SEMI G74 - Specification for Tape Frame for 300 mm Wafers -

Abstract

The purpose of this Document is to standardize the specifications for 300 mm wafer tape frames used between the dicing process and the die-bonding process.

This Standard documents the dimensions, characteristics, and measurement methods for 300 mm wafer tape frames.

 

This Standard can be used as the specification sheet for tape frame upon purchasing.

 

This Standard uses the SI unit system.

 

Referenced SEMI Standards (purchase separately)

None.

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