SEMI 3D14 - Guide for Incoming/Outgoing Quality control and Testing Flow for 3DS-IC Products -

Abstract

This Standard was technically approved by the 3DS-IC Global Technical Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on March 26, 2015. Available at www.semiviews.org and www.semi.org in June 2015.

　

To ensure consistent yield control of 3DS-IC products, common criteria for incoming quality control (IQC) and outgoing quality control (OQC) of outsourced subassembly and test (OSAT) are needed. The generic testing flows for different 3DS-IC products also be defined in this Guide will expedite the progress of 3DS-IC testing.

　

This Guide will define the criteria for IQC and OQC of OSATs, such as appearance, discoloration, missing ball or crack to clarify the manufacturer’s responsibilities and to improve product yield. This Guide will also define the generic testing flows for different 3DS-IC products, such as chip on chip (CoC), chip on substrate (CoS), chip on wafer (CoW), stacked chip on substrate (SCoS), and wafer on wafer (WoW) to help accelerate the progress of 3DS-IC testing.

　

Referenced SEMI Standards

SEMI M59 — Terminology for Silicon Technology

Refund Policy: Due to the nature of our products, SEMI has a no refund/no exchange policy. Please make sure that you have reviewed your order prior to finalizing your purchase. All sales are final.