SEMI G27 - Specification for Leadframes for Plastic Leaded Chip Carrier (PLCC) Packages -

Abstract

This specification is a guideline for high volume production of leadframes for plastic leaded chip carrier semiconductor packages. It is a design guideline for packaging engineers, leadframe stampers, and mold manufacturers, and has been developed to meet the requirements of automatic assemblers.

　

Referenced SEMI Standards

SEMI G4 — Specification for Integrated Circuit Leadframe Material
SEMI G10 — Standard Method of Mechanical Measurement for Leadframes
SEMI G18 — Specification, Integrated Circuit Leadframe Materials Used in the Production of Etched Leadframes
SEMI G21 — Specification, Plating Integrated Circuit Leadframes

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