SEMI 3D8 - Guide for Describing Silicon Wafers for Use as 300 mm Carrier Wafers in a 3DS-IC Temporary Bond-Debond (TBDB) Process

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1910 products

F11700 - SEMI F117 - Specification for Dimensions of Sandwich Components for 1.125 Inch Type Surface Mount Gas Distribution Systems
SEMI F117 - Specification for Dimensions of Sandwich Components for 1.125 Inch Type Surface Mount Gas Distribution Systems Sale priceMember Price: ¥113
Non-Member Price: ¥31,900
MS01200 - SEMI MS12 - Specification for Silicon Substrates Used in Fabrication of MEMS Devices
SEMI MS12 - Specification for Silicon Substrates Used in Fabrication of MEMS Devices Sale priceMember Price: ¥113
Non-Member Price: ¥31,900
G00900 - SEMI G9 - Specification for Stamped Leadframes for Plastic Molded Dual-in-Line Semiconductor Packages
SEMI G9 - Specification for Stamped Leadframes for Plastic Molded Dual-in-Line Semiconductor Packages Regular price¥49,500 JPY Sale price¥31,900 JPY
G07200 - SEMI G72 - ボールグリッドアレイ設計ライブラリのための仕様
SEMI G72 - ボールグリッドアレイ設計ライブラリのための仕様 Sale priceMember Price: ¥135
Non-Member Price: ¥29,700
G05800 - SEMI G58 - CERQUADパッケージ構造の仕様
SEMI G58 - CERQUADパッケージ構造の仕様 Sale priceMember Price: ¥135
Non-Member Price: ¥29,700
G03200 - SEMI G32 - カプセルなし熱抵抗測定用チップのガイドライン
SEMI G32 - カプセルなし熱抵抗測定用チップのガイドライン Sale priceMember Price: ¥135
Non-Member Price: ¥29,700
M08900 - SEMI M89 - Test Method for Recombination Lifetime of the Epilayer of the Silicon Epitaxial Wafer (p/p+, n/n+) by the Short Wavelength Excitation Microwave Photoconductive Decay Method
SEMI M89 - Test Method for Recombination Lifetime of the Epilayer of the Silicon Epitaxial Wafer (p/p+, n/n+) by the Short Wavelength Excitation Microwave Photoconductive Decay Method Sale priceMember Price: ¥113
Non-Member Price: ¥31,900
PV09200 - SEMI PV92 - Test Method for Extension of Flexible Thin Film Photovoltaic (PV) Modules
SEMI PV92 - Test Method for Extension of Flexible Thin Film Photovoltaic (PV) Modules Sale priceMember Price: ¥113
Non-Member Price: ¥31,900
G00600 - SEMI G6 - Test Method for Seal Ring Flatness
SEMI G6 - Test Method for Seal Ring Flatness Sale priceMember Price: ¥113
Non-Member Price: ¥31,900
E04400 - SEMI E44 - Guide for Procurment and Acceptance of Minienvironments
SEMI E44 - Guide for Procurment and Acceptance of Minienvironments Sale priceMember Price: ¥113
Non-Member Price: ¥31,900
G05400 - SEMI G54 - Specification for Dimensions and Tolerances Used to Manufacture Molded Plastic Packages
SEMI G54 - Specification for Dimensions and Tolerances Used to Manufacture Molded Plastic Packages Sale priceMember Price: ¥113
Non-Member Price: ¥24,800
3D02200 - SEMI 3D23 - Specification for Glass Carrier Characteristics for Panel Level Packaging (PLP) Applications
SEMI 3D23 - Specification for Glass Carrier Characteristics for Panel Level Packaging (PLP) Applications Sale priceMember Price: ¥113
Non-Member Price: ¥31,900
E17900 - SEMI E179 - Specification for Protocol Buffers Common Components
SEMI E179 - Specification for Protocol Buffers Common Components Sale price Member Price : ¥113
Flex Electronics Webinar Master Class: September 2021 (On Demand)
Flex Electronics Webinar Master Class: September 2021 (On Demand) Sale priceMember Price: ¥49
Non-Member Price: ¥16,400
PV08800 - SEMI PV88 - 惰性气体熔融红外吸收法测定光伏多晶硅中氢含量的测试方法
SEMI PV88 - 惰性气体熔融红外吸收法测定光伏多晶硅中氢含量的测试方法 Sale priceMember Price: ¥113
Non-Member Price: ¥24,800