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1910 products

Global Semiconductor Packaging Materials Outlook 2020 to 2024 - SEMI Dev 2
Global Semiconductor Packaging Materials Outlook 2020 to 2024 Sale priceMember Price: ₩7,000
Non-Member Price: ₩15,400,000
Global Smart MedTech Symposium July (ON DEMAND) 2021
Global Smart MedTech Symposium July (ON DEMAND) 2021 Sale priceMember Price: ₩199
Non-Member Price: ₩330,000
HB00100 - SEMI HB1 - Specification for Sapphire Wafers Intended for Use for Manufacturing High Brightness-Light Emitting Diode Devices
SEMI HB1 - Specification for Sapphire Wafers Intended for Use for Manufacturing High Brightness-Light Emitting Diode Devices Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
HB00200 - SEMI HB2 - Specification for 150 mm Open Plastic and Metal Wafer Cassettes Intended for Use for Manufacturing HB-LED Devices
SEMI HB2 - Specification for 150 mm Open Plastic and Metal Wafer Cassettes Intended for Use for Manufacturing HB-LED Devices Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
HB00300 - SEMI HB3 - Specification for the Mechanical Interface for 150 mm HB-LED Load Port
SEMI HB3 - Specification for the Mechanical Interface for 150 mm HB-LED Load Port Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
HB00400 - SEMI HB4 - Specification of Communication Interfaces for High Brightness LED Manufacturing Equipment (HB-LED ECI)
SEMI HB4 - Specification of Communication Interfaces for High Brightness LED Manufacturing Equipment (HB-LED ECI) Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
HB00500 - SEMI HB5 - Test Method for Measurement of Saw Marks on Crystalline Sapphire Wafers by Using Optical Probes
SEMI HB5 - Test Method for Measurement of Saw Marks on Crystalline Sapphire Wafers by Using Optical Probes Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
HB00600 - SEMI HB6 - Test Method for Measurement of Thickness and Shape of Crystalline Sapphire Wafers by Using Optical Probes
SEMI HB6 - Test Method for Measurement of Thickness and Shape of Crystalline Sapphire Wafers by Using Optical Probes Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
HB00700 - SEMI HB7 - Test Method for Measurement of Waviness of Crystalline Sapphire Wafers by Using Optical Probes
SEMI HB7 - Test Method for Measurement of Waviness of Crystalline Sapphire Wafers by Using Optical Probes Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
HB00800 - SEMI HB8 - Test Method for Determining Orientation of a Sapphire Single Crystal
SEMI HB8 - Test Method for Determining Orientation of a Sapphire Single Crystal Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
HB00900 - SEMI HB9 - Test Method and Acceptance Criteria for Visual Inspection of Surface Defects of GaN Epitaxial Wafers Used for Manufacturing HB-LED
SEMI HB9 - Test Method and Acceptance Criteria for Visual Inspection of Surface Defects of GaN Epitaxial Wafers Used for Manufacturing HB-LED Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
HB01000 - SEMI HB10 - Specification for Single Crystal Sapphire Intended for Use for Manufacturing HB-LED Wafers
SEMI HB10 - Specification for Single Crystal Sapphire Intended for Use for Manufacturing HB-LED Wafers Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
HB01100 - SEMI HB11 - Specification for Sapphire Single Crystal Ingot Intended for Use for Manufacturing HB-LED Wafers
SEMI HB11 - Specification for Sapphire Single Crystal Ingot Intended for Use for Manufacturing HB-LED Wafers Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
HB01200 - SEMI HB12 - Specification for Dry-Etched Patterned Sapphire Substrates (DPSS)
SEMI HB12 - Specification for Dry-Etched Patterned Sapphire Substrates (DPSS) Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
HB01300 - SEMI HB13 - Specification of Susceptors for HB-LED MOCVD Equipment Communication Interface
SEMI HB13 - Specification of Susceptors for HB-LED MOCVD Equipment Communication Interface Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
HB01400 - SEMI HB14 - Test Method for Determining Geometrical Parameters of Patterns on Patterned Sapphire Substrate
SEMI HB14 - Test Method for Determining Geometrical Parameters of Patterns on Patterned Sapphire Substrate Sale priceMember Price:
Non-Member Price: ₩290,000
Historical 200mm Fab Report (2011-2022)
Historical 200mm Fab Report (20112022) Sale priceMember Price:
Non-Member Price: ₩7,287,000
Historical 300mm Fab Report (2011-2022)
Historical 300mm Fab Report (20112022) Sale priceMember Price:
Non-Member Price: ₩9,391,000
Historical Book-to-Bill Report (1991-2016) and Billings Report (1991-2025)
Historical Book-to-Bill Report (1991-2016) and Billings Report (19912025) Sale priceMember Price: ₩1,150
Non-Member Price: ₩3,757,000
Historical Silicon Wafer shipment (MSI) Report (1995-2020)
Historical Silicon Wafer shipment (MSI) Report (19952020) Sale priceMember Price:
Non-Member Price: ₩1,954,000
Historical World Fab Report (2012 - 2023)
Historical World Fab Report (2012 2023) Sale priceMember Price:
Non-Member Price: ₩23,138,000
Historical Worldwide Semiconductor Equipment Market Statistics (WWSEMS) Report (1991-2025)
Historical Worldwide Semiconductor Equipment Market Statistics (WWSEMS) Report (19912025) Sale priceMember Price: ₩2,500
Non-Member Price: ₩6,160,000
IC Market Overview
IC Market Overview Sale priceMember Price:
Non-Member Price: ₩224,000
IC Packaging - Beginner Level Certification
IC Packaging Beginner Level Certification Sale priceMember Price:
Non-Member Price: ₩450,000