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1910 products

G04500 - SEMI G45 - Practice for Flash Characteristics of Thermosetting Molding Compounds
SEMI G45 - Practice for Flash Characteristics of Thermosetting Molding Compounds Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
G04600 - SEMI G46 - Test Method for Thermal Transient Testing for Die Attachment Evaluation of Integrated Circuits
SEMI G46 - Test Method for Thermal Transient Testing for Die Attachment Evaluation of Integrated Circuits Sale priceMember Price: ₩113
Non-Member Price: ₩226,000
G04700 - SEMI G47 - Specification for Plastic Molded Quad Flat Pack Leadframes
SEMI G47 - Specification for Plastic Molded Quad Flat Pack Leadframes Sale priceMember Price: ₩113
Non-Member Price: ₩226,000
G04800 - SEMI G48 - Specification for Measurement Method for Molded Plastic Package Tooling
SEMI G48 - Specification for Measurement Method for Molded Plastic Package Tooling Sale priceMember Price: ₩113
Non-Member Price: ₩226,000
G04900 - SEMI G49 - Specification for Plastic Molding Preforms
SEMI G49 - Specification for Plastic Molding Preforms Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
G05000 - SEMI G50 - Specification for Co-Fired Ceramic Fine Pitch Leaded and Leadless Chip Carrier Package Constructions
SEMI G50 - Specification for Co-Fired Ceramic Fine Pitch Leaded and Leadless Chip Carrier Package Constructions Sale priceMember Price: ₩113
Non-Member Price: ₩226,000
G05100 - SEMI G51 - Specification for Plastic Molded (Metric) Quad Flat Pack Leadframes
SEMI G51 - Specification for Plastic Molded (Metric) Quad Flat Pack Leadframes Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
G05100 - SEMI G51 - プラスチックモールド・クアッドフラットパック・リードフレームのための仕様
SEMI G51 - プラスチックモールド・クアッドフラットパック・リードフレームのための仕様 Sale priceMember Price: ₩135
Non-Member Price: ₩347,000
G05200 - SEMI G52 - Test Method for Measurement of Ionic Contamination on Semiconductor Leadframes
SEMI G52 - Test Method for Measurement of Ionic Contamination on Semiconductor Leadframes Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
G05200 - SEMI G52 - 半導体リードフレームのイオン汚染物の測定のための標準測定法（提案）
SEMI G52 - 半導体リードフレームのイオン汚染物の測定のための標準測定法（提案） Sale priceMember Price: ₩135
Non-Member Price: ₩347,000
G05300 - SEMI G53 - Specification for Metal Lid/Preform Assembly
SEMI G53 - Specification for Metal Lid/Preform Assembly Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
G05400 - SEMI G54 - Specification for Dimensions and Tolerances Used to Manufacture Molded Plastic Packages
SEMI G54 - Specification for Dimensions and Tolerances Used to Manufacture Molded Plastic Packages Sale priceMember Price: ₩113
Non-Member Price: ₩226,000
G05500 - SEMI G55 - Test Method for Measurement of Silver Plating Brightness
SEMI G55 - Test Method for Measurement of Silver Plating Brightness Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
G05500 - SEMI G55 - リードフレーム銀めっき光沢度の測定方法
SEMI G55 - リードフレーム銀めっき光沢度の測定方法 Sale priceMember Price: ₩135
Non-Member Price: ₩347,000
G05600 - SEMI G56 - Test Method for Measurement of Silver Plating Thickness
SEMI G56 - Test Method for Measurement of Silver Plating Thickness Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
G05600 - SEMI G56 - リードフレーム銀めっき厚さの測定方法
SEMI G56 - リードフレーム銀めっき厚さの測定方法 Sale priceMember Price: ₩135
Non-Member Price: ₩347,000
G05700 - SEMI G57 - Guide for Standardization of Leadframe Terminology
SEMI G57 - Guide for Standardization of Leadframe Terminology Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
G05800 - SEMI G58 - CERQUADパッケージ構造の仕様
SEMI G58 - CERQUADパッケージ構造の仕様 Sale priceMember Price: ₩135
Non-Member Price: ₩271,000
G05800 - SEMI G58 - Specification for Cerquad Package Constructions
SEMI G58 - Specification for Cerquad Package Constructions Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
G05900 - SEMI G59 - Test Method for Measurement of Ionic Contamination on Leadframe Interleafing and the Contamination Transferred from the Interleafing to the Leadframes
SEMI G59 - Test Method for Measurement of Ionic Contamination on Leadframe Interleafing and the Contamination Transferred from the Interleafing to the Leadframes Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
G05900 - SEMI G59 - リードフレーム挿間紙上のイオン汚染物および挿間紙からリードフレームに移る汚染物の測定方法
SEMI G59 - リードフレーム挿間紙上のイオン汚染物および挿間紙からリードフレームに移る汚染物の測定方法 Sale priceMember Price: ₩135
Non-Member Price: ₩347,000
G06000 - SEMI G60 - Test Method for the Measurement of Electrostatic Properties of Semiconductor Leadframe Interleafing Materials
SEMI G60 - Test Method for the Measurement of Electrostatic Properties of Semiconductor Leadframe Interleafing Materials Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
G06000 - SEMI G60 - 半導体リードフレーム挿間紙材料の静電特性の測定方法
SEMI G60 - 半導体リードフレーム挿間紙材料の静電特性の測定方法 Sale priceMember Price: ₩135
Non-Member Price: ₩347,000
G06100 - SEMI G61 - Specification for Cofired Ceramic Packages
SEMI G61 - Specification for Cofired Ceramic Packages Sale priceMember Price: ₩113
Non-Member Price: ₩226,000