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G04800 - SEMI G48 - Specification for Measurement Method for Molded Plastic Package Tooling
SEMI G48 - Specification for Measurement Method for Molded Plastic Package Tooling 할인 가격Member Price: ₩113
Non-Member Price: ₩226,000
G00900 - SEMI G9 - 仕様 スタンピングによる半導体プラスチックDIPパッケージ用リードフレーム
G04700 - SEMI G47 - Specification for Plastic Molded Quad Flat Pack Leadframes
SEMI G47 - Specification for Plastic Molded Quad Flat Pack Leadframes 할인 가격Member Price: ₩113
Non-Member Price: ₩226,000
P04400 - SEMI P44 - マスク装置向けオープン・アートワーク・システム・インターチェンジ・スタンダード(OASIS®)の仕様
C10000 - SEMI C100 - Guide for Reporting Chemical Mechanical Planarization (CMP) Polishing Pads Hardness Used in Semiconductor Manufacturing
T01400 - SEMI T14 - Specification for Micro ID on 300 mm Silicon Wafers
SEMI T14 - Specification for Micro ID on 300 mm Silicon Wafers 할인 가격Member Price: ₩225
Non-Member Price: ₩571,000
P02900 - SEMI P29 - 減衰型位相シフトマスク(ハーフトーン型位相シフトマスク)およびマスクブランクスに特有な特性の仕様
E18100 - SEMI E181 - Specification for Panel FOUP for Panel Level Packaging
SEMI E181 - Specification for Panel FOUP for Panel Level Packaging 할인 가격Member Price: ₩113
Non-Member Price: ₩290,000
P00700 - SEMI P7 - 粘性決定方法,方法A-動粘度
SEMI P7 - 粘性決定方法,方法A-動粘度 할인 가격Member Price: ₩135
Non-Member Price: ₩347,000
P03100 - SEMI P31 - 化学増幅型(CA)フォトレジストパラメータのカタログ発行の作業方法
M09000 - SEMI M90 - Test Method for Bulk Micro Defect Density and Denuded Zone Width in Annealed Silicon Wafers by Optical Microscopy After Preferential Etching
C10100 - SEMI C101 - Test Method for Determining pH of Chemical Mechanical Planarization (CMP) Slurries and Related Chemicals
PV09500 - SEMI PV95 - Test Method for Metal Wrap Through Solar Cell Via Resistance
SEMI PV95 - Test Method for Metal Wrap Through Solar Cell Via Resistance 할인 가격Member Price: ₩113
Non-Member Price: ₩290,000
G07600 - SEMI G76 - TCP用ポリイミド接着テープの仕様
SEMI G76 - TCP用ポリイミド接着テープの仕様 할인 가격Member Price: ₩135
Non-Member Price: ₩271,000
F11900 - SEMI F119 - Test Method for Determining the Critical Pitting Temperature of Stainless Steel Surfaces Used in Corrosive Gas Systems by Use of a Ferric Chloride Solution
T01500 - SEMI T15 - 治具IDの一般仕様 (コンセプト)
SEMI T15 - 治具IDの一般仕様 (コンセプト) 할인 가격Member Price: ₩135
Non-Member Price: ₩347,000
G00100 - SEMI G1 - 仕様Cer-DIPパッケージ構造
SEMI G1 - 仕様Cer-DIPパッケージ構造 할인 가격Member Price: ₩135
Non-Member Price: ₩347,000
PV02300 - SEMI PV23 - 結晶シリコン太陽電池(PV)モジュールの輸送環境におけるメカニカル振動試験の方法
D08100 - SEMI D81 - Test Method for Dimming Properties of Flat Panel Displays
SEMI D81 - Test Method for Dimming Properties of Flat Panel Displays 할인 가격Member Price: ₩113
Non-Member Price: ₩290,000
G02700 - SEMI G27 - Specification for Leadframes for Plastic Leaded Chip Carrier (PLCC) Packages
SEMI G27 - Specification for Leadframes for Plastic Leaded Chip Carrier (PLCC) Packages 할인 가격Member Price: ₩113
Non-Member Price: ₩226,000
T01300 - SEMI T13 - Specification for Device Tracking: Concepts, Behavior, and Services
SEMI T13 - Specification for Device Tracking: Concepts, Behavior, and Services 할인 가격Member Price: ₩225
Non-Member Price: ₩571,000
P03900 - SEMI P39 - OASISTM – オープン・アートワーク・システム・インターチェンジ・スタンダード(OPEN ARTWORK SYSTEM INTERCHANGE STANDARD)
A00300 - SEMI A3 - Specification for Printed Circuit Board Equipment Communication Interfaces (PCBECI)
SEMI A3 - Specification for Printed Circuit Board Equipment Communication Interfaces (PCBECI) 할인 가격Member Price: ₩225
Non-Member Price: ₩571,000
S00600 - SEMI S6 - 半導体製造装置の排気換気に関する環境,健康,安全のためのガイドライン
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