SEMI 3D8 - Guide for Describing Silicon Wafers for Use as 300 mm Carrier Wafers in a 3DS-IC Temporary Bond-Debond (TBDB) Process

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1910 products

HB00700 - SEMI HB7 - Test Method for Measurement of Waviness of Crystalline Sapphire Wafers by Using Optical Probes
SEMI HB7 - Test Method for Measurement of Waviness of Crystalline Sapphire Wafers by Using Optical Probes Sale priceMember Price: ¥113
Non-Member Price: ¥31,900
M05600 - SEMI M56 - Practice for Determining Cost Components for Metrology Equipment Due to Measurement Variability and Bias
SEMI M56 - Practice for Determining Cost Components for Metrology Equipment Due to Measurement Variability and Bias Sale priceMember Price: ¥113
Non-Member Price: ¥31,900
G03100 - SEMI G31 - Test Method for Determining the Abrasive Characteristics of Molding Compounds
SEMI G31 - Test Method for Determining the Abrasive Characteristics of Molding Compounds Sale priceMember Price: ¥113
Non-Member Price: ¥31,900
MF213900 - SEMI MF2139 - Test Method for Measuring Nitrogen Concentration in Silicon Substrates by Secondary Ion Mass Spectrometry
SEMI MF2139 - Test Method for Measuring Nitrogen Concentration in Silicon Substrates by Secondary Ion Mass Spectrometry Sale priceMember Price: ¥113
Non-Member Price: ¥31,900
F02200 - SEMI F22 - Guide for Bulk and Specialty Gas Distribution Systems
SEMI F22 - Guide for Bulk and Specialty Gas Distribution Systems Sale priceMember Price: ¥113
Non-Member Price: ¥31,900
G08700 - SEMI G87 - Specification for Plastic Tape Frame for 300 mm Wafer
SEMI G87 - Specification for Plastic Tape Frame for 300 mm Wafer Sale priceMember Price: ¥113
Non-Member Price: ¥31,900
G07500 - SEMI G75 - Standard Test Method of the Properties of Leadframe Tape
SEMI G75 - Standard Test Method of the Properties of Leadframe Tape Sale priceMember Price: ¥113
Non-Member Price: ¥31,900
G05700 - SEMI G57 - Guide for Standardization of Leadframe Terminology
SEMI G57 - Guide for Standardization of Leadframe Terminology Sale priceMember Price: ¥113
Non-Member Price: ¥31,900
G05200 - SEMI G52 - Test Method for Measurement of Ionic Contamination on Semiconductor Leadframes
SEMI G52 - Test Method for Measurement of Ionic Contamination on Semiconductor Leadframes Sale priceMember Price: ¥113
Non-Member Price: ¥31,900
G07300 - SEMI G73 - Test Method for Pull Strength for Wire Bonding
SEMI G73 - Test Method for Pull Strength for Wire Bonding Sale priceMember Price: ¥113
Non-Member Price: ¥31,900
G05900 - SEMI G59 - Test Method for Measurement of Ionic Contamination on Leadframe Interleafing and the Contamination Transferred from the Interleafing to the Leadframes
SEMI G59 - Test Method for Measurement of Ionic Contamination on Leadframe Interleafing and the Contamination Transferred from the Interleafing to the Leadframes Sale priceMember Price: ¥113
Non-Member Price: ¥31,900
HB00300 - SEMI HB3 - Specification for the Mechanical Interface for 150 mm HB-LED Load Port
SEMI HB3 - Specification for the Mechanical Interface for 150 mm HB-LED Load Port Sale priceMember Price: ¥113
Non-Member Price: ¥31,900
M07000 - SEMI M70 - パーシャルサイト平坦度を使ってウェーハのエッジ近傍形状を決定するための作業方法
SEMI M70 - パーシャルサイト平坦度を使ってウェーハのエッジ近傍形状を決定するための作業方法 Sale priceMember Price: ¥135
Non-Member Price: ¥38,100
F02600 - SEMI F26 - Specification for Particle Concentration of Grade 10/0.2 Toxic Specialty Gases
SEMI F26 - Specification for Particle Concentration of Grade 10/0.2 Toxic Specialty Gases Sale priceMember Price: ¥113
Non-Member Price: ¥31,900
HB00200 - SEMI HB2 - Specification for 150 mm Open Plastic and Metal Wafer Cassettes Intended for Use for Manufacturing HB-LED Devices
SEMI HB2 - Specification for 150 mm Open Plastic and Metal Wafer Cassettes Intended for Use for Manufacturing HB-LED Devices Sale priceMember Price: ¥113
Non-Member Price: ¥31,900