ESD Alliance 2026 Executive Outlook

ESD Alliance 2026 Executive Outlook
How Will Agentic AI Change Chip Design and Verification?

Panel Moderator: Ed Sperling, Editor-in-Chief, Semiconductor Engineering, Moderator

Panelists:
Dave Kelf, CEO, Breker Verification Systems
Vince Wong, Head of AI Development, Verific
Shelly Henry, CEO, Moores Lab AI
Ann Wu, CEO, Silimate
Cindy Cui, VP of Global Customer Success, Chips Agent

CANCELLATION POLICY:
Email cancellations requests prior to May 27, 2026, to Paul Cohen, pcohen@semi.org.