SEMI 3D16 - Specification for Glass Base Material for Semiconductor Packaging

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1910 products

G07600 - SEMI G76 - Specification for Polyimide-Based Adhesive Tape Used in Tape Carrier Packages (TCP)
M02200 - SEMI M22 - Specification for Dielectrically Isolated (DI) Wafers
SEMI M22 - Specification for Dielectrically Isolated (DI) Wafers Sale priceMember Price: €113,00
Non-Member Price: €171,95
C02100 - SEMI C21 - 水酸化アンモニウムの仕様とガイドライン
SEMI C21 - 水酸化アンモニウムの仕様とガイドライン Sale priceMember Price: €135,00
Non-Member Price: €205,95
G07100 - SEMI G71 - パッケージング材料の中間容器のバーコードマーキングの仕様
G07800 - SEMI G78 - Test Method for Comparing Automated Wafer Probe Systems Utilizing Process-Specific Measurements
T01300 - SEMI T13 - Specification for Device Tracking: Concepts, Behavior, and Services
SEMI T13 - Specification for Device Tracking: Concepts, Behavior, and Services Sale priceMember Price: €225,00
Non-Member Price: €337,95
G02700 - SEMI G27 - Specification for Leadframes for Plastic Leaded Chip Carrier (PLCC) Packages
SEMI G27 - Specification for Leadframes for Plastic Leaded Chip Carrier (PLCC) Packages Sale priceMember Price: €113,00
Non-Member Price: €133,95
P01400 - SEMI P14 - 黒鉛炉原子吸光分光法によるポジティブフォトレジスト中の錫の測定
G06500 - SEMI G65 - Lリード(ガルウイング型)パッケージ用リードフレーム材料の評価の試験方法
P01900 - SEMI P19 - Specification for Metrology Pattern Cells for Integrated Circuit Manufacture
SEMI P19 - Specification for Metrology Pattern Cells for Integrated Circuit Manufacture Sale priceMember Price: €113,00
Non-Member Price: €171,95
P01400 - SEMI P14 - Determination of Tin in Positive Photoresists by Graphite Furnace Atomic Absorption Spectroscopy
3D01900 - SEMI 3D19 - Test Method for Adhesive Strength of Adhesive Tray Used for Thin Chip Handling
SEMI 3D19 - Test Method for Adhesive Strength of Adhesive Tray Used for Thin Chip Handling Sale priceMember Price: €113,00
Non-Member Price: €171,95
C00300 - SEMI C3 - ガスの仕様
SEMI C3 - ガスの仕様 Sale priceMember Price: €135,00
Non-Member Price: €205,95
D02900 - SEMI D29 - 平面顯示螢幕(FPD)彩色濾光片耐熱性計算之測試法
SEMI D29 - 平面顯示螢幕(FPD)彩色濾光片耐熱性計算之測試法 Sale priceMember Price: €113,00
Non-Member Price: €171,95
C02900 - SEMI C29 - 4.9%フッ化ケイ素酸(10:1 V/V)の仕様とガイドライン
SEMI C29 - 4.9%フッ化ケイ素酸(10:1 V/V)の仕様とガイドライン Sale priceMember Price: €135,00
Non-Member Price: €205,95
P02300 - SEMI P23 - プログラム欠陥マスクおよびマスク欠陥検査システムの感度分析ベンチマーク手順についてのガイドライン
MS00800 - SEMI MS8 - Guide to Evaluating Hermeticity of Microelectromechanical Systems (MEMS) Packages
SEMI MS8 - Guide to Evaluating Hermeticity of Microelectromechanical Systems (MEMS) Packages Sale priceMember Price: €113,00
Non-Member Price: €171,95
G03800 - SEMI G38 - 静止空気および強制風冷によるICパッケージのジャンクション部周囲間の熱抵抗の測定法
MF172300 - SEMI MF1723 - Practice for Evaluation of Polycrystalline Silicon Rods by Float-Zone Crystal Growth and Spectroscopy
C03900 - SEMI C39 - Specification for Potassium Hydroxide Pellets
SEMI C39 - Specification for Potassium Hydroxide Pellets Sale priceMember Price: €113,00
Non-Member Price: €171,95
M03700 - SEMI M37 - 低転位密度Inp基板のエッチピット密度(EPD)測定方法
SEMI M37 - 低転位密度Inp基板のエッチピット密度(EPD)測定方法 Sale priceMember Price: €135,00
Non-Member Price: €205,95
F02000 - SEMI F20 - 高純度および超高純度の半導体製造アプリケーションで使用される汎用コンポーネント用の316Lステンレス鋼の棒鋼,鍛造品,押出成形品,鋼板,鋼管の仕様
P04700 - SEMI P47 - Test Method for Evaluation of Line-Edge Roughness and Linewidth Roughness
SEMI P47 - Test Method for Evaluation of Line-Edge Roughness and Linewidth Roughness Sale priceMember Price: €113,00
Non-Member Price: €171,95
M03100 - SEMI M31 - 300 mmウェーハの搬送および出荷用フロントオープニング・シッピングボックスの機械仕様