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SEMI M74 - Specification for 450 mm Diameter Mechanical Handling Polished Wafers -
Abstract
This Standard was technically approved by the Silicon Wafer Global Technical Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on August 17, 2018. Available at www.semiviews.org and www.semi.org in October 2018; originally published November 2008; previously published April 2013.
This Document specifies 450 mm diameter mechanical handling wafers intended for use in research, development and early design investigation of 450 mm semiconductor equipment such as 450 mm wafers, carriers, load ports, AMHS, and robotics.
This Specification covers dimensional requirements for 450 mm diameter polished silicon wafers. This Specification is intended to address a short-term need for handling wafers. It is not intended to specify wafers used in process development or for technology-specific circuit-quality applications. This Document should be superseded by a process development wafer specification, a prime wafer specification and technology-specific guidelines for circuit-quality wafers.
A complete purchase specification may require that additional physical properties be specified along with test methods for determining their magnitude (see § 5).
Wafers meeting the basic specification requirements herein are suitable for use as "mechanical handling" wafers for equipment set-up and robotic handling applications.
For referee purposes, SI (System International, commonly called metric) units shall be used.
Referenced SEMI Standards
SEMI M1 — Specification for Polished Single Crystal Silicon Wafers
SEMI M20 — Practice for Establishing a Wafer Coordinate System
SEMI M59 — Terminology for Silicon Technology
SEMI MF533 — Test Method for Thickness and Thickness Variation of Silicon Wafers
SEMI MF928 — Test Method for Edge Contour of Circular Semiconductor Wafers and Rigid Disk Substrates
SEMI MF1152 — Test Method for Dimensions of Notches on Silicon Wafers
SEMI MF1390 — Test Method for Measuring Warp on Silicon Wafers by Automated Non-Contact Scanning
SEMI MF1451 — Test Method for Measuring Sori on Silicon Wafers by Automated Non-Contact Scanning
SEMI MF1530 — Test Method for Measuring Flatness, Thickness, and Total Thickness Variation on Silicon Wafers by Automated Non-Contact Scanning
SEMI T3 — Specification for Wafer Box Labels
SEMI T7 — Specification for Back Surface Marking of Double-Side Polished Wafers with a Two-Dimensional Matrix Code Symbol
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