Products

2140 products

G04100 - SEMI G41 - Specification for Dual Strip SOIC Leadframe
SEMI G41 - Specification for Dual Strip SOIC Leadframe Sale priceMember Price: $113.00
Non-Member Price: $170.00
G04200 - SEMI G42 - Specification for Thermal Test Board Standardization for Measuring Junction-to-Ambient Thermal Resistance of Semiconductor Packages
G04200 - SEMI G42 - 半導体パッケージのジャンクション部と周囲間の熱抵抗測定用標準熱抵抗測定基板の仕様
G04300 - SEMI G43 - Test Method for Junction-to-Case Thermal Resistance Measurements of Molded Plastic Packages
G04300 - SEMI G43 - プラスチックモールドパッケージのジャンクション部とケース間の熱抵抗のための試験方法
G04400 - SEMI G44 - Specification for Lead Finishes for Glass to Metal Seal Ceramic Packages (Active Devices Only)
G04500 - SEMI G45 - Practice for Flash Characteristics of Thermosetting Molding Compounds
SEMI G45 - Practice for Flash Characteristics of Thermosetting Molding Compounds Sale priceMember Price: $113.00
Non-Member Price: $170.00
G04600 - SEMI G46 - Test Method for Thermal Transient Testing for Die Attachment Evaluation of Integrated Circuits
G04700 - SEMI G47 - Specification for Plastic Molded Quad Flat Pack Leadframes
SEMI G47 - Specification for Plastic Molded Quad Flat Pack Leadframes Sale priceMember Price: $113.00
Non-Member Price: $150.00
G04800 - SEMI G48 - Specification for Measurement Method for Molded Plastic Package Tooling
SEMI G48 - Specification for Measurement Method for Molded Plastic Package Tooling Sale priceMember Price: $113.00
Non-Member Price: $150.00
G04900 - SEMI G49 - Specification for Plastic Molding Preforms
SEMI G49 - Specification for Plastic Molding Preforms Sale priceMember Price: $113.00
Non-Member Price: $170.00
G05000 - SEMI G50 - Specification for Co-Fired Ceramic Fine Pitch Leaded and Leadless Chip Carrier Package Constructions
G05100 - SEMI G51 - Specification for Plastic Molded (Metric) Quad Flat Pack Leadframes
SEMI G51 - Specification for Plastic Molded (Metric) Quad Flat Pack Leadframes Sale priceMember Price: $113.00
Non-Member Price: $170.00
G05100 - SEMI G51 - プラスチックモールド・クアッドフラットパック・リードフレームのための仕様
G05200 - SEMI G52 - Test Method for Measurement of Ionic Contamination on Semiconductor Leadframes
G05200 - SEMI G52 - 半導体リードフレームのイオン汚染物の測定のための標準測定法(提案)
G05300 - SEMI G53 - Specification for Metal Lid/Preform Assembly
SEMI G53 - Specification for Metal Lid/Preform Assembly Sale priceMember Price: $113.00
Non-Member Price: $150.00
G05400 - SEMI G54 - Specification for Dimensions and Tolerances Used to Manufacture Molded Plastic Packages
G05500 - SEMI G55 - Test Method for Measurement of Silver Plating Brightness
SEMI G55 - Test Method for Measurement of Silver Plating Brightness Sale priceMember Price: $113.00
Non-Member Price: $170.00
G05500 - SEMI G55 - リードフレーム銀めっき光沢度の測定方法
SEMI G55 - リードフレーム銀めっき光沢度の測定方法 Sale priceMember Price: $135.00
Non-Member Price: $203.00
G05600 - SEMI G56 - Test Method for Measurement of Silver Plating Thickness
SEMI G56 - Test Method for Measurement of Silver Plating Thickness Sale priceMember Price: $113.00
Non-Member Price: $170.00
G05600 - SEMI G56 - リードフレーム銀めっき厚さの測定方法
SEMI G56 - リードフレーム銀めっき厚さの測定方法 Sale priceMember Price: $135.00
Non-Member Price: $203.00
G05700 - SEMI G57 - Guide for Standardization of Leadframe Terminology
SEMI G57 - Guide for Standardization of Leadframe Terminology Sale priceMember Price: $113.00
Non-Member Price: $170.00
G05800 - SEMI G58 - CERQUADパッケージ構造の仕様
SEMI G58 - CERQUADパッケージ構造の仕様 Sale priceMember Price: $135.00
Non-Member Price: $180.00