SEMI 3D8 - Guide for Describing Silicon Wafers for Use as 300 mm Carrier Wafers in a 3DS-IC Temporary Bond-Debond (TBDB) Process

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1910 products

M06600 - SEMI M66 - MISフラットバンド電圧―絶縁膜厚法を使った，酸化膜，およびhigh-κゲートスタックの有効仕事関数の算出方法
SEMI M66 - MISフラットバンド電圧―絶縁膜厚法を使った，酸化膜，およびhigh-κゲートスタックの有効仕事関数の算出方法 Sale priceMember Price: ₩135
Non-Member Price: ₩348,000
M06300 - SEMI M63 - Test Method for Measuring the Al Fraction in AlGaAs on GaAs Substrates by High Resolution X-Ray Diffraction
SEMI M63 - Test Method for Measuring the Al Fraction in AlGaAs on GaAs Substrates by High Resolution X-Ray Diffraction Sale priceMember Price: ₩113
Non-Member Price: ₩291,000
MF145100 - SEMI MF1451 - Test Method for Measuring Sori on Silicon Wafers by Automated Noncontact Scanning
SEMI MF1451 - Test Method for Measuring Sori on Silicon Wafers by Automated Noncontact Scanning Sale priceMember Price: ₩113
Non-Member Price: ₩291,000
MF053300 - SEMI MF533 - Test Method for Thickness and Thickness Variation of Silicon Wafers
SEMI MF533 - Test Method for Thickness and Thickness Variation of Silicon Wafers Sale priceMember Price: ₩113
Non-Member Price: ₩291,000
M01000 - SEMI M10 - Terminology for Identification of Structures and Features Seen on Gallium Arsenide Wafers
SEMI M10 - Terminology for Identification of Structures and Features Seen on Gallium Arsenide Wafers Sale priceMember Price: ₩113
Non-Member Price: ₩291,000
M07700 - SEMI M77 - ロールオフ量（ROA）を使ってウェーハのエッジ近傍形状を決定するための作業方法
SEMI M77 - ロールオフ量（ROA）を使ってウェーハのエッジ近傍形状を決定するための作業方法 Sale priceMember Price: ₩135
Non-Member Price: ₩348,000
G06000 - SEMI G60 - Test Method for the Measurement of Electrostatic Properties of Semiconductor Leadframe Interleafing Materials
SEMI G60 - Test Method for the Measurement of Electrostatic Properties of Semiconductor Leadframe Interleafing Materials Sale priceMember Price: ₩113
Non-Member Price: ₩291,000
G06200 - SEMI G62 - Test Method for Silver Plating Quality
SEMI G62 - Test Method for Silver Plating Quality Sale priceMember Price: ₩113
Non-Member Price: ₩291,000
F06300 - SEMI F63 - Guide for Ultrapure Water Used in Semiconductor Processing
SEMI F63 - Guide for Ultrapure Water Used in Semiconductor Processing Sale priceMember Price: ₩252
Non-Member Price: ₩571,000
M04100 - SEMI M41 - Specification of Silicon-on-Insulator (SOI) for Power Device/ICs
SEMI M41 - Specification of Silicon-on-Insulator (SOI) for Power Device/ICs Sale priceMember Price: ₩113
Non-Member Price: ₩291,000
M05800 - SEMI M58 - Test Method for Evaluating DMA Based Particle Deposition Systems and Processes
SEMI M58 - Test Method for Evaluating DMA Based Particle Deposition Systems and Processes Sale priceMember Price: ₩113
Non-Member Price: ₩291,000
M08100 - SEMI M81 - Guide to Defects Found in Monocrystalline Silicon Carbide Substrates
SEMI M81 - Guide to Defects Found in Monocrystalline Silicon Carbide Substrates Sale priceMember Price: ₩113
Non-Member Price: ₩291,000
MF104900 - SEMI MF1049 - Practice for Shallow Etch Pit Detection on Silicon Wafers
SEMI MF1049 - Practice for Shallow Etch Pit Detection on Silicon Wafers Sale priceMember Price: ₩113
Non-Member Price: ₩291,000
G01300 - SEMI G13 - モールディングコンパウンドの膨張特性の標準試験方法
SEMI G13 - モールディングコンパウンドの膨張特性の標準試験方法 Sale priceMember Price: ₩135
Non-Member Price: ₩348,000
G00400 - SEMI G4 - Specification for Integrated Circuit Leadframe Materials Used in the Production of Stamped Leadframes
SEMI G4 - Specification for Integrated Circuit Leadframe Materials Used in the Production of Stamped Leadframes Sale priceMember Price: ₩113
Non-Member Price: ₩291,000