SEMI 3D14 - Guide for Incoming/Outgoing Quality control and Testing Flow for 3DS-IC Products

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MF172700 - SEMI MF1727 - Practice for Detection of Oxidation Induced Defects in Polished Silicon Wafers
MF153500 - SEMI MF1535 - Test Method for Carrier Recombination Lifetime in Electronic-Grade Silicon Wafers by Noncontact Measurement of Photoconductivity Decay by Microwave Reflectance
MF152700 - SEMI MF1527 - Guide for Application of Certified Reference Materials and Reference Wafers for Calibration and Control of Instruments for Measuring Resistivity of Silicon
F03400 - SEMI F34 - Guide for Liquid Chemical Pipe Labeling
SEMI F34 - Guide for Liquid Chemical Pipe Labeling Sale priceMember Price: $113.00
Non-Member Price: $193.00
M04200 - SEMI M42 - Specification for Compound Semiconductor Epitaxial Wafers
SEMI M42 - Specification for Compound Semiconductor Epitaxial Wafers Sale priceMember Price: $113.00
Non-Member Price: $193.00
M01200 - SEMI M12 - Specification for Serial Alphanumeric Marking of Silicon Wafers
SEMI M12 - Specification for Serial Alphanumeric Marking of Silicon Wafers Sale priceMember Price: $113.00
Non-Member Price: $193.00
MF008400 - SEMI MF84 - Test Method for Measuring Resistivity of Silicon Wafers With an In-Line Four-Point Probe
G01100 - SEMI G11 - Practice for RAM Follower Gel Time and Spiral Flow of Thermal Setting Molding Compounds
F05100 - SEMI F51 - Guide for Elastometric Sealing Technology
SEMI F51 - Guide for Elastometric Sealing Technology Sale priceMember Price: $113.00
Non-Member Price: $193.00
M08800 - SEMI M88 - Practice for Sample Preparation Methods for Measuring Minority Carrier Diffusion Length in Silicon Wafers by Surface Photovoltage Methods
M03100 - SEMI M31 - Specification for Mechanical Features of Front-Opening Shipping Box Used to Transport and Ship 300 mm Wafers
F04500 - SEMI F45 - Specification for Machined Stainless Steel Reducing Weld Fittings
M06100 - SEMI M61 - 埋め込み層付きシリコンエピタキシャルウェーハの仕様
SEMI M61 - 埋め込み層付きシリコンエピタキシャルウェーハの仕様 Sale priceMember Price: $135.00
Non-Member Price: $231.00
M04000 - SEMI M40 - Guide for Measurement of Roughness of Planar Surfaces on Polished Wafers
SEMI M40 - Guide for Measurement of Roughness of Planar Surfaces on Polished Wafers Sale priceMember Price: $113.00
Non-Member Price: $193.00
MF002800 - SEMI MF28 - Test Method for Minority Carrier Lifetime in Bulk Germanium and Silicon by Measurement of Photoconductivity Decay
G01000 - SEMI G10 - プラスチックパッケージリードフレームの機械的標準測定方法
M05000 - SEMI M50 - Test Method for Determining Capture Rate and False Count Rate for Surface Scanning Inspection Systems by the Overlay Method
G03100 - SEMI G31 - Test Method for Determining the Abrasive Characteristics of Molding Compounds
E01000 - SEMI E10 - Specification for Definition and Measurement of Equipment Reliability, Availability, and Maintainability (RAM) and Utilization
E03700 - SEMI E37 - Specification for High-Speed SECS Message Services (HSMS) Generic Services
SEMI E37 - Specification for High-Speed SECS Message Services (HSMS) Generic Services Sale priceMember Price: $225.00
Non-Member Price: $380.00
E04000 - SEMI E40 - Specification for Processing Management
SEMI E40 - Specification for Processing Management Sale priceMember Price: $113.00
Non-Member Price: $193.00
E00400 - SEMI E4 - Specification for SEMI Equipment Communications Standard 1 Message Transfer (SECS-I)
G09700 - SEMI G97 - Specification for Adhesive Tray Used for Thin Chip Handling
SEMI G97 - Specification for Adhesive Tray Used for Thin Chip Handling Sale priceMember Price: $113.00
Non-Member Price: $193.00
E03900 - SEMI E39 - Specification for Object Services: Concepts, Behavior, and Services
SEMI E39 - Specification for Object Services: Concepts, Behavior, and Services Sale priceMember Price: $113.00
Non-Member Price: $193.00