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1222 products

MF153500 - SEMI MF1535 - Test Method for Carrier Recombination Lifetime in Electronic-Grade Silicon Wafers by Noncontact Measurement of Photoconductivity Decay by Microwave Reflectance
SEMI MF1535 - Test Method for Carrier Recombination Lifetime in Electronic-Grade Silicon Wafers by Noncontact Measurement of Photoconductivity Decay by Microwave Reflectance Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
F03400 - SEMI F34 - Guide for Liquid Chemical Pipe Labeling
SEMI F34 - Guide for Liquid Chemical Pipe Labeling Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
M01200 - SEMI M12 - Specification for Serial Alphanumeric Marking of Silicon Wafers
SEMI M12 - Specification for Serial Alphanumeric Marking of Silicon Wafers Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
MF008400 - SEMI MF84 - Test Method for Measuring Resistivity of Silicon Wafers With an In-Line Four-Point Probe
SEMI MF84 - Test Method for Measuring Resistivity of Silicon Wafers With an In-Line Four-Point Probe Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
G01100 - SEMI G11 - Practice for RAM Follower Gel Time and Spiral Flow of Thermal Setting Molding Compounds
SEMI G11 - Practice for RAM Follower Gel Time and Spiral Flow of Thermal Setting Molding Compounds Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
F05100 - SEMI F51 - Guide for Elastometric Sealing Technology
SEMI F51 - Guide for Elastometric Sealing Technology Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
M08800 - SEMI M88 - Practice for Sample Preparation Methods for Measuring Minority Carrier Diffusion Length in Silicon Wafers by Surface Photovoltage Methods
SEMI M88 - Practice for Sample Preparation Methods for Measuring Minority Carrier Diffusion Length in Silicon Wafers by Surface Photovoltage Methods Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
M03100 - SEMI M31 - Specification for Mechanical Features of Front-Opening Shipping Box Used to Transport and Ship 300 mm Wafers
SEMI M31 - Specification for Mechanical Features of Front-Opening Shipping Box Used to Transport and Ship 300 mm Wafers Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
F04500 - SEMI F45 - Specification for Machined Stainless Steel Reducing Weld Fittings
SEMI F45 - Specification for Machined Stainless Steel Reducing Weld Fittings Sale price Member Price : ₩113
M04000 - SEMI M40 - Guide for Measurement of Roughness of Planar Surfaces on Polished Wafers
SEMI M40 - Guide for Measurement of Roughness of Planar Surfaces on Polished Wafers Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
MF002800 - SEMI MF28 - Test Method for Minority Carrier Lifetime in Bulk Germanium and Silicon by Measurement of Photoconductivity Decay
SEMI MF28 - Test Method for Minority Carrier Lifetime in Bulk Germanium and Silicon by Measurement of Photoconductivity Decay Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
G01000 - SEMI G10 - プラスチックパッケージリードフレームの機械的標準測定方法
SEMI G10 - プラスチックパッケージリードフレームの機械的標準測定方法 Sale priceMember Price: ₩135
Non-Member Price: ₩347,000
M05000 - SEMI M50 - Test Method for Determining Capture Rate and False Count Rate for Surface Scanning Inspection Systems by the Overlay Method
SEMI M50 - Test Method for Determining Capture Rate and False Count Rate for Surface Scanning Inspection Systems by the Overlay Method Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
G03100 - SEMI G31 - Test Method for Determining the Abrasive Characteristics of Molding Compounds
SEMI G31 - Test Method for Determining the Abrasive Characteristics of Molding Compounds Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
E01000 - SEMI E10 - Specification for Definition and Measurement of Equipment Reliability, Availability, and Maintainability (RAM) and Utilization
SEMI E10 - Specification for Definition and Measurement of Equipment Reliability, Availability, and Maintainability (RAM) and Utilization Sale priceMember Price: ₩225
Non-Member Price: ₩571,000
E03700 - SEMI E37 - Specification for High-Speed SECS Message Services (HSMS) Generic Services
SEMI E37 - Specification for High-Speed SECS Message Services (HSMS) Generic Services Sale priceMember Price: ₩225
Non-Member Price: ₩571,000
E04000 - SEMI E40 - Specification for Processing Management
SEMI E40 - Specification for Processing Management Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
E00400 - SEMI E4 - Specification for SEMI Equipment Communications Standard 1 Message Transfer (SECS-I)
SEMI E4 - Specification for SEMI Equipment Communications Standard 1 Message Transfer (SECS-I) Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
G09700 - SEMI G97 - Specification for Adhesive Tray Used for Thin Chip Handling
SEMI G97 - Specification for Adhesive Tray Used for Thin Chip Handling Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
E03900 - SEMI E39 - Specification for Object Services: Concepts, Behavior, and Services
SEMI E39 - Specification for Object Services: Concepts, Behavior, and Services Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
F10500 - SEMI F105 - Guide for Metallic Material Compatibility in Gas Distribution Systems
SEMI F105 - Guide for Metallic Material Compatibility in Gas Distribution Systems Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
MF136600 - SEMI MF1366 - Test Method for Measuring Oxygen Concentration in Heavily Doped Silicon Substrates by Secondary Ion Mass Spectrometry
SEMI MF1366 - Test Method for Measuring Oxygen Concentration in Heavily Doped Silicon Substrates by Secondary Ion Mass Spectrometry Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
M07000 - SEMI M70 - Test Method for Determining Wafer-Near-Edge Geometry Using Partial Wafer Site Flatness
SEMI M70 - Test Method for Determining Wafer-Near-Edge Geometry Using Partial Wafer Site Flatness Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
E00500 - SEMI E5 - 半導体製造装置通信スタンダード2 メッセージ内容（SECS-II）
SEMI E5 - 半導体製造装置通信スタンダード2 メッセージ内容（SECS-II） Sale priceMember Price: ₩135
Non-Member Price: ₩686,000
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