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1910 products

G01000 - SEMI G10 - Standard Method for Mechanical Measurement of Plastic Package Leadframes
SEMI G10 - Standard Method for Mechanical Measurement of Plastic Package Leadframes Sale priceMember Price: €113,00
Non-Member Price: €171,95
G01000 - SEMI G10 - プラスチックパッケージリードフレームの機械的標準測定方法
G01100 - SEMI G11 - Practice for RAM Follower Gel Time and Spiral Flow of Thermal Setting Molding Compounds
G01100 - SEMI G11 - 熱硬化性モールディングコンパウンドのラムフォロワー装置によるゲル化時間およびスパイラルフローの推奨作業方法
G01300 - SEMI G13 - Test Method for Thermal Expansion Characteristics of Molding Compounds
SEMI G13 - Test Method for Thermal Expansion Characteristics of Molding Compounds Sale priceMember Price: €113,00
Non-Member Price: €171,95
G01300 - SEMI G13 - モールディングコンパウンドの膨張特性の標準試験方法
SEMI G13 - モールディングコンパウンドの膨張特性の標準試験方法 Sale priceMember Price: €135,00
Non-Member Price: €204,95
G01400 - SEMI G14 - Guideline for Specifying the Dimensions and Tolerances Used to Manufacture Plastic Molded Dip Package Tooling
G01500 - SEMI G15 - Standard Test Method for Differential Scanning Calorimetry of Molding Compounds
SEMI G15 - Standard Test Method for Differential Scanning Calorimetry of Molding Compounds Sale priceMember Price: €113,00
Non-Member Price: €171,95
G01500 - SEMI G15 - モールディングコンパウンド示差走査熱量分析の標準試験方法
G01600 - SEMI G16 - Specification for Dimensions and Tolerances Used to Manufacture Plastic Chip Carrier Tooling
G01800 - SEMI G18 - Specification for Integrated Circuit Leadframe Material Used in the Production of Etched Leadframes
G01800 - SEMI G18 - エッチングリードフレームの製造に使用する集積回路用リードフレーム材料のためのスタンダード
G01900 - SEMI G19 - Specification for Dip Leadframes Produced by Etching
SEMI G19 - Specification for Dip Leadframes Produced by Etching Sale priceMember Price: €113,00
Non-Member Price: €171,95
G01900 - SEMI G19 - エッチングにより製造されるDIPリードフレームのための仕様
SEMI G19 - エッチングにより製造されるDIPリードフレームのための仕様 Sale priceMember Price: €135,00
Non-Member Price: €159,95
G02000 - SEMI G20 - Specification for Lead Finishes for Plastic Packages (Active Devices Only)
SEMI G20 - Specification for Lead Finishes for Plastic Packages (Active Devices Only) Sale priceMember Price: €113,00
Non-Member Price: €171,95
G02100 - SEMI G21 - Specification for Plating Integrated Circuit Leadframes
SEMI G21 - Specification for Plating Integrated Circuit Leadframes Sale priceMember Price: €113,00
Non-Member Price: €171,95
G02200 - SEMI G22 - Specification for Ceramic Pin Grid Array Packages
SEMI G22 - Specification for Ceramic Pin Grid Array Packages Sale priceMember Price: €113,00
Non-Member Price: €133,95
G02300 - SEMI G23 - Test Method of Inductance for Internal Traces of Semiconductor Packages
SEMI G23 - Test Method of Inductance for Internal Traces of Semiconductor Packages Sale priceMember Price: €113,00
Non-Member Price: €171,95
G02300 - SEMI G23 - 半導体パッケージの内部導体路のインダクタンスのための試験方法
G02400 - SEMI G24 - Test Method for Measuring the Lead-to-Lead and Loading Capacitance of Package Leads
G02400 - SEMI G24 - パッケージ・リード間の容量および付加容量の測定のための試験方法
G02500 - SEMI G25 - Test Method for Measuring the Resistance of Package Leads
SEMI G25 - Test Method for Measuring the Resistance of Package Leads Sale priceMember Price: €113,00
Non-Member Price: €171,95
G02500 - SEMI G25 - パッケージ・リード抵抗の測定のための試験方法
SEMI G25 - パッケージ・リード抵抗の測定のための試験方法 Sale priceMember Price: €135,00
Non-Member Price: €204,95
G02600 - SEMI G26 - Specification for Hermetic Slam Chip Carrier Lids
SEMI G26 - Specification for Hermetic Slam Chip Carrier Lids Sale priceMember Price: €113,00
Non-Member Price: €133,95