SEMI 3D8 - Guide for Describing Silicon Wafers for Use as 300 mm Carrier Wafers in a 3DS-IC Temporary Bond-Debond (TBDB) Process

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1910 products

P03400 - SEMI P34 - Specification for 230 mm Square Photomask Substrates
SEMI P34 - Specification for 230 mm Square Photomask Substrates Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
C00347 - SEMI C3.47 - 臭化水素（HBr），品質99.98%の仕様
SEMI C3.47 - 臭化水素（HBr），品質99.98%の仕様 Sale priceMember Price: ₩135
Non-Member Price: ₩347,000
P00200 - SEMI P2 - Specification for Chrome Thin Films for Hard Surface Photomasks
SEMI P2 - Specification for Chrome Thin Films for Hard Surface Photomasks Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
G07600 - SEMI G76 - Specification for Polyimide-Based Adhesive Tape Used in Tape Carrier Packages (TCP)
SEMI G76 - Specification for Polyimide-Based Adhesive Tape Used in Tape Carrier Packages (TCP) Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
P04200 - SEMI P42 - Specification of Reticle Data for Automatic Recipe Transfer to Wafer Exposure System
SEMI P42 - Specification of Reticle Data for Automatic Recipe Transfer to Wafer Exposure System Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
P00200 - SEMI P2 - ハードサーフェス・フォトマスク用クロムブランク
SEMI P2 - ハードサーフェス・フォトマスク用クロムブランク Sale priceMember Price: ₩135
Non-Member Price: ₩347,000
G07800 - SEMI G78 - Test Method for Comparing Automated Wafer Probe Systems Utilizing Process-Specific Measurements
SEMI G78 - Test Method for Comparing Automated Wafer Probe Systems Utilizing Process-Specific Measurements Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
G06500 - SEMI G65 - Lリード（ガルウイング型）パッケージ用リードフレーム材料の評価の試験方法
SEMI G65 - Lリード（ガルウイング型）パッケージ用リードフレーム材料の評価の試験方法 Sale priceMember Price: ₩135
Non-Member Price: ₩347,000
D02900 - SEMI D29 - 平面顯示螢幕(FPD)彩色濾光片耐熱性計算之測試法
SEMI D29 - 平面顯示螢幕(FPD)彩色濾光片耐熱性計算之測試法 Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
C02900 - SEMI C29 - 4.9%フッ化ケイ素酸（10:1 V/V）の仕様とガイドライン
SEMI C29 - 4.9%フッ化ケイ素酸（10:1 V/V）の仕様とガイドライン Sale priceMember Price: ₩135
Non-Member Price: ₩347,000
P01900 - SEMI P19 - Specification for Metrology Pattern Cells for Integrated Circuit Manufacture
SEMI P19 - Specification for Metrology Pattern Cells for Integrated Circuit Manufacture Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
P01400 - SEMI P14 - 黒鉛炉原子吸光分光法によるポジティブフォトレジスト中の錫の測定
SEMI P14 - 黒鉛炉原子吸光分光法によるポジティブフォトレジスト中の錫の測定 Sale priceMember Price: ₩135
Non-Member Price: ₩347,000
C00300 - SEMI C3 - ガスの仕様
SEMI C3 - ガスの仕様 Sale priceMember Price: ₩135
Non-Member Price: ₩347,000
MS00800 - SEMI MS8 - Guide to Evaluating Hermeticity of Microelectromechanical Systems (MEMS) Packages
SEMI MS8 - Guide to Evaluating Hermeticity of Microelectromechanical Systems (MEMS) Packages Regular price₩451,000 KRW Sale price₩290,000 KRW
3D01900 - SEMI 3D19 - Test Method for Adhesive Strength of Adhesive Tray Used for Thin Chip Handling
SEMI 3D19 - Test Method for Adhesive Strength of Adhesive Tray Used for Thin Chip Handling Sale priceMember Price: ₩113
Non-Member Price: ₩290,000