SEMI Standards

SEMI Standards are voluntary technical agreements for the semiconductor, flat panel display, micro-electromechanical systems, photovoltaic, and high-brightness LED industries.

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1625 products

G06700 - SEMI G67 - Test Method for the Measurement of Particle Generation from Sheet Materials
SEMI G67 - Test Method for the Measurement of Particle Generation from Sheet Materials Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
G02100 - SEMI G21 - Specification for Plating Integrated Circuit Leadframes
SEMI G21 - Specification for Plating Integrated Circuit Leadframes Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
G02800 - SEMI G28 - Specification for Leadframes for Plastic Molded S.O. Packages
SEMI G28 - Specification for Leadframes for Plastic Molded S.O. Packages Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
G06800 - SEMI G68 - Test Method for Junction-to-Case Thermal Resistance Measurements in Air Environment for Semiconductor Packages
SEMI G68 - Test Method for Junction-to-Case Thermal Resistance Measurements in Air Environment for Semiconductor Packages Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
G02400 - SEMI G24 - パッケージ・リード間の容量および付加容量の測定のための試験方法
SEMI G24 - パッケージ・リード間の容量および付加容量の測定のための試験方法 Sale priceMember Price: ₩135
Non-Member Price: ₩348,000
M07500 - SEMI M75 - Specification for Polished Monocrystalline Gallium Antimonide Wafers
SEMI M75 - Specification for Polished Monocrystalline Gallium Antimonide Wafers Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
G03800 - SEMI G38 - Test Method for Still- and Forced-Air Junction-to-Ambient Thermal Resistance Measurements of Integrated Circuit Packages
SEMI G38 - Test Method for Still- and Forced-Air Junction-to-Ambient Thermal Resistance Measurements of Integrated Circuit Packages Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
G05100 - SEMI G51 - プラスチックモールド・クアッドフラットパック・リードフレームのための仕様
SEMI G51 - プラスチックモールド・クアッドフラットパック・リードフレームのための仕様 Sale priceMember Price: ₩135
Non-Member Price: ₩348,000
G01000 - SEMI G10 - プラスチックパッケージリードフレームの機械的標準測定方法
SEMI G10 - プラスチックパッケージリードフレームの機械的標準測定方法 Sale priceMember Price: ₩135
Non-Member Price: ₩348,000
G03100 - SEMI G31 - Test Method for Determining the Abrasive Characteristics of Molding Compounds
SEMI G31 - Test Method for Determining the Abrasive Characteristics of Molding Compounds Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
G08100 - SEMI G81 - Specification for Map Data Items
SEMI G81 - Specification for Map Data Items Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
G04900 - SEMI G49 - Specification for Plastic Molding Preforms
SEMI G49 - Specification for Plastic Molding Preforms Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
G07500 - SEMI G75 - Standard Test Method of the Properties of Leadframe Tape
SEMI G75 - Standard Test Method of the Properties of Leadframe Tape Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
G05700 - SEMI G57 - Guide for Standardization of Leadframe Terminology
SEMI G57 - Guide for Standardization of Leadframe Terminology Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
G05900 - SEMI G59 - Test Method for Measurement of Ionic Contamination on Leadframe Interleafing and the Contamination Transferred from the Interleafing to the Leadframes
SEMI G59 - Test Method for Measurement of Ionic Contamination on Leadframe Interleafing and the Contamination Transferred from the Interleafing to the Leadframes Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
G09700 - SEMI G97 - Specification for Adhesive Tray Used for Thin Chip Handling
SEMI G97 - Specification for Adhesive Tray Used for Thin Chip Handling Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
G07000 - SEMI G70 - プラスチックパッケージリードフレーム測定用装置とリードフレーム支持具のスタンダード
SEMI G70 - プラスチックパッケージリードフレーム測定用装置とリードフレーム支持具のスタンダード Sale priceMember Price: ₩135
Non-Member Price: ₩348,000
G01800 - SEMI G18 - Specification for Integrated Circuit Leadframe Material Used in the Production of Etched Leadframes
SEMI G18 - Specification for Integrated Circuit Leadframe Material Used in the Production of Etched Leadframes Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
M07000 - SEMI M70 - Test Method for Determining Wafer-Near-Edge Geometry Using Partial Wafer Site Flatness
SEMI M70 - Test Method for Determining Wafer-Near-Edge Geometry Using Partial Wafer Site Flatness Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
G02000 - SEMI G20 - Specification for Lead Finishes for Plastic Packages (Active Devices Only)
SEMI G20 - Specification for Lead Finishes for Plastic Packages (Active Devices Only) Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
G01500 - SEMI G15 - Standard Test Method for Differential Scanning Calorimetry of Molding Compounds
SEMI G15 - Standard Test Method for Differential Scanning Calorimetry of Molding Compounds Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
G00400 - SEMI G4 - スタンピングリードフレーム製品で使用されるICリードフレーム材料の仕様
SEMI G4 - スタンピングリードフレーム製品で使用されるICリードフレーム材料の仕様 Sale priceMember Price: ₩135
Non-Member Price: ₩348,000
E02100 - SEMI E21 - Specification for Cluster Tool Module Interface: Mechanical Interface and Wafer Transport
SEMI E21 - Specification for Cluster Tool Module Interface: Mechanical Interface and Wafer Transport Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
E15300 - SEMI E153 - Specification for AMHS SEM (AMHS SEM)
SEMI E153 - Specification for AMHS SEM (AMHS SEM) Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
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