SEMI 3D8 - Guide for Describing Silicon Wafers for Use as 300 mm Carrier Wafers in a 3DS-IC Temporary Bond-Debond (TBDB) Process

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1910 products

G09500 - SEMI G95 - 後工程における450mmウェーハ用テープフレームカセットのためのロードポートの機械的インタフェースの仕様
SEMI G95 - 後工程における450mmウェーハ用テープフレームカセットのためのロードポートの機械的インタフェースの仕様 Sale priceMember Price: ₩135
Non-Member Price: ₩348,000
G07100 - SEMI G71 - Specification for Barcode Marking of Intermediate Containers for Packaging Materials
SEMI G71 - Specification for Barcode Marking of Intermediate Containers for Packaging Materials Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
G01500 - SEMI G15 - Standard Test Method for Differential Scanning Calorimetry of Molding Compounds
SEMI G15 - Standard Test Method for Differential Scanning Calorimetry of Molding Compounds Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
G09200 - SEMI G92 - Specification for Tape Frame Cassette for 450 mm Wafer
SEMI G92 - Specification for Tape Frame Cassette for 450 mm Wafer Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
M06700 - SEMI M67 - Test Method for Determining Wafer Near-Edge Geometry from a Measured Thickness Data Array Using the ESFQR, ESFQD, and ESBIR Metrics
SEMI M67 - Test Method for Determining Wafer Near-Edge Geometry from a Measured Thickness Data Array Using the ESFQR, ESFQD, and ESBIR Metrics Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
F05400 - SEMI F54 - Test Method for Measuring the Counting Efficiency of Condensation Nucleus Counters
SEMI F54 - Test Method for Measuring the Counting Efficiency of Condensation Nucleus Counters Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
G00400 - SEMI G4 - スタンピングリードフレーム製品で使用されるICリードフレーム材料の仕様
SEMI G4 - スタンピングリードフレーム製品で使用されるICリードフレーム材料の仕様 Sale priceMember Price: ₩135
Non-Member Price: ₩348,000
G01300 - SEMI G13 - Test Method for Thermal Expansion Characteristics of Molding Compounds
SEMI G13 - Test Method for Thermal Expansion Characteristics of Molding Compounds Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
E00500 - SEMI E5 - Specification for SEMI Equipment Communications Standard 2 Message Content (SECS-II)
SEMI E5 - Specification for SEMI Equipment Communications Standard 2 Message Content (SECS-II) Sale price Member Price : ₩225
E08400 - SEMI E84 - Specification for Enhanced Carrier Handoff Parallel I/O Interface
SEMI E84 - Specification for Enhanced Carrier Handoff Parallel I/O Interface Sale priceMember Price: ₩225
Non-Member Price: ₩571,000
E03000 - SEMI E30 - Specification for the Generic Model for Communications and Control of Manufacturing Equipment (GEM)
SEMI E30 - Specification for the Generic Model for Communications and Control of Manufacturing Equipment (GEM) Sale price Member Price : ₩225
E01000 - SEMI E10 - Specification for Definition and Measurement of Equipment Reliability, Availability, and Maintainability (RAM) and Utilization
SEMI E10 - Specification for Definition and Measurement of Equipment Reliability, Availability, and Maintainability (RAM) and Utilization Sale priceMember Price: ₩225
Non-Member Price: ₩571,000
E03700 - SEMI E37 - Specification for High-Speed SECS Message Services (HSMS) Generic Services
SEMI E37 - Specification for High-Speed SECS Message Services (HSMS) Generic Services Sale priceMember Price: ₩225
Non-Member Price: ₩571,000
E04000 - SEMI E40 - Specification for Processing Management
SEMI E40 - Specification for Processing Management Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
E00400 - SEMI E4 - Specification for SEMI Equipment Communications Standard 1 Message Transfer (SECS-I)
SEMI E4 - Specification for SEMI Equipment Communications Standard 1 Message Transfer (SECS-I) Sale priceMember Price: ₩113
Non-Member Price: ₩290,000