SEMI G26 - Specification for Hermetic Slam Chip Carrier Lids -

Name: G02600 - SEMI G26 - Specification for Hermetic Slam Chip Carrier Lids
Brand: semi.org
Price: 211000.0 KRW
Availability: InStock

Member Price: ₩113

Non-Member Price: ₩211,000

Volume(s): Packaging
Language: English
Type: Single Standards Download (.pdf)
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Abstract

This specification covers the ceramic piece part commonly referred to as a lid, used in the construction of a hermetic SLAM package with a 0.050" pad centerline. The SLAM package is covered separately in SEMI G5.

Referenced SEMI Standards

None.

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SEMI G26 - Specification for Hermetic Slam Chip Carrier Lids -

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