Products

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SEMI G23 - 半導体パッケージの内部導体路のインダクタンスのための試験方法 Sale priceMember Price: $135.00
Non-Member Price: $203.00

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SEMI G24 - Test Method for Measuring the Lead-to-Lead and Loading Capacitance of Package Leads Sale priceMember Price: $113.00
Non-Member Price: $170.00

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SEMI G24 - パッケージ・リード間の容量および付加容量の測定のための試験方法 Sale priceMember Price: $135.00
Non-Member Price: $203.00

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SEMI G25 - Test Method for Measuring the Resistance of Package Leads Sale priceMember Price: $113.00
Non-Member Price: $170.00

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SEMI G25 - パッケージ・リード抵抗の測定のための試験方法 Sale priceMember Price: $135.00
Non-Member Price: $203.00

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SEMI G26 - Specification for Hermetic Slam Chip Carrier Lids Sale priceMember Price: $113.00
Non-Member Price: $150.00

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SEMI G27 - Specification for Leadframes for Plastic Leaded Chip Carrier (PLCC) Packages Sale priceMember Price: $113.00
Non-Member Price: $150.00

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SEMI G28 - Specification for Leadframes for Plastic Molded S.O. Packages Sale priceMember Price: $113.00
Non-Member Price: $170.00

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SEMI G28 - プラスチックモールドS.O.パッケージのリードフレームのための仕様 Sale priceMember Price: $135.00
Non-Member Price: $203.00

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SEMI G29 - Test Method for Trace Contaminants in Molding Compounds Sale priceMember Price: $113.00
Non-Member Price: $170.00

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SEMI G29 - モールディングコンパウンド中の微量異物検査のための試験方法 Sale priceMember Price: $135.00
Non-Member Price: $203.00

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SEMI G30 - Test Method for Junction-to-Case Thermal Resistance Measurements of Ceramic Packages Sale priceMember Price: $113.00
Non-Member Price: $170.00

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SEMI G30 - セラミックパッケージのジャンクションとケース間の熱抵抗測定のための試験方法 Sale priceMember Price: $135.00
Non-Member Price: $180.00

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SEMI G31 - Test Method for Determining the Abrasive Characteristics of Molding Compounds Sale priceMember Price: $113.00
Non-Member Price: $170.00

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SEMI G32 - Guideline for Unencapsulated Thermal Test Chip Sale priceMember Price: $113.00
Non-Member Price: $170.00

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SEMI G32 - カプセルなし熱抵抗測定用チップのガイドライン Sale priceMember Price: $135.00
Non-Member Price: $180.00

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SEMI G33 - Specification for Pressed Ceramic Pin Grid Array Packages Sale priceMember Price: $113.00
Non-Member Price: $150.00

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SEMI G34 - Specification for Cer-Pack Package Constructions, Including Leadframes, Suitable for Automated Assembly by End Users Sale priceMember Price: $113.00
Non-Member Price: $150.00

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SEMI G35 - Specification for Test Methods for Lead Finishes on Semiconductor (Active) Devices Sale priceMember Price: $113.00
Non-Member Price: $150.00

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SEMI G36 - Specification for Dimensions and Tolerances Used to Manufacture Plastic Molded High Density Tab Quad Semiconductor Package Tooling Sale priceMember Price: $113.00
Non-Member Price: $150.00

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SEMI G37 - Specification for Dimensions and Tolerances Used to Manufacture Plastic Molded Small Outline Package Tooling Sale priceMember Price: $113.00
Non-Member Price: $150.00

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SEMI G38 - Test Method for Still- and Forced-Air Junction-to-Ambient Thermal Resistance Measurements of Integrated Circuit Packages Sale priceMember Price: $113.00
Non-Member Price: $170.00

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SEMI G38 - 静止空気および強制風冷によるICパッケージのジャンクション部周囲間の熱抵抗の測定法 Sale priceMember Price: $135.00
Non-Member Price: $203.00

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SEMI G39 - Specification for Brazed Lead Flatpack Constructions, Including Leadframes, Suitable for Automated Assembly Sale priceMember Price: $113.00
Non-Member Price: $150.00