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SEMI G27 - Specification for Leadframes for Plastic Leaded Chip Carrier (PLCC) Packages
Sale priceMember Price: ₩113
Non-Member Price: ₩226,000
Non-Member Price: ₩226,000
SEMI G28 - Specification for Leadframes for Plastic Molded S.O. Packages
Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
Non-Member Price: ₩290,000
SEMI G28 - プラスチックモールドS.O.パッケージのリードフレームのための仕様
Sale priceMember Price: ₩135
Non-Member Price: ₩347,000
Non-Member Price: ₩347,000
SEMI G29 - Test Method for Trace Contaminants in Molding Compounds
Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
Non-Member Price: ₩290,000
SEMI G29 - モールディングコンパウンド中の微量異物検査のための試験方法
Sale priceMember Price: ₩135
Non-Member Price: ₩347,000
Non-Member Price: ₩347,000
SEMI G30 - Test Method for Junction-to-Case Thermal Resistance Measurements of Ceramic Packages
Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
Non-Member Price: ₩290,000
SEMI G30 - セラミックパッケージのジャンクションとケース間の熱抵抗測定のための試験方法
Sale priceMember Price: ₩135
Non-Member Price: ₩271,000
Non-Member Price: ₩271,000
SEMI G31 - Test Method for Determining the Abrasive Characteristics of Molding Compounds
Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
Non-Member Price: ₩290,000
SEMI G32 - Guideline for Unencapsulated Thermal Test Chip
Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
Non-Member Price: ₩290,000
SEMI G32 - カプセルなし熱抵抗測定用チップのガイドライン
Sale priceMember Price: ₩135
Non-Member Price: ₩271,000
Non-Member Price: ₩271,000
SEMI G33 - Specification for Pressed Ceramic Pin Grid Array Packages
Sale priceMember Price: ₩113
Non-Member Price: ₩226,000
Non-Member Price: ₩226,000
SEMI G34 - Specification for Cer-Pack Package Constructions, Including Leadframes, Suitable for Automated Assembly by End Users
Sale priceMember Price: ₩113
Non-Member Price: ₩226,000
Non-Member Price: ₩226,000
SEMI G35 - Specification for Test Methods for Lead Finishes on Semiconductor (Active) Devices
Sale priceMember Price: ₩113
Non-Member Price: ₩226,000
Non-Member Price: ₩226,000
SEMI G36 - Specification for Dimensions and Tolerances Used to Manufacture Plastic Molded High Density Tab Quad Semiconductor Package Tooling
Sale priceMember Price: ₩113
Non-Member Price: ₩226,000
Non-Member Price: ₩226,000
SEMI G37 - Specification for Dimensions and Tolerances Used to Manufacture Plastic Molded Small Outline Package Tooling
Sale priceMember Price: ₩113
Non-Member Price: ₩226,000
Non-Member Price: ₩226,000
SEMI G38 - Test Method for Still- and Forced-Air Junction-to-Ambient Thermal Resistance Measurements of Integrated Circuit Packages
Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
Non-Member Price: ₩290,000
SEMI G38 - 静止空気および強制風冷によるICパッケージのジャンクション部周囲間の熱抵抗の測定法
Sale priceMember Price: ₩135
Non-Member Price: ₩347,000
Non-Member Price: ₩347,000
SEMI G39 - Specification for Brazed Lead Flatpack Constructions, Including Leadframes, Suitable for Automated Assembly
Sale priceMember Price: ₩113
Non-Member Price: ₩226,000
Non-Member Price: ₩226,000
SEMI G41 - Specification for Dual Strip SOIC Leadframe
Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
Non-Member Price: ₩290,000
SEMI G42 - Specification for Thermal Test Board Standardization for Measuring Junction-to-Ambient Thermal Resistance of Semiconductor Packages
Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
Non-Member Price: ₩290,000
SEMI G42 - 半導体パッケージのジャンクション部と周囲間の熱抵抗測定用標準熱抵抗測定基板の仕様
Sale priceMember Price: ₩135
Non-Member Price: ₩347,000
Non-Member Price: ₩347,000
SEMI G43 - Test Method for Junction-to-Case Thermal Resistance Measurements of Molded Plastic Packages
Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
Non-Member Price: ₩290,000
SEMI G43 - プラスチックモールドパッケージのジャンクション部とケース間の熱抵抗のための試験方法
Sale priceMember Price: ₩135
Non-Member Price: ₩347,000
Non-Member Price: ₩347,000
SEMI G44 - Specification for Lead Finishes for Glass to Metal Seal Ceramic Packages (Active Devices Only)
Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
Non-Member Price: ₩290,000