip Carriers Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
G00500 - SEMI G5 - 仕様　セラミックチップキャリア（CCC）
SEMI G5 - 仕様　セラミックチップキャリア（CCC） Sale priceMember Price: ₩135
Non-Member Price: ₩290,000
G00600 - SEMI G6 - Test Method for Seal Ring Flatness
SEMI G6 - Test Method for Seal Ring Flatness Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
G00600 - SEMI G6 - 検査方法　封止リング平坦度
SEMI G6 - 検査方法　封止リング平坦度 Sale priceMember Price: ₩135
Non-Member Price: ₩271,000
G00800 - SEMI G8 - Test Method for Gold Plating
SEMI G8 - Test Method for Gold Plating Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
G00800 - SEMI G8 - 金めっきの試験方法
SEMI G8 - 金めっきの試験方法 Sale priceMember Price: ₩135
Non-Member Price: ₩271,000
G00900 - SEMI G9 - Specification for Stamped Leadframes for Plastic Molded Dual-in-Line Semiconductor Packages
SEMI G9 - Specification for Stamped Leadframes for Plastic Molded Dual-in-Line Semiconductor Packages Regular price₩451,000 KRW Sale price₩290,000 KRW
G00900 - SEMI G9 - 仕様　スタンピングによる半導体プラスチックDIPパッケージ用リードフレーム
SEMI G9 - 仕様　スタンピングによる半導体プラスチックDIPパッケージ用リードフレーム Sale priceMember Price: ₩135
Non-Member Price: ₩271,000