SEMI 3D16 - Specification for Glass Base Material for Semiconductor Pa – Page 52

1910 products

G06900 - SEMI G69 - Test Method for Measurement of Adhesive Strength Between Leadframes and Molding Compounds

SEMI G69 - Test Method for Measurement of Adhesive Strength Between Leadframes and Molding Compounds

Member Price: €113,00
Non-Member Price: €171,95

G06000 - SEMI G60 - Test Method for the Measurement of Electrostatic Properties of Semiconductor Leadframe Interleafing Materials

SEMI G60 - Test Method for the Measurement of Electrostatic Properties of Semiconductor Leadframe Interleafing Materials

Member Price: €113,00
Non-Member Price: €171,95

M07700 - SEMI M77 - ロールオフ量（ROA）を使ってウェーハのエッジ近傍形状を決定するための作業方法

SEMI M77 - ロールオフ量（ROA）を使ってウェーハのエッジ近傍形状を決定するための作業方法

Member Price: €135,00
Non-Member Price: €205,95

M08100 - SEMI M81 - Guide to Defects Found in Monocrystalline Silicon Carbide Substrates

SEMI M81 - Guide to Defects Found in Monocrystalline Silicon Carbide Substrates

Member Price: €113,00
Non-Member Price: €171,95

MF104900 - SEMI MF1049 - Practice for Shallow Etch Pit Detection on Silicon Wafers

SEMI MF1049 - Practice for Shallow Etch Pit Detection on Silicon Wafers

Member Price: €113,00
Non-Member Price: €171,95

G06200 - SEMI G62 - Test Method for Silver Plating Quality

SEMI G62 - Test Method for Silver Plating Quality

Member Price: €113,00
Non-Member Price: €171,95

E10200 - SEMI E102 - Provisional Specification for CIM Framework Material Transport and Storage Component

SEMI E102 - Provisional Specification for CIM Framework Material Transport and Storage Component

Member Price: €113,00
Non-Member Price: €171,95

S02500 - SEMI S25 - Safety Guideline for Hydrogen Peroxide Storage & Handling Systems

SEMI S25 - Safety Guideline for Hydrogen Peroxide Storage & Handling Systems

Member Price: €113,00
Non-Member Price: €171,95

M02000 - SEMI M20 - Practice for Establishing a Wafer Coordinate System

SEMI M20 - Practice for Establishing a Wafer Coordinate System

Member Price: €113,00
Non-Member Price: €171,95

G01300 - SEMI G13 - モールディングコンパウンドの膨張特性の標準試験方法

SEMI G13 - モールディングコンパウンドの膨張特性の標準試験方法

Member Price: €135,00
Non-Member Price: €205,95

F03700 - SEMI F37 - Test Method for Determination of Surface Roughness Parameters for Gas Distribution System Components

SEMI F37 - Test Method for Determination of Surface Roughness Parameters for Gas Distribution System Components

Member Price: €113,00
Non-Member Price: €171,95

F09800 - SEMI F98 - Guide for Treatment of Reuse Water in Semiconductor Processing

SEMI F98 - Guide for Treatment of Reuse Water in Semiconductor Processing

From €171,95 EUR

M02300 - SEMI M23 - Specification for Polished Monocrystalline Indium Phosphide Wafers

SEMI M23 - Specification for Polished Monocrystalline Indium Phosphide Wafers

Member Price: €113,00
Non-Member Price: €171,95

G00400 - SEMI G4 - Specification for Integrated Circuit Leadframe Materials Used in the Production of Stamped Leadframes

SEMI G4 - Specification for Integrated Circuit Leadframe Materials Used in the Production of Stamped Leadframes

Member Price: €113,00
Non-Member Price: €171,95

MF067400 - SEMI MF674 - Practice for Preparing Silicon for Spreading Resistance Measurements

SEMI MF674 - Practice for Preparing Silicon for Spreading Resistance Measurements

Member Price: €113,00
Non-Member Price: €171,95

MF092800 - SEMI MF928 - Test Method for Edge Contour of Circular Semiconductor Wafers and Rigid Disk Substrates

SEMI MF928 - Test Method for Edge Contour of Circular Semiconductor Wafers and Rigid Disk Substrates

Member Price: €113,00
Non-Member Price: €171,95

M06000 - SEMI M60 - Test Method for Time Dependent Dielectric Breakdown Characteristics of SiO2 Films for Si Wafer Evaluation

SEMI M60 - Test Method for Time Dependent Dielectric Breakdown Characteristics of SiO2 Films for Si Wafer Evaluation

Member Price: €113,00
Non-Member Price: €171,95

HB01000 - SEMI HB10 - Specification for Single Crystal Sapphire Intended for Use for Manufacturing HB-LED Wafers

SEMI HB10 - Specification for Single Crystal Sapphire Intended for Use for Manufacturing HB-LED Wafers

Member Price: €113,00
Non-Member Price: €171,95

G07400 - SEMI G74 - Specification for Tape Frame for 300 mm Wafers

SEMI G74 - Specification for Tape Frame for 300 mm Wafers

Member Price: €113,00
Non-Member Price: €171,95

PV08800 - SEMI PV88 - Test Method for Determination of Hydrogen in Photovoltaic (PV) Polysilicon by Inert Gas Fusion Infrared Absorption Method

SEMI PV88 - Test Method for Determination of Hydrogen in Photovoltaic (PV) Polysilicon by Inert Gas Fusion Infrared Absorption Method

Member Price: €113,00
Non-Member Price: €171,95

PV02100 - SEMI PV21 - Guide for Silane (SiH4), Used in Photovoltaic Applications

PV02100 - SEMI PV21 - Guide for Silane (SiH4), Used in Photovoltaic Applications

SEMI PV21 - Guide for Silane (SiH4), Used in Photovoltaic Applications

Member Price: €113,00
Non-Member Price: €171,95

PV05400 - SEMI PV54 - 晶体硅太阳电池N型层接触用银浆技术规范

SEMI PV54 - 晶体硅太阳电池N型层接触用银浆技术规范

Member Price: €113,00
Non-Member Price: €171,95

G02500 - SEMI G25 - Test Method for Measuring the Resistance of Package Leads

SEMI G25 - Test Method for Measuring the Resistance of Package Leads

Member Price: €113,00
Non-Member Price: €171,95

M08300 - SEMI M83 - Test Method for Determination of Dislocation Etch Pit Density in Monocrystals of III-V Compound Semiconductors

SEMI M83 - Test Method for Determination of Dislocation Etch Pit Density in Monocrystals of III-V Compound Semiconductors

From €171,95 EUR