SEMI 3D16 - Specification for Glass Base Material for Semiconductor Packaging

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1910 products

G03700 - SEMI G37 - Specification for Dimensions and Tolerances Used to Manufacture Plastic Molded Small Outline Package Tooling
SEMI G37 - Specification for Dimensions and Tolerances Used to Manufacture Plastic Molded Small Outline Package Tooling Sale priceMember Price: ¥113
Non-Member Price: ¥24,800
G03000 - SEMI G30 - セラミックパッケージのジャンクションとケース間の熱抵抗測定のための試験方法
SEMI G30 - セラミックパッケージのジャンクションとケース間の熱抵抗測定のための試験方法 Sale priceMember Price: ¥135
Non-Member Price: ¥29,700
Flex Electronics Webinar Master Class: September 2020 (On Demand)
Flex Electronics Webinar Master Class: September 2020 (On Demand) Sale priceMember Price: ¥25
Non-Member Price: ¥8,100
G05000 - SEMI G50 - Specification for Co-Fired Ceramic Fine Pitch Leaded and Leadless Chip Carrier Package Constructions
SEMI G50 - Specification for Co-Fired Ceramic Fine Pitch Leaded and Leadless Chip Carrier Package Constructions Sale priceMember Price: ¥113
Non-Member Price: ¥24,800
E18200 - SEMI E182 - Specification for Panel FOUP Load Port for Panel Level Packaging
SEMI E182 - Specification for Panel FOUP Load Port for Panel Level Packaging Sale priceFrom ¥31,900 JPY
Flex Electronics Webinar Master Class: December 2021 (On Demand)
Flex Electronics Webinar Master Class: December 2021 (On Demand) Sale priceMember Price: ¥49
Non-Member Price: ¥16,400
G07200 - SEMI G72 - ボールグリッドアレイ設計ライブラリのための仕様
SEMI G72 - ボールグリッドアレイ設計ライブラリのための仕様 Sale priceMember Price: ¥135
Non-Member Price: ¥29,700
G09100 - SEMI G91 - Standard Test Data Format (STDF) Memory Fail Datalog
SEMI G91 - Standard Test Data Format (STDF) Memory Fail Datalog Sale priceMember Price: ¥113
Non-Member Price: ¥31,900
G03400 - SEMI G34 - Specification for Cer-Pack Package Constructions, Including Leadframes, Suitable for Automated Assembly by End Users
SEMI G34 - Specification for Cer-Pack Package Constructions, Including Leadframes, Suitable for Automated Assembly by End Users Sale priceMember Price: ¥113
Non-Member Price: ¥24,800
MS01200 - SEMI MS12 - Specification for Silicon Substrates Used in Fabrication of MEMS Devices
SEMI MS12 - Specification for Silicon Substrates Used in Fabrication of MEMS Devices Sale priceMember Price: ¥113
Non-Member Price: ¥31,900
F11700 - SEMI F117 - Specification for Dimensions of Sandwich Components for 1.125 Inch Type Surface Mount Gas Distribution Systems
SEMI F117 - Specification for Dimensions of Sandwich Components for 1.125 Inch Type Surface Mount Gas Distribution Systems Sale priceMember Price: ¥113
Non-Member Price: ¥31,900
G00900 - SEMI G9 - Specification for Stamped Leadframes for Plastic Molded Dual-in-Line Semiconductor Packages
SEMI G9 - Specification for Stamped Leadframes for Plastic Molded Dual-in-Line Semiconductor Packages Regular price¥49,500 JPY Sale price¥31,900 JPY
G05800 - SEMI G58 - CERQUADパッケージ構造の仕様
SEMI G58 - CERQUADパッケージ構造の仕様 Sale priceMember Price: ¥135
Non-Member Price: ¥29,700
F11400 - SEMI F114 - Test Method for the Determination of Organic Contaminants Present on Wetted Surfaces of Ultra High Purity Chemical Delivery Systems and Components
SEMI F114 - Test Method for the Determination of Organic Contaminants Present on Wetted Surfaces of Ultra High Purity Chemical Delivery Systems and Components Sale priceMember Price: ¥113
Non-Member Price: ¥31,900
E17800 - SEMI E178 - Guide for EDA Freeze Version
SEMI E178 - Guide for EDA Freeze Version Sale price Member Price : ¥113
G05400 - SEMI G54 - Specification for Dimensions and Tolerances Used to Manufacture Molded Plastic Packages
SEMI G54 - Specification for Dimensions and Tolerances Used to Manufacture Molded Plastic Packages Sale priceMember Price: ¥113
Non-Member Price: ¥24,800
3D02200 - SEMI 3D23 - Specification for Glass Carrier Characteristics for Panel Level Packaging (PLP) Applications
SEMI 3D23 - Specification for Glass Carrier Characteristics for Panel Level Packaging (PLP) Applications Sale priceMember Price: ¥113
Non-Member Price: ¥31,900
PV08800 - SEMI PV88 - 惰性气体熔融红外吸收法测定光伏多晶硅中氢含量的测试方法
SEMI PV88 - 惰性气体熔融红外吸收法测定光伏多晶硅中氢含量的测试方法 Sale priceMember Price: ¥113
Non-Member Price: ¥24,800
MS01300 - SEMI MS13 - Guide for Use of Test Patterns for Characterizing a Deep Reactive Ion Etching (DRIE) Process
SEMI MS13 - Guide for Use of Test Patterns for Characterizing a Deep Reactive Ion Etching (DRIE) Process Sale priceMember Price: ¥113
Non-Member Price: ¥31,900
G03900 - SEMI G39 - Specification for Brazed Lead Flatpack Constructions, Including Leadframes, Suitable for Automated Assembly
SEMI G39 - Specification for Brazed Lead Flatpack Constructions, Including Leadframes, Suitable for Automated Assembly Sale priceMember Price: ¥113
Non-Member Price: ¥24,800
Flex Electronics Webinar Master Class: October 2020 (On Demand)
Flex Electronics Webinar Master Class: October 2020 (On Demand) Sale priceMember Price: ¥25
Non-Member Price: ¥8,100
A00400 - SEMI A4 - Specification for the Automated Test Equipment Tester Event Messaging for Semiconductors (TEMS)
SEMI A4 - Specification for the Automated Test Equipment Tester Event Messaging for Semiconductors (TEMS) Sale priceMember Price: ¥113
Non-Member Price: ¥31,900
Flex Electronics Webinar Master Class: August 2020 (On Demand)
Flex Electronics Webinar Master Class: August 2020 (On Demand) Sale priceMember Price: ¥25
Non-Member Price: ¥8,100
G00300 - SEMI G3 - 仕様　側面ろう付け積層板
SEMI G3 - 仕様　側面ろう付け積層板 Sale priceMember Price: ¥135
Non-Member Price: ¥38,100