SEMI 3D8 - Guide for Describing Silicon Wafers for Use as 300 mm Carrier Wafers in a 3DS-IC Temporary Bond-Debond (TBDB) Process

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E13700 - SEMI E137 - 半导体制造设备总装、包装、运输、拆箱和搬运指南
SEMI E137 - 半导体制造设备总装、包装、运输、拆箱和搬运指南 Sale priceMember Price: ¥113
Non-Member Price: ¥31,900
F00200 - SEMI F2 - Specification for 316L Stainless Steel Tubing for General Purpose Semiconductor Manufacturing Applications
SEMI F2 - Specification for 316L Stainless Steel Tubing for General Purpose Semiconductor Manufacturing Applications Sale priceMember Price: ¥113
Non-Member Price: ¥31,900
E18000 - SEMI E180 - 通过ICP-MS测量半导体晶圆加工过程中关键腔室部件表面金属污染的试验方法
SEMI E180 - 通过ICP-MS测量半导体晶圆加工过程中关键腔室部件表面金属污染的试验方法 Sale priceMember Price: ¥113
Non-Member Price: ¥31,900
Semiconductor Fabrication Worker Safety Part 2
Semiconductor Fabrication Worker Safety Part 2 Sale priceMember Price: ¥30
Non-Member Price: ¥7,200
T01600 - SEMI T16-0310 (Reapproved 0322) - Specification for Use of Data Matrix Symbology for Automated Identification of Extreme Ultraviolet Lithography Masks
SEMI T16-0310 (Reapproved 0322) - Specification for Use of Data Matrix Symbology for Automated Identification of Extreme Ultraviolet Lithography Masks Sale priceMember Price: ¥113
Non-Member Price: ¥24,800
F02000 - SEMI F20 - 用于通用、高纯和超高纯半导体制造组件的316L不锈钢棒材、锻材、挤压型材、板材和管材的规范
SEMI F20 - 用于通用、高纯和超高纯半导体制造组件的316L不锈钢棒材、锻材、挤压型材、板材和管材的规范 Sale priceMember Price: ¥225
Non-Member Price: ¥62,700
F00300 - SEMI F3 - Guide for Welding Stainless Steel Tubing for Semiconductor Manufacturing Applications
SEMI F3 - Guide for Welding Stainless Steel Tubing for Semiconductor Manufacturing Applications Sale priceMember Price: ¥113
Non-Member Price: ¥31,900
M09100 - SEMI M91 - Test Method for Determination of Threading Screw Dislocation Density in 4H-SIC by X-Ray Topography
SEMI M91 - Test Method for Determination of Threading Screw Dislocation Density in 4H-SIC by X-Ray Topography Sale priceMember Price: ¥113
Non-Member Price: ¥31,900
Test Webinar
Test Webinar Sale priceMember Price: ¥0
Non-Member Price: ¥0
E18800 - SEMI E188 - Specification for Malware Free Equipment Integration
SEMI E188 - Specification for Malware Free Equipment Integration Sale priceMember Price: ¥113
Non-Member Price: ¥62,700
300mm Fab Outlook - Subscription
300mm Fab Outlook Subscription Sale priceMember Price: ¥8,000
Non-Member Price: ¥2,374,900
C10400 - SEMI C104 - Guide for Reporting Performance Parameters of the Polymer Windows for Chemical Mechanical Planarization (CMP) Pads Used in Semiconductor Manufacturing
SEMI C104 - Guide for Reporting Performance Parameters of the Polymer Windows for Chemical Mechanical Planarization (CMP) Pads Used in Semiconductor Manufacturing Sale priceMember Price: ¥113
Non-Member Price: ¥31,900
MS01400 - SEMI MS14 - Guide for Critical Parameters of Gas Sensors
SEMI MS14 - Guide for Critical Parameters of Gas Sensors Sale priceMember Price: ¥113
Non-Member Price: ¥31,900
T00700 - SEMI T7 - 二次元マトリクスコードシンボルの両面研磨ウェーハ裏面マーキングの仕様
SEMI T7 - 二次元マトリクスコードシンボルの両面研磨ウェーハ裏面マーキングの仕様 Sale priceMember Price: ¥135
Non-Member Price: ¥38,100
F11800 - SEMI F118 - Test Method for Determination of Moisture Dry-Down Characteristics of Gas Delivery Components
SEMI F118 - Test Method for Determination of Moisture Dry-Down Characteristics of Gas Delivery Components Sale priceMember Price: ¥113
Non-Member Price: ¥31,900