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1222 products

E18100 - SEMI E181 - Specification for Panel FOUP for Panel Level Packaging
SEMI E181 - Specification for Panel FOUP for Panel Level Packaging Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
M09000 - SEMI M90 - Test Method for Bulk Micro Defect Density and Denuded Zone Width in Annealed Silicon Wafers by Optical Microscopy After Preferential Etching
SEMI M90 - Test Method for Bulk Micro Defect Density and Denuded Zone Width in Annealed Silicon Wafers by Optical Microscopy After Preferential Etching Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
G07600 - SEMI G76 - TCP用ポリイミド接着テープの仕様
SEMI G76 - TCP用ポリイミド接着テープの仕様 Sale priceMember Price: ₩135
Non-Member Price: ₩271,000
PV09500 - SEMI PV95 - Test Method for Metal Wrap Through Solar Cell Via Resistance
SEMI PV95 - Test Method for Metal Wrap Through Solar Cell Via Resistance Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
G00100 - SEMI G1 - 仕様Cer-DIPパッケージ構造
SEMI G1 - 仕様Cer-DIPパッケージ構造 Sale priceMember Price: ₩135
Non-Member Price: ₩347,000
F11900 - SEMI F119 - Test Method for Determining the Critical Pitting Temperature of Stainless Steel Surfaces Used in Corrosive Gas Systems by Use of a Ferric Chloride Solution
SEMI F119 - Test Method for Determining the Critical Pitting Temperature of Stainless Steel Surfaces Used in Corrosive Gas Systems by Use of a Ferric Chloride Solution Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
PV09100 - SEMI PV91 - Specification for Trichlorosilane Used in Polysilicon Production
SEMI PV91 - Specification for Trichlorosilane Used in Polysilicon Production Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
D08100 - SEMI D81 - Test Method for Dimming Properties of Flat Panel Displays
SEMI D81 - Test Method for Dimming Properties of Flat Panel Displays Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
G00500 - SEMI G5 - Standard for Ceramic Chip Carriers
SEMI G5 - Standard for Ceramic Chip Carriers Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
G02200 - SEMI G22 - Specification for Ceramic Pin Grid Array Packages
SEMI G22 - Specification for Ceramic Pin Grid Array Packages Sale priceMember Price: ₩113
Non-Member Price: ₩226,000
D08200 - SEMI D82 - Test Method for Viewing Angle of Flat Panel Displays
SEMI D82 - Test Method for Viewing Angle of Flat Panel Displays Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
A00300 - SEMI A3 - Specification for Printed Circuit Board Equipment Communication Interfaces (PCBECI)
SEMI A3 - Specification for Printed Circuit Board Equipment Communication Interfaces (PCBECI) Sale priceMember Price: ₩225
Non-Member Price: ₩571,000
C10200 - SEMI C102 - Guide for Reporting Density and Porosity of Chemical Mechanical Planarization (CMP) Polishing Pads Used in Semiconductor Manufacturing
SEMI C102 - Guide for Reporting Density and Porosity of Chemical Mechanical Planarization (CMP) Polishing Pads Used in Semiconductor Manufacturing Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
S00600 - SEMI S6 - 半導体製造装置の排気換気に関する環境，健康，安全のためのガイドライン
SEMI S6 - 半導体製造装置の排気換気に関する環境，健康，安全のためのガイドライン Sale priceMember Price: ₩225
Non-Member Price: ₩686,000
G01400 - SEMI G14 - Guideline for Specifying the Dimensions and Tolerances Used to Manufacture Plastic Molded Dip Package Tooling
SEMI G14 - Guideline for Specifying the Dimensions and Tolerances Used to Manufacture Plastic Molded Dip Package Tooling Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
G08000 - SEMI G80 - 自動試験装置の総合的デジタルタイミング精度を分析するための試験方法
SEMI G80 - 自動試験装置の総合的デジタルタイミング精度を分析するための試験方法 Sale priceMember Price: ₩135
Non-Member Price: ₩347,000
3D02200 - SEMI 3D22 - Guide on Measurements of Openings and Vias in Glass
SEMI 3D22 - Guide on Measurements of Openings and Vias in Glass Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
PV09800 - SEMI PV98 - Specification for Silicone Adhesive for the Back Rail Fixture on Photovoltaic (PV) Modules
SEMI PV98 - Specification for Silicone Adhesive for the Back Rail Fixture on Photovoltaic (PV) Modules Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
HB01100 - SEMI HB11 - Specification for Sapphire Single Crystal Ingot Intended for Use for Manufacturing HB-LED Wafers
SEMI HB11 - Specification for Sapphire Single Crystal Ingot Intended for Use for Manufacturing HB-LED Wafers Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
3D02100 - SEMI 3D21 - Guide for Describing Glass-Based Material for Use in 3DS-IC Process
SEMI 3D21 - Guide for Describing Glass-Based Material for Use in 3DS-IC Process Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
G00100 - SEMI G1 - Specification for Cerdip Package Constructions
SEMI G1 - Specification for Cerdip Package Constructions Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
E18600 - SEMI E186 - Specification for Location and Dimensions for Power Connectors and Ethercat Ports in Mass Flow Controllers and Mass Flow Meters
SEMI E186 - Specification for Location and Dimensions for Power Connectors and Ethercat Ports in Mass Flow Controllers and Mass Flow Meters Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
E18400 - SEMI E184 - Specification for 300 mm Tape Frame FOUP Load Port
SEMI E184 - Specification for 300 mm Tape Frame FOUP Load Port Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
G01900 - SEMI G19 - エッチングにより製造されるDIPリードフレームのための仕様
SEMI G19 - エッチングにより製造されるDIPリードフレームのための仕様 Sale priceMember Price: ₩135
Non-Member Price: ₩271,000
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