G08600 - SEMI G86 - 시리콘칩(다이)의 3차 테스트 방법

SEMI G86 - 시리콘칩(다이)의 3차 테스트 방법 -

Member Price: ₩135
Non-Member Price: ₩347,000

Volume(s): Packaging
Language: Japanese

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Type: Single Standards Download (.pdf)

개정: SEMI G86-0303(0811 재승인) - 대체됨

개정

Abstract

本test方法は，Global Assembly and Packaging Committeeで技術的に承認されたもので，Japanese Packaging Committeeが直接責任を負うものである。현재 는 2003년 1월 10 일일본지역표준위원회 にて承認されている。 2003年1 月にまず www.semi.org で入手可能になり，2003 年3 月発行に至る。

 

本test方法は，시리콘칩強度評価のための，静的な三点曲げtest方法を定義する。

　

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