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1222 products

E18800 - SEMI E188 - Specification for Malware Free Equipment Integration
SEMI E188 - Specification for Malware Free Equipment Integration Sale priceMember Price: ₩113
Non-Member Price: ₩571,000
G00600 - SEMI G6 - 検査方法　封止リング平坦度
SEMI G6 - 検査方法　封止リング平坦度 Sale priceMember Price: ₩135
Non-Member Price: ₩271,000
E18000 - SEMI E180 - Test Method for Measuring Surface Metal Contamination Through ICP-MS of Critical Chamber Components Used in Semiconductor Wafer Processing
SEMI E180 - Test Method for Measuring Surface Metal Contamination Through ICP-MS of Critical Chamber Components Used in Semiconductor Wafer Processing Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
HB01200 - SEMI HB12 - Specification for Dry-Etched Patterned Sapphire Substrates (DPSS)
SEMI HB12 - Specification for Dry-Etched Patterned Sapphire Substrates (DPSS) Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
PV09800 - SEMI PV99 - Classification of Building Integrated Photovoltaic (BIPV)
SEMI PV99 - Classification of Building Integrated Photovoltaic (BIPV) Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
G03500 - SEMI G35 - Specification for Test Methods for Lead Finishes on Semiconductor (Active) Devices
SEMI G35 - Specification for Test Methods for Lead Finishes on Semiconductor (Active) Devices Sale priceMember Price: ₩113
Non-Member Price: ₩226,000
G01600 - SEMI G16 - Specification for Dimensions and Tolerances Used to Manufacture Plastic Chip Carrier Tooling
SEMI G16 - Specification for Dimensions and Tolerances Used to Manufacture Plastic Chip Carrier Tooling Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
G00200 - SEMI G2 - CERDIPパッケージ用金属リードフレームの仕様
SEMI G2 - CERDIPパッケージ用金属リードフレームの仕様 Sale priceMember Price: ₩135
Non-Member Price: ₩347,000
A00500 - SEMI A5 - Specification for Factory Operation Extension for SEMI A2 SMASH (SMASH-FOX)
SEMI A5 - Specification for Factory Operation Extension for SEMI A2 SMASH (SMASH-FOX) Sale priceFrom ₩290,000 KRW
AUX00500 - SEMI AUX005 - Comparison Matrix Between SEMI S2-93A and S2-0200
SEMI AUX005 - Comparison Matrix Between SEMI S2-93A and S2-0200 Sale priceMember Price: ₩113
Non-Member Price: ₩256,000
E18700 - SEMI E187 - Specification for Cybersecurity of Fab Equipment
SEMI E187 - Specification for Cybersecurity of Fab Equipment Sale priceMember Price: ₩113
Non-Member Price: ₩571,000
E18500 - SEMI E185 - Specification for 300 mm Tape Frame FOUP
SEMI E185 - Specification for 300 mm Tape Frame FOUP Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
PV09300 - SEMI PV93 - Test Method for Accelerated Cell Level Testing for Light And Elevated Temperature Induced Degradation (LeTID) Susceptibility of Solar Cells
SEMI PV93 - Test Method for Accelerated Cell Level Testing for Light And Elevated Temperature Induced Degradation (LeTID) Susceptibility of Solar Cells Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
G03600 - SEMI G36 - Specification for Dimensions and Tolerances Used to Manufacture Plastic Molded High Density Tab Quad Semiconductor Package Tooling
SEMI G36 - Specification for Dimensions and Tolerances Used to Manufacture Plastic Molded High Density Tab Quad Semiconductor Package Tooling Sale priceMember Price: ₩113
Non-Member Price: ₩226,000
C10400 - SEMI C104 - Guide for Reporting Performance Parameters of the Polymer Windows for Chemical Mechanical Planarization (CMP) Pads Used in Semiconductor Manufacturing
SEMI C104 - Guide for Reporting Performance Parameters of the Polymer Windows for Chemical Mechanical Planarization (CMP) Pads Used in Semiconductor Manufacturing Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
P00300 - SEMI P3 - Specification for Photoresist/E-Beam Resist for Hard Surface Photoplates
SEMI P3 - Specification for Photoresist/E-Beam Resist for Hard Surface Photoplates Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
P02000 - SEMI P20 - EBレジストパラメータのカタログ公表のガイドライン（提案）
SEMI P20 - EBレジストパラメータのカタログ公表のガイドライン（提案） Sale priceMember Price: ₩135
Non-Member Price: ₩347,000
G04400 - SEMI G44 - Specification for Lead Finishes for Glass to Metal Seal Ceramic Packages (Active Devices Only)
SEMI G44 - Specification for Lead Finishes for Glass to Metal Seal Ceramic Packages (Active Devices Only) Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
P01100 - SEMI P11 - アルカリ現像溶液に対する全規定度の測定のテスト方法
SEMI P11 - アルカリ現像溶液に対する全規定度の測定のテスト方法 Sale priceMember Price: ₩135
Non-Member Price: ₩347,000
M07600 - SEMI M76 - Specification for Developmental 450 mm Diameter Polished Single Crystal Silicon Wafers
SEMI M76 - Specification for Developmental 450 mm Diameter Polished Single Crystal Silicon Wafers Regular price₩451,000 KRW Sale price₩290,000 KRW
P03400 - SEMI P34 - 230mm方形フォトマスク基板の仕様
SEMI P34 - 230mm方形フォトマスク基板の仕様 Sale priceMember Price: ₩135
Non-Member Price: ₩347,000
MS00900 - SEMI MS9 - Specification for High Density Permanent Connections Between Microfluidic Devices
SEMI MS9 - Specification for High Density Permanent Connections Between Microfluidic Devices Regular price₩451,000 KRW Sale price₩290,000 KRW
G03300 - SEMI G33 - Specification for Pressed Ceramic Pin Grid Array Packages
SEMI G33 - Specification for Pressed Ceramic Pin Grid Array Packages Sale priceMember Price: ₩113
Non-Member Price: ₩226,000
M01500 - SEMI M15 - Polished Wafer Defect Limits Table for Semi-Insulating Gallium Arsenide Wafers
SEMI M15 - Polished Wafer Defect Limits Table for Semi-Insulating Gallium Arsenide Wafers Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
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