Global Semiconductor Packaging Materials Outlook 2020 to 2024 - SEMI Dev 2

Global Semiconductor Packaging Materials Outlook 2020 to 2024

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Joint report from SEMI and TechSearch International examining the global semiconductor packaging materials market size and 5-year forecast to 2024.


Packaging material segments include substrates, leadframes, bonding wires, underfill materials, die attach materials, solder balls, wafer level packages, and plating chemicals.


Market size is broken out by region and is represented in units and revenue.

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