Products

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SEMI G6 - Test Method for Seal Ring Flatness Sale priceMember Price: $113.00
Non-Member Price: $170.00

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SEMI G6 - 検査方法　封止リング平坦度 Sale priceMember Price: $135.00
Non-Member Price: $180.00

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SEMI G8 - Test Method for Gold Plating Sale priceMember Price: $113.00
Non-Member Price: $170.00

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SEMI G8 - 金めっきの試験方法 Sale priceMember Price: $135.00
Non-Member Price: $180.00

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SEMI G9 - Specification for Stamped Leadframes for Plastic Molded Dual-in-Line Semiconductor Packages Regular price$300.00 USD Sale price$170.00 USD

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SEMI G9 - 仕様　スタンピングによる半導体プラスチックDIPパッケージ用リードフレーム Sale priceMember Price: $135.00
Non-Member Price: $180.00

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SEMI G10 - Standard Method for Mechanical Measurement of Plastic Package Leadframes Sale priceMember Price: $113.00
Non-Member Price: $170.00

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SEMI G10 - プラスチックパッケージリードフレームの機械的標準測定方法 Sale priceMember Price: $135.00
Non-Member Price: $203.00

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SEMI G11 - Practice for RAM Follower Gel Time and Spiral Flow of Thermal Setting Molding Compounds Sale priceMember Price: $113.00
Non-Member Price: $170.00

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SEMI G11 - 熱硬化性モールディングコンパウンドのラムフォロワー装置によるゲル化時間およびスパイラルフローの推奨作業方法 Sale priceMember Price: $135.00
Non-Member Price: $203.00

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SEMI G13 - Test Method for Thermal Expansion Characteristics of Molding Compounds Sale priceMember Price: $113.00
Non-Member Price: $170.00

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SEMI G13 - モールディングコンパウンドの膨張特性の標準試験方法 Sale priceMember Price: $135.00
Non-Member Price: $203.00

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SEMI G14 - Guideline for Specifying the Dimensions and Tolerances Used to Manufacture Plastic Molded Dip Package Tooling Sale priceMember Price: $113.00
Non-Member Price: $170.00

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SEMI G15 - Standard Test Method for Differential Scanning Calorimetry of Molding Compounds Sale priceMember Price: $113.00
Non-Member Price: $170.00

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SEMI G15 - モールディングコンパウンド示差走査熱量分析の標準試験方法 Sale priceMember Price: $135.00
Non-Member Price: $203.00

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SEMI G16 - Specification for Dimensions and Tolerances Used to Manufacture Plastic Chip Carrier Tooling Sale priceMember Price: $113.00
Non-Member Price: $170.00

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SEMI G18 - Specification for Integrated Circuit Leadframe Material Used in the Production of Etched Leadframes Sale priceMember Price: $113.00
Non-Member Price: $170.00

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SEMI G18 - エッチングリードフレームの製造に使用する集積回路用リードフレーム材料のためのスタンダード Sale priceMember Price: $135.00
Non-Member Price: $203.00

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SEMI G19 - Specification for Dip Leadframes Produced by Etching Sale priceMember Price: $113.00
Non-Member Price: $170.00

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SEMI G19 - エッチングにより製造されるDIPリードフレームのための仕様 Sale priceMember Price: $135.00
Non-Member Price: $180.00

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SEMI G20 - Specification for Lead Finishes for Plastic Packages (Active Devices Only) Sale priceMember Price: $113.00
Non-Member Price: $170.00

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SEMI G21 - Specification for Plating Integrated Circuit Leadframes Sale priceMember Price: $113.00
Non-Member Price: $170.00

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SEMI G22 - Specification for Ceramic Pin Grid Array Packages Sale priceMember Price: $113.00
Non-Member Price: $150.00

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SEMI G23 - Test Method of Inductance for Internal Traces of Semiconductor Packages Sale priceMember Price: $113.00
Non-Member Price: $170.00