SEMI 3D16 - Specification for Glass Base Material for Semiconductor Packaging

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1910 products

F11900 - SEMI F119 - Test Method for Determining the Critical Pitting Temperature of Stainless Steel Surfaces Used in Corrosive Gas Systems by Use of a Ferric Chloride Solution
SEMI F119 - Test Method for Determining the Critical Pitting Temperature of Stainless Steel Surfaces Used in Corrosive Gas Systems by Use of a Ferric Chloride Solution Sale priceMember Price: ¥113
Non-Member Price: ¥31,900
G00100 - SEMI G1 - 仕様Cer-DIPパッケージ構造
SEMI G1 - 仕様Cer-DIPパッケージ構造 Sale priceMember Price: ¥135
Non-Member Price: ¥38,100
PV09100 - SEMI PV91 - Specification for Trichlorosilane Used in Polysilicon Production
SEMI PV91 - Specification for Trichlorosilane Used in Polysilicon Production Sale priceMember Price: ¥113
Non-Member Price: ¥31,900
T01500 - SEMI T15 - 治具IDの一般仕様 （コンセプト）
SEMI T15 - 治具IDの一般仕様 （コンセプト） Sale priceMember Price: ¥135
Non-Member Price: ¥38,100
D08100 - SEMI D81 - Test Method for Dimming Properties of Flat Panel Displays
SEMI D81 - Test Method for Dimming Properties of Flat Panel Displays Sale priceMember Price: ¥113
Non-Member Price: ¥31,900
Flex Electronics Webinar Master Class: October 2021 (on demand)
Flex Electronics Webinar Master Class: October 2021 (on demand) Sale priceMember Price: ¥49
Non-Member Price: ¥16,400
PV02300 - SEMI PV23 - 結晶シリコン太陽電池（PV）モジュールの輸送環境におけるメカニカル振動試験の方法
SEMI PV23 - 結晶シリコン太陽電池（PV）モジュールの輸送環境におけるメカニカル振動試験の方法 Sale priceMember Price: ¥135
Non-Member Price: ¥38,100
G00500 - SEMI G5 - Standard for Ceramic Chip Carriers
SEMI G5 - Standard for Ceramic Chip Carriers Sale priceMember Price: ¥113
Non-Member Price: ¥31,900
G02200 - SEMI G22 - Specification for Ceramic Pin Grid Array Packages
SEMI G22 - Specification for Ceramic Pin Grid Array Packages Sale priceMember Price: ¥113
Non-Member Price: ¥24,800
D08200 - SEMI D82 - Test Method for Viewing Angle of Flat Panel Displays
SEMI D82 - Test Method for Viewing Angle of Flat Panel Displays Sale priceMember Price: ¥113
Non-Member Price: ¥31,900
A00300 - SEMI A3 - Specification for Printed Circuit Board Equipment Communication Interfaces (PCBECI)
SEMI A3 - Specification for Printed Circuit Board Equipment Communication Interfaces (PCBECI) Sale priceMember Price: ¥225
Non-Member Price: ¥62,700
C10200 - SEMI C102 - Guide for Reporting Density and Porosity of Chemical Mechanical Planarization (CMP) Polishing Pads Used in Semiconductor Manufacturing
SEMI C102 - Guide for Reporting Density and Porosity of Chemical Mechanical Planarization (CMP) Polishing Pads Used in Semiconductor Manufacturing Sale priceMember Price: ¥113
Non-Member Price: ¥31,900
PV04700 - SEMI PV47 - 晶体硅光伏组件用减反射镀膜玻璃技术规范
SEMI PV47 - 晶体硅光伏组件用减反射镀膜玻璃技术规范 Sale priceMember Price: ¥113
Non-Member Price: ¥31,900
P03900 - SEMI P39 - OASISTM – オープン・アートワーク・システム・インターチェンジ・スタンダード（OPEN ARTWORK SYSTEM INTERCHANGE STANDARD）
SEMI P39 - OASISTM – オープン・アートワーク・システム・インターチェンジ・スタンダード（OPEN ARTWORK SYSTEM INTERCHANGE STANDARD） Sale priceMember Price: ¥135
Non-Member Price: ¥38,100
S00600 - SEMI S6 - 半導体製造装置の排気換気に関する環境，健康，安全のためのガイドライン
SEMI S6 - 半導体製造装置の排気換気に関する環境，健康，安全のためのガイドライン Sale priceMember Price: ¥225
Non-Member Price: ¥75,400
G01400 - SEMI G14 - Guideline for Specifying the Dimensions and Tolerances Used to Manufacture Plastic Molded Dip Package Tooling
SEMI G14 - Guideline for Specifying the Dimensions and Tolerances Used to Manufacture Plastic Molded Dip Package Tooling Sale priceMember Price: ¥113
Non-Member Price: ¥31,900
G08000 - SEMI G80 - 自動試験装置の総合的デジタルタイミング精度を分析するための試験方法
SEMI G80 - 自動試験装置の総合的デジタルタイミング精度を分析するための試験方法 Sale priceMember Price: ¥135
Non-Member Price: ¥38,100
T00200 - SEMI T2 - Specification for Marking of Wafers With a Two Dimensional Dot Matrix
SEMI T2 - Specification for Marking of Wafers With a Two Dimensional Dot Matrix Sale priceMember Price: ¥113
Non-Member Price: ¥31,900
3D02200 - SEMI 3D22 - Guide on Measurements of Openings and Vias in Glass
SEMI 3D22 - Guide on Measurements of Openings and Vias in Glass Sale priceMember Price: ¥113
Non-Member Price: ¥31,900
PV09800 - SEMI PV98 - Specification for Silicone Adhesive for the Back Rail Fixture on Photovoltaic (PV) Modules
SEMI PV98 - Specification for Silicone Adhesive for the Back Rail Fixture on Photovoltaic (PV) Modules Sale priceMember Price: ¥113
Non-Member Price: ¥31,900
P00800 - SEMI P8 - フォトレジスト中の水分の測定方法
SEMI P8 - フォトレジスト中の水分の測定方法 Sale priceMember Price: ¥135
Non-Member Price: ¥38,100
HB01100 - SEMI HB11 - Specification for Sapphire Single Crystal Ingot Intended for Use for Manufacturing HB-LED Wafers
SEMI HB11 - Specification for Sapphire Single Crystal Ingot Intended for Use for Manufacturing HB-LED Wafers Sale priceMember Price: ¥113
Non-Member Price: ¥31,900
3D02100 - SEMI 3D21 - Guide for Describing Glass-Based Material for Use in 3DS-IC Process
SEMI 3D21 - Guide for Describing Glass-Based Material for Use in 3DS-IC Process Sale priceMember Price: ¥113
Non-Member Price: ¥31,900
Flex Electronics Webinar Master Class Series: Power, AI, Integration, Reliability (On Demand)
Flex Electronics Webinar Master Class Series: Power, AI, Integration, Reliability (On Demand) Sale priceMember Price: ¥75
Non-Member Price: ¥24,600