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M07000 - SEMI M70 - Test Method for Determining Wafer-Near-Edge Geometry Using Partial Wafer Site Flatness
SEMI M70 - Test Method for Determining Wafer-Near-Edge Geometry Using Partial Wafer Site Flatness Sale priceMember Price: ₩113
Non-Member Price: ₩291,000
G07300 - SEMI G73 - ワイヤボンディングに関するプル強度のための試験方法
SEMI G73 - ワイヤボンディングに関するプル強度のための試験方法 Sale priceMember Price: ₩135
Non-Member Price: ₩348,000
G02900 - SEMI G29 - モールディングコンパウンド中の微量異物検査のための試験方法
SEMI G29 - モールディングコンパウンド中の微量異物検査のための試験方法 Sale priceMember Price: ₩135
Non-Member Price: ₩348,000
M01600 - SEMI M16 - Specification for Polycrystalline Silicon
SEMI M16 - Specification for Polycrystalline Silicon Sale priceMember Price: ₩113
Non-Member Price: ₩291,000
MF115300 - SEMI MF1153 - Test Method for Characterization of Metal-Oxide Silicon (MOS) Structures by Capacitance-Voltage Measurements
SEMI MF1153 - Test Method for Characterization of Metal-Oxide Silicon (MOS) Structures by Capacitance-Voltage Measurements Sale priceMember Price: ₩113
Non-Member Price: ₩291,000
G01100 - SEMI G11 - 熱硬化性モールディングコンパウンドのラムフォロワー装置によるゲル化時間およびスパイラルフローの推奨作業方法
SEMI G11 - 熱硬化性モールディングコンパウンドのラムフォロワー装置によるゲル化時間およびスパイラルフローの推奨作業方法 Sale priceMember Price: ₩135
Non-Member Price: ₩348,000
G02000 - SEMI G20 - Specification for Lead Finishes for Plastic Packages (Active Devices Only)
SEMI G20 - Specification for Lead Finishes for Plastic Packages (Active Devices Only) Sale priceMember Price: ₩113
Non-Member Price: ₩291,000
M08200 - SEMI M82 - Test Method for the Carbon Acceptor Concentration in Semi-Insulating Gallium Arsenide Single Crystals by Infrared Absorption Spectroscopy
SEMI M82 - Test Method for the Carbon Acceptor Concentration in Semi-Insulating Gallium Arsenide Single Crystals by Infrared Absorption Spectroscopy Sale priceMember Price: ₩113
Non-Member Price: ₩291,000
G07100 - SEMI G71 - Specification for Barcode Marking of Intermediate Containers for Packaging Materials
SEMI G71 - Specification for Barcode Marking of Intermediate Containers for Packaging Materials Sale priceMember Price: ₩113
Non-Member Price: ₩291,000
M06300 - SEMI M63 - 化合物半導体エピタキシャルウェーハに使用するサファイア基板の仕様
SEMI M63 - 化合物半導体エピタキシャルウェーハに使用するサファイア基板の仕様 Sale priceMember Price: ₩135
Non-Member Price: ₩348,000
G05200 - SEMI G52 - 半導体リードフレームのイオン汚染物の測定のための標準測定法（提案）
SEMI G52 - 半導体リードフレームのイオン汚染物の測定のための標準測定法（提案） Sale priceMember Price: ₩135
Non-Member Price: ₩348,000
G01500 - SEMI G15 - Standard Test Method for Differential Scanning Calorimetry of Molding Compounds
SEMI G15 - Standard Test Method for Differential Scanning Calorimetry of Molding Compounds Sale priceMember Price: ₩113
Non-Member Price: ₩291,000
G09500 - SEMI G95 - 後工程における450mmウェーハ用テープフレームカセットのためのロードポートの機械的インタフェースの仕様
SEMI G95 - 後工程における450mmウェーハ用テープフレームカセットのためのロードポートの機械的インタフェースの仕様 Sale priceMember Price: ₩135
Non-Member Price: ₩348,000
M06700 - SEMI M67 - Test Method for Determining Wafer Near-Edge Geometry from a Measured Thickness Data Array Using the ESFQR, ESFQD, and ESBIR Metrics
SEMI M67 - Test Method for Determining Wafer Near-Edge Geometry from a Measured Thickness Data Array Using the ESFQR, ESFQD, and ESBIR Metrics Sale priceMember Price: ₩113
Non-Member Price: ₩291,000
G09200 - SEMI G92 - Specification for Tape Frame Cassette for 450 mm Wafer
SEMI G92 - Specification for Tape Frame Cassette for 450 mm Wafer Sale priceMember Price: ₩113
Non-Member Price: ₩291,000
F05400 - SEMI F54 - Test Method for Measuring the Counting Efficiency of Condensation Nucleus Counters
SEMI F54 - Test Method for Measuring the Counting Efficiency of Condensation Nucleus Counters Sale priceMember Price: ₩113
Non-Member Price: ₩291,000
G00400 - SEMI G4 - スタンピングリードフレーム製品で使用されるICリードフレーム材料の仕様
SEMI G4 - スタンピングリードフレーム製品で使用されるICリードフレーム材料の仕様 Sale priceMember Price: ₩135
Non-Member Price: ₩348,000
G01300 - SEMI G13 - Test Method for Thermal Expansion Characteristics of Molding Compounds
SEMI G13 - Test Method for Thermal Expansion Characteristics of Molding Compounds Sale priceMember Price: ₩113
Non-Member Price: ₩291,000
E00500 - SEMI E5 - Specification for SEMI Equipment Communications Standard 2 Message Content (SECS-II)
SEMI E5 - Specification for SEMI Equipment Communications Standard 2 Message Content (SECS-II) Sale price Member Price : ₩225
E08400 - SEMI E84 - Specification for Enhanced Carrier Handoff Parallel I/O Interface
SEMI E84 - Specification for Enhanced Carrier Handoff Parallel I/O Interface Sale priceMember Price: ₩225
Non-Member Price: ₩572,000
E03000 - SEMI E30 - Specification for the Generic Model for Communications and Control of Manufacturing Equipment (GEM)
SEMI E30 - Specification for the Generic Model for Communications and Control of Manufacturing Equipment (GEM) Sale price Member Price : ₩225
E04000 - SEMI E40 - Specification for Processing Management
SEMI E40 - Specification for Processing Management Sale priceMember Price: ₩113
Non-Member Price: ₩291,000
E00400 - SEMI E4 - Specification for SEMI Equipment Communications Standard 1 Message Transfer (SECS-I)
SEMI E4 - Specification for SEMI Equipment Communications Standard 1 Message Transfer (SECS-I) Sale priceMember Price: ₩113
Non-Member Price: ₩291,000
E03700 - SEMI E37 - Specification for High-Speed SECS Message Services (HSMS) Generic Services
SEMI E37 - Specification for High-Speed SECS Message Services (HSMS) Generic Services Sale priceMember Price: ₩225
Non-Member Price: ₩572,000
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