SEMI G20 - Specification for Lead Finishes for Plastic Packages (Active Devices Only) -

Abstract

This specification defines lead finishes for plastic packages (e.g., single-in-line, dual-in-line, quad-in-line) using leadframes with SEMI-specified leadframe materials.

　

Referenced SEMI Standards

SEMI G4 — Specification for Integrated Circuit Leadframe Materials Used in the Production of Stamped Leadframes
SEMI G18 — Specification for Integrated Circuit Leadframe Material Used in the Production of Etched Leadframes
SEMI G55 — Test Method Measurement of Silver Plating Brightness
SEMI G56 — Test Method Measurement of Silver Plating Thickness

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