SEMI 3D8 - Guide for Describing Silicon Wafers for Use as 300 mm Carrier Wafers in a 3DS-IC Temporary Bond-Debond (TBDB) Process

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1910 products

G08600 - SEMI G86 - Test Method for Measurement of Chip (Die) Strength by Mean of 3-Point Bending
SEMI G86 - Test Method for Measurement of Chip (Die) Strength by Mean of 3-Point Bending Sale priceMember Price: ¥113
Non-Member Price: ¥31,900
MF180900 - SEMI MF1809 - Guide for Selection and Use of Etching Solutions to Delineate Structural Defects in Silicon
SEMI MF1809 - Guide for Selection and Use of Etching Solutions to Delineate Structural Defects in Silicon Sale priceMember Price: ¥113
Non-Member Price: ¥31,900
M05400 - SEMI M54 - 半絶縁性（SI）GaAs材料のパラメータのガイド
SEMI M54 - 半絶縁性（SI）GaAs材料のパラメータのガイド Sale priceMember Price: ¥135
Non-Member Price: ¥38,100
G05500 - SEMI G55 - Test Method for Measurement of Silver Plating Brightness
SEMI G55 - Test Method for Measurement of Silver Plating Brightness Sale priceMember Price: ¥113
Non-Member Price: ¥31,900
M04000 - SEMI M40 - Guide for Measurement of Roughness of Planar Surfaces on Polished Wafers
SEMI M40 - Guide for Measurement of Roughness of Planar Surfaces on Polished Wafers Sale priceMember Price: ¥113
Non-Member Price: ¥31,900
MF002800 - SEMI MF28 - Test Method for Minority Carrier Lifetime in Bulk Germanium and Silicon by Measurement of Photoconductivity Decay
SEMI MF28 - Test Method for Minority Carrier Lifetime in Bulk Germanium and Silicon by Measurement of Photoconductivity Decay Sale priceMember Price: ¥113
Non-Member Price: ¥31,900
G01000 - SEMI G10 - プラスチックパッケージリードフレームの機械的標準測定方法
SEMI G10 - プラスチックパッケージリードフレームの機械的標準測定方法 Sale priceMember Price: ¥135
Non-Member Price: ¥38,100
M01600 - SEMI M16 - 多結晶シリコンの仕様
SEMI M16 - 多結晶シリコンの仕様 Sale priceMember Price: ¥135
Non-Member Price: ¥38,100
G06300 - SEMI G63 - ダイ剪断強度の測定方法
SEMI G63 - ダイ剪断強度の測定方法 Sale priceMember Price: ¥135
Non-Member Price: ¥38,100
M04100 - SEMI M41 - 電源デバイス／IC用シリコン・オン・インシュレーター（SOI）の仕様
SEMI M41 - 電源デバイス／IC用シリコン・オン・インシュレーター（SOI）の仕様 Sale priceMember Price: ¥135
Non-Member Price: ¥38,100
HB00100 - SEMI HB1 - Specification for Sapphire Wafers Intended for Use for Manufacturing High Brightness-Light Emitting Diode Devices
SEMI HB1 - Specification for Sapphire Wafers Intended for Use for Manufacturing High Brightness-Light Emitting Diode Devices Sale priceMember Price: ¥113
Non-Member Price: ¥31,900
M05000 - SEMI M50 - Test Method for Determining Capture Rate and False Count Rate for Surface Scanning Inspection Systems by the Overlay Method
SEMI M50 - Test Method for Determining Capture Rate and False Count Rate for Surface Scanning Inspection Systems by the Overlay Method Sale priceMember Price: ¥113
Non-Member Price: ¥31,900
HB00500 - SEMI HB5 - Test Method for Measurement of Saw Marks on Crystalline Sapphire Wafers by Using Optical Probes
SEMI HB5 - Test Method for Measurement of Saw Marks on Crystalline Sapphire Wafers by Using Optical Probes Sale priceMember Price: ¥113
Non-Member Price: ¥31,900
G04900 - SEMI G49 - Specification for Plastic Molding Preforms
SEMI G49 - Specification for Plastic Molding Preforms Sale priceMember Price: ¥113
Non-Member Price: ¥31,900
G08100 - SEMI G81 - Specification for Map Data Items
SEMI G81 - Specification for Map Data Items Sale priceMember Price: ¥113
Non-Member Price: ¥31,900