SEMI 3D14 - Guide for Incoming/Outgoing Quality control and Testing Flow for 3DS-IC Products

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1900 products

G05100 - SEMI G51 - プラスチックモールド・クアッドフラットパック・リードフレームのための仕様
SEMI G51 - プラスチックモールド・クアッドフラットパック・リードフレームのための仕様 Sale priceMember Price: $135.00
Non-Member Price: $231.00
G08600 - SEMI G86 - Test Method for Measurement of Chip (Die) Strength by Mean of 3-Point Bending
SEMI G86 - Test Method for Measurement of Chip (Die) Strength by Mean of 3-Point Bending Sale priceMember Price: $113.00
Non-Member Price: $193.00
MF180900 - SEMI MF1809 - Guide for Selection and Use of Etching Solutions to Delineate Structural Defects in Silicon
SEMI MF1809 - Guide for Selection and Use of Etching Solutions to Delineate Structural Defects in Silicon Sale priceMember Price: $113.00
Non-Member Price: $193.00
M05400 - SEMI M54 - 半絶縁性（SI）GaAs材料のパラメータのガイド
SEMI M54 - 半絶縁性（SI）GaAs材料のパラメータのガイド Sale priceMember Price: $135.00
Non-Member Price: $231.00
G05500 - SEMI G55 - Test Method for Measurement of Silver Plating Brightness
SEMI G55 - Test Method for Measurement of Silver Plating Brightness Sale priceMember Price: $113.00
Non-Member Price: $193.00
M00100 - SEMI M1 - Specification for Polished Single Crystal Silicon Wafers
SEMI M1 - Specification for Polished Single Crystal Silicon Wafers Sale priceMember Price: $225.00
Non-Member Price: $380.00
M01600 - SEMI M16 - 多結晶シリコンの仕様
SEMI M16 - 多結晶シリコンの仕様 Sale priceMember Price: $135.00
Non-Member Price: $231.00
HB00500 - SEMI HB5 - Test Method for Measurement of Saw Marks on Crystalline Sapphire Wafers by Using Optical Probes
SEMI HB5 - Test Method for Measurement of Saw Marks on Crystalline Sapphire Wafers by Using Optical Probes Sale priceMember Price: $113.00
Non-Member Price: $193.00
G06300 - SEMI G63 - ダイ剪断強度の測定方法
SEMI G63 - ダイ剪断強度の測定方法 Sale priceMember Price: $135.00
Non-Member Price: $231.00
M04100 - SEMI M41 - 電源デバイス／IC用シリコン・オン・インシュレーター（SOI）の仕様
SEMI M41 - 電源デバイス／IC用シリコン・オン・インシュレーター（SOI）の仕様 Sale priceMember Price: $135.00
Non-Member Price: $231.00
HB00100 - SEMI HB1 - Specification for Sapphire Wafers Intended for Use for Manufacturing High Brightness-Light Emitting Diode Devices
SEMI HB1 - Specification for Sapphire Wafers Intended for Use for Manufacturing High Brightness-Light Emitting Diode Devices Sale priceMember Price: $113.00
Non-Member Price: $193.00
MF213900 - SEMI MF2139 - Test Method for Measuring Nitrogen Concentration in Silicon Substrates by Secondary Ion Mass Spectrometry
SEMI MF2139 - Test Method for Measuring Nitrogen Concentration in Silicon Substrates by Secondary Ion Mass Spectrometry Sale priceMember Price: $113.00
Non-Member Price: $193.00
G04900 - SEMI G49 - Specification for Plastic Molding Preforms
SEMI G49 - Specification for Plastic Molding Preforms Sale priceMember Price: $113.00
Non-Member Price: $193.00
G08100 - SEMI G81 - Specification for Map Data Items
SEMI G81 - Specification for Map Data Items Sale priceMember Price: $113.00
Non-Member Price: $193.00
HB00700 - SEMI HB7 - Test Method for Measurement of Waviness of Crystalline Sapphire Wafers by Using Optical Probes
SEMI HB7 - Test Method for Measurement of Waviness of Crystalline Sapphire Wafers by Using Optical Probes Sale priceMember Price: $113.00
Non-Member Price: $193.00
M05600 - SEMI M56 - Practice for Determining Cost Components for Metrology Equipment Due to Measurement Variability and Bias
SEMI M56 - Practice for Determining Cost Components for Metrology Equipment Due to Measurement Variability and Bias Sale priceMember Price: $113.00
Non-Member Price: $193.00
G05700 - SEMI G57 - Guide for Standardization of Leadframe Terminology
SEMI G57 - Guide for Standardization of Leadframe Terminology Sale priceMember Price: $113.00
Non-Member Price: $193.00
F02200 - SEMI F22 - Guide for Bulk and Specialty Gas Distribution Systems
SEMI F22 - Guide for Bulk and Specialty Gas Distribution Systems Sale priceMember Price: $113.00
Non-Member Price: $193.00
G08700 - SEMI G87 - Specification for Plastic Tape Frame for 300 mm Wafer
SEMI G87 - Specification for Plastic Tape Frame for 300 mm Wafer Sale priceMember Price: $113.00
Non-Member Price: $193.00
G07300 - SEMI G73 - Test Method for Pull Strength for Wire Bonding
SEMI G73 - Test Method for Pull Strength for Wire Bonding Sale priceMember Price: $113.00
Non-Member Price: $193.00
G05200 - SEMI G52 - Test Method for Measurement of Ionic Contamination on Semiconductor Leadframes
SEMI G52 - Test Method for Measurement of Ionic Contamination on Semiconductor Leadframes Sale priceMember Price: $113.00
Non-Member Price: $193.00
G07500 - SEMI G75 - Standard Test Method of the Properties of Leadframe Tape
SEMI G75 - Standard Test Method of the Properties of Leadframe Tape Sale priceMember Price: $113.00
Non-Member Price: $193.00
G05900 - SEMI G59 - Test Method for Measurement of Ionic Contamination on Leadframe Interleafing and the Contamination Transferred from the Interleafing to the Leadframes
SEMI G59 - Test Method for Measurement of Ionic Contamination on Leadframe Interleafing and the Contamination Transferred from the Interleafing to the Leadframes Sale priceMember Price: $113.00
Non-Member Price: $193.00
HB00300 - SEMI HB3 - Specification for the Mechanical Interface for 150 mm HB-LED Load Port
SEMI HB3 - Specification for the Mechanical Interface for 150 mm HB-LED Load Port Sale priceMember Price: $113.00
Non-Member Price: $193.00