G01500 - SEMI G15 - 모르딩콘파운드示差走査熱量分析の標準試験方法

SEMI G15 - 모르딩콘파운드示差走査熱量分析の標準試験方法 -

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Volume(s): Packaging
Language: Japanese

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Type: Single Standards Download (.pdf)

개정: SEMI G15-93(0811 재승인) - 비활성

개정

Abstract

本standanardは， global Assembly & Packaging Technical Committee で技術的に承認されている。現版は2011年7月1日， global Audits and Reviews Subcommitteeにて発行が承認された。 2011年8月にwww.semiviews .orgおよびwww.semi.org 에서 1993 년 열병식을 시작하세요.

　

注意: 本文書は，編集上の修正を伴い再承認された.

　

本文は示差走査熱量分析(DSC)により，에포키시모르딘그콘파운드を評価する方法を記述したものである.

　

単位－SI 単位系を使用する.

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