SEMI Standards

SEMI Standards are voluntary technical agreements for the semiconductor, flat panel display, micro-electromechanical systems, photovoltaic, and high-brightness LED industries.

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1625 products

G07600 - SEMI G76 - TCP用ポリイミド接着テープの仕様
SEMI G76 - TCP用ポリイミド接着テープの仕様 Sale priceMember Price: ₩135
Non-Member Price: ₩271,000
G00100 - SEMI G1 - 仕様Cer-DIPパッケージ構造
SEMI G1 - 仕様Cer-DIPパッケージ構造 Sale priceMember Price: ₩135
Non-Member Price: ₩347,000
G02700 - SEMI G27 - Specification for Leadframes for Plastic Leaded Chip Carrier (PLCC) Packages
SEMI G27 - Specification for Leadframes for Plastic Leaded Chip Carrier (PLCC) Packages Sale priceMember Price: ₩113
Non-Member Price: ₩226,000
T01300 - SEMI T13 - Specification for Device Tracking: Concepts, Behavior, and Services
SEMI T13 - Specification for Device Tracking: Concepts, Behavior, and Services Sale priceMember Price: ₩225
Non-Member Price: ₩571,000
G00500 - SEMI G5 - Standard for Ceramic Chip Carriers
SEMI G5 - Standard for Ceramic Chip Carriers Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
G02200 - SEMI G22 - Specification for Ceramic Pin Grid Array Packages
SEMI G22 - Specification for Ceramic Pin Grid Array Packages Sale priceMember Price: ₩113
Non-Member Price: ₩226,000
G08000 - SEMI G80 - 自動試験装置の総合的デジタルタイミング精度を分析するための試験方法
SEMI G80 - 自動試験装置の総合的デジタルタイミング精度を分析するための試験方法 Sale priceMember Price: ₩135
Non-Member Price: ₩347,000
G02600 - SEMI G26 - Specification for Hermetic Slam Chip Carrier Lids
SEMI G26 - Specification for Hermetic Slam Chip Carrier Lids Sale priceMember Price: ₩113
Non-Member Price: ₩226,000
G01400 - SEMI G14 - Guideline for Specifying the Dimensions and Tolerances Used to Manufacture Plastic Molded Dip Package Tooling
SEMI G14 - Guideline for Specifying the Dimensions and Tolerances Used to Manufacture Plastic Molded Dip Package Tooling Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
G00500 - SEMI G5 - 仕様　セラミックチップキャリア（CCC）
SEMI G5 - 仕様　セラミックチップキャリア（CCC） Sale priceMember Price: ₩135
Non-Member Price: ₩290,000
G00100 - SEMI G1 - Specification for Cerdip Package Constructions
SEMI G1 - Specification for Cerdip Package Constructions Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
G01900 - SEMI G19 - エッチングにより製造されるDIPリードフレームのための仕様
SEMI G19 - エッチングにより製造されるDIPリードフレームのための仕様 Sale priceMember Price: ₩135
Non-Member Price: ₩271,000
G03500 - SEMI G35 - Specification for Test Methods for Lead Finishes on Semiconductor (Active) Devices
SEMI G35 - Specification for Test Methods for Lead Finishes on Semiconductor (Active) Devices Sale priceMember Price: ₩113
Non-Member Price: ₩226,000
G01600 - SEMI G16 - Specification for Dimensions and Tolerances Used to Manufacture Plastic Chip Carrier Tooling
SEMI G16 - Specification for Dimensions and Tolerances Used to Manufacture Plastic Chip Carrier Tooling Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
G00200 - SEMI G2 - Specification for Metallic Leadframes for CerDIP Packages
SEMI G2 - Specification for Metallic Leadframes for CerDIP Packages Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
G00200 - SEMI G2 - CERDIPパッケージ用金属リードフレームの仕様
SEMI G2 - CERDIPパッケージ用金属リードフレームの仕様 Sale priceMember Price: ₩135
Non-Member Price: ₩347,000
G00600 - SEMI G6 - 検査方法　封止リング平坦度
SEMI G6 - 検査方法　封止リング平坦度 Sale priceMember Price: ₩135
Non-Member Price: ₩271,000
G04600 - SEMI G46 - Test Method for Thermal Transient Testing for Die Attachment Evaluation of Integrated Circuits
SEMI G46 - Test Method for Thermal Transient Testing for Die Attachment Evaluation of Integrated Circuits Sale priceMember Price: ₩113
Non-Member Price: ₩226,000
G03600 - SEMI G36 - Specification for Dimensions and Tolerances Used to Manufacture Plastic Molded High Density Tab Quad Semiconductor Package Tooling
SEMI G36 - Specification for Dimensions and Tolerances Used to Manufacture Plastic Molded High Density Tab Quad Semiconductor Package Tooling Sale priceMember Price: ₩113
Non-Member Price: ₩226,000
P02000 - SEMI P20 - EBレジストパラメータのカタログ公表のガイドライン（提案）
SEMI P20 - EBレジストパラメータのカタログ公表のガイドライン（提案） Sale priceMember Price: ₩135
Non-Member Price: ₩347,000
P00300 - SEMI P3 - Specification for Photoresist/E-Beam Resist for Hard Surface Photoplates
SEMI P3 - Specification for Photoresist/E-Beam Resist for Hard Surface Photoplates Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
G04400 - SEMI G44 - Specification for Lead Finishes for Glass to Metal Seal Ceramic Packages (Active Devices Only)
SEMI G44 - Specification for Lead Finishes for Glass to Metal Seal Ceramic Packages (Active Devices Only) Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
P01300 - SEMI P13 - 原子吸光分光法によるポジティブフォトレジスト中におけるナトリウムとカリウムの測定
SEMI P13 - 原子吸光分光法によるポジティブフォトレジスト中におけるナトリウムとカリウムの測定 Sale priceMember Price: ₩135
Non-Member Price: ₩347,000
M07600 - SEMI M76 - Specification for Developmental 450 mm Diameter Polished Single Crystal Silicon Wafers
SEMI M76 - Specification for Developmental 450 mm Diameter Polished Single Crystal Silicon Wafers Regular price₩451,000 KRW Sale price₩290,000 KRW
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