SEMI 3D14 - Guide for Incoming/Outgoing Quality control and Testing Flow for 3DS-IC Products

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1900 products

HB01200 - SEMI HB12 - Specification for Dry-Etched Patterned Sapphire Substrates (DPSS)
SEMI HB12 - Specification for Dry-Etched Patterned Sapphire Substrates (DPSS) Sale priceMember Price: $113.00
Non-Member Price: $193.00
G00600 - SEMI G6 - 検査方法 封止リング平坦度
SEMI G6 - 検査方法 封止リング平坦度 Sale priceMember Price: $135.00
Non-Member Price: $180.00
G03500 - SEMI G35 - Specification for Test Methods for Lead Finishes on Semiconductor (Active) Devices
T00600 - SEMI T6 - Procedure and Format for Reporting of Test Results by Electronic Data Interchange (EDI)
G01600 - SEMI G16 - Specification for Dimensions and Tolerances Used to Manufacture Plastic Chip Carrier Tooling
P00500 - SEMI P5 - ペリクルの仕様
SEMI P5 - ペリクルの仕様 Sale priceMember Price: $135.00
Non-Member Price: $231.00
AUX00500 - SEMI AUX005 - Comparison Matrix Between SEMI S2-93A and S2-0200
SEMI AUX005 - Comparison Matrix Between SEMI S2-93A and S2-0200 Sale priceMember Price: $113.00
Non-Member Price: $170.00
P03700 - SEMI P37 - 極紫外線リソグラフィマスク基板の仕様
SEMI P37 - 極紫外線リソグラフィマスク基板の仕様 Sale priceMember Price: $135.00
Non-Member Price: $231.00
G00200 - SEMI G2 - CERDIPパッケージ用金属リードフレームの仕様
SEMI G2 - CERDIPパッケージ用金属リードフレームの仕様 Sale priceMember Price: $135.00
Non-Member Price: $231.00
A00500 - SEMI A5 - Specification for Factory Operation Extension for SEMI A2 SMASH (SMASH-FOX)
E18700 - SEMI E187 - Specification for Cybersecurity of Fab Equipment
SEMI E187 - Specification for Cybersecurity of Fab Equipment Sale priceMember Price: $113.00
Non-Member Price: $380.00
E18500 - SEMI E185 - Specification for 300 mm Tape Frame FOUP
SEMI E185 - Specification for 300 mm Tape Frame FOUP Sale priceMember Price: $113.00
Non-Member Price: $193.00
PV09300 - SEMI PV93 - Test Method for Accelerated Cell Level Testing for Light And Elevated Temperature Induced Degradation (LeTID) Susceptibility of Solar Cells
G03600 - SEMI G36 - Specification for Dimensions and Tolerances Used to Manufacture Plastic Molded High Density Tab Quad Semiconductor Package Tooling
C10400 - SEMI C104 - Guide for Reporting Performance Parameters of the Polymer Windows for Chemical Mechanical Planarization (CMP) Pads Used in Semiconductor Manufacturing
F07700 - SEMI F77 - 腐食性のガスシステムに使用される合金表面の電気化学的臨界孔食温度のテスト方法
P00300 - SEMI P3 - Specification for Photoresist/E-Beam Resist for Hard Surface Photoplates
SEMI P3 - Specification for Photoresist/E-Beam Resist for Hard Surface Photoplates Sale priceMember Price: $113.00
Non-Member Price: $193.00
G04400 - SEMI G44 - Specification for Lead Finishes for Glass to Metal Seal Ceramic Packages (Active Devices Only)
P02000 - SEMI P20 - EBレジストパラメータのカタログ公表のガイドライン(提案)
P01100 - SEMI P11 - アルカリ現像溶液に対する全規定度の測定のテスト方法
SEMI P11 - アルカリ現像溶液に対する全規定度の測定のテスト方法 Sale priceMember Price: $135.00
Non-Member Price: $231.00
M03800 - SEMI M38 - 鏡面リクレイムシリコンウェーハの仕様
SEMI M38 - 鏡面リクレイムシリコンウェーハの仕様 Sale priceMember Price: $135.00
Non-Member Price: $231.00
M02300 - SEMI M23 - 鏡面単結晶インジウムリンウェーハの仕様
SEMI M23 - 鏡面単結晶インジウムリンウェーハの仕様 Sale priceMember Price: $135.00
Non-Member Price: $231.00
M07600 - SEMI M76 - Specification for Developmental 450 mm Diameter Polished Single Crystal Silicon Wafers
M05600 - SEMI M56 - 計量装置の測定変動と偏りに起因する費用成分の作業法
SEMI M56 - 計量装置の測定変動と偏りに起因する費用成分の作業法 Sale priceMember Price: $135.00
Non-Member Price: $231.00