G06600 - SEMI G66 - 半導体用 프라스틱크모르딘그콘파운드의 吸湿特性の測定方法

SEMI G66 - 半導体用 프라스틱크모르딘그콘파운드의 吸湿特性の測定方法 -

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Volume(s): Packaging
Language: Japanese

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Type: Single Standards Download (.pdf)

개정: SEMI G66-96(0811 재승인) - 대체됨

개정

Abstract

本standanardは， global Assembly & Packaging Technical Committee で技術的に承認されている。現版は2011年7月1日， global Audits and Reviews Subcommitteeにて発行が承認された。 2011年8月にwww.semiviews .org およびwww.semi.org 에서 1996년 9월 20일 이전 2004년 11월 11일.

　

注意: 本文書は，編集上の修正を伴い再承認された.

　

この試験方法は，Prastickmordingconpaundoの吸水率の測定手順について説明し，吸湿特性をシミュレートするために必要な拡散係数to溶解度係数を計算する方法を提供する.

　

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