SEMI 3D8 - Guide for Describing Silicon Wafers for Use as 300 mm Carri – Page 81

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M05200 - SEMI M52 - Guide for Specifying Scanning Surface Inspection Systems for Silicon Wafers for the 130 nm to 5 nm Technology Generations

SEMI M52 - Guide for Specifying Scanning Surface Inspection Systems for Silicon Wafers for the 130 nm to 5 nm Technology Generations

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G08800 - SEMI G88 - Specification for Tape Frame for 450 mm Wafer

SEMI G88 - Specification for Tape Frame for 450 mm Wafer

Member Price: ₩113
Non-Member Price: ₩291,000

F02400 - SEMI F24 - Specification for Particle Concentration of Grade 10/0.2 Inert Specialty Gases

SEMI F24 - Specification for Particle Concentration of Grade 10/0.2 Inert Specialty Gases

Member Price: ₩113
Non-Member Price: ₩291,000

G09300 - SEMI G93 - Measurement Method for Solder Sphere Size for Ball Grid Array Package

SEMI G93 - Measurement Method for Solder Sphere Size for Ball Grid Array Package

Member Price: ₩113
Non-Member Price: ₩291,000

G04200 - SEMI G42 - Specification for Thermal Test Board Standardization for Measuring Junction-to-Ambient Thermal Resistance of Semiconductor Packages

SEMI G42 - Specification for Thermal Test Board Standardization for Measuring Junction-to-Ambient Thermal Resistance of Semiconductor Packages

Member Price: ₩113
Non-Member Price: ₩291,000

G09000 - SEMI G90 - Specification for 300 mm Wafer Coin-Stack Type Shipping Container Used for Test and Packaging Processes

SEMI G90 - Specification for 300 mm Wafer Coin-Stack Type Shipping Container Used for Test and Packaging Processes

Member Price: ₩113
Non-Member Price: ₩291,000

G06400 - SEMI G64 - Specification for Full-Plated Integrated Circuit Leadframes (Au, Ag, Cu, Ni, Pd/Ni, Pd)

SEMI G64 - Specification for Full-Plated Integrated Circuit Leadframes (Au, Ag, Cu, Ni, Pd/Ni, Pd)

Member Price: ₩113
Non-Member Price: ₩291,000

MF181000 - SEMI MF1810 - Test Method for Counting Preferentially Etched or Decorated Surface Defects in Silicon Wafers

SEMI MF1810 - Test Method for Counting Preferentially Etched or Decorated Surface Defects in Silicon Wafers

Member Price: ₩113
Non-Member Price: ₩291,000

G06500 - SEMI G65 - Test Method for Evaluation of Leadframe Materials Used for L-Leaded (Gull Wing Type) Packages

SEMI G65 - Test Method for Evaluation of Leadframe Materials Used for L-Leaded (Gull Wing Type) Packages

Member Price: ₩113
Non-Member Price: ₩291,000

F11000 - SEMI F110 - Test Method for Mono-Dispersed Polystyrene Latex (PSL) Challenge of Liquid Filters

SEMI F110 - Test Method for Mono-Dispersed Polystyrene Latex (PSL) Challenge of Liquid Filters

Member Price: ₩113
Non-Member Price: ₩291,000

MF004300 - SEMI MF43 - Test Method for Resistivity of Semiconductor Materials

SEMI MF43 - Test Method for Resistivity of Semiconductor Materials

Member Price: ₩113
Non-Member Price: ₩291,000

MF084700 - SEMI MF847 - Test Method for Measuring Crystallographic Orientation of Flats on Single Crystal Silicon Wafers by X-Ray Techniques

SEMI MF847 - Test Method for Measuring Crystallographic Orientation of Flats on Single Crystal Silicon Wafers by X-Ray Techniques

Member Price: ₩113
Non-Member Price: ₩291,000

G04300 - SEMI G43 - プラスチックモールドパッケージのジャンクション部とケース間の熱抵抗のための試験方法

SEMI G43 - プラスチックモールドパッケージのジャンクション部とケース間の熱抵抗のための試験方法

Member Price: ₩135
Non-Member Price: ₩348,000

M08000 - SEMI M80 - Specification for Front-Opening Shipping Box Used to Transport and Ship 450 mm Wafers

SEMI M80 - Specification for Front-Opening Shipping Box Used to Transport and Ship 450 mm Wafers

Member Price: ₩113
Non-Member Price: ₩291,000

HB00900 - SEMI HB9 - Test Method and Acceptance Criteria for Visual Inspection of Surface Defects of GaN Epitaxial Wafers Used for Manufacturing HB-LED

SEMI HB9 - Test Method and Acceptance Criteria for Visual Inspection of Surface Defects of GaN Epitaxial Wafers Used for Manufacturing HB-LED

Member Price: ₩113
Non-Member Price: ₩291,000