SEMI G54 - Specification for Dimensions and Tolerances Used to Manufacture Molded Plastic Packages -

Abstract

This document is a guideline for ordering the tooling required to manufacture plastic semiconductor packages. These packages include the following JEDEC-registered outlines: Plastic Dual-in-Line Packages (PDIP); Plastic Leaded Chip Carrier (PLCC); Plastic Quad Flat Packages (PQFP); Small Outline I.C. Packages (SOIC - Gull Wing and "J" lead); and Plastic TAB Quad Packages (PTAB)Title.

　

Referenced SEMI Standards

SEMI G48 — Specification, Measurement Method for Molded Plastic Package Tooling

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