{"product_id":"interconnects-and-its-processes","title":"Interconnects and Its Processes","description":"\u003cdiv style='-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(0, 0, 0);font-family:\"Segoe UI\", \"Segoe UI Web\", Arial, Verdana, sans-serif;font-size:12px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;'\u003e\u003cdiv style='background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(0, 0, 0);font-family:\"Segoe UI\", \"Segoe UI Web\", Arial, Verdana, sans-serif;font-size:12px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;'\u003e\n\u003cp style=\"background-color:rgba(0, 0, 0, 0);box-sizing:border-box;color:rgb(0, 0, 0);font-style:normal;font-weight:normal;margin-top:0px;\"\u003e\u003cem style=\"box-sizing:border-box;color:rgb(0, 0, 0);font-family:Aptos, Aptos_MSFontService, sans-serif;font-size:16px;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e\u003ci\u003e\u003cstrong style=\"box-sizing:border-box;\"\u003eCourse Description\u003c\/strong\u003e\u003c\/i\u003e\u003c\/em\u003e\u003c\/p\u003e\n\u003cp style=\"background-color:rgba(0, 0, 0, 0);box-sizing:border-box;color:rgb(0, 0, 0);font-style:normal;font-weight:normal;margin-top:0px;\"\u003e\u003cem style=\"background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(0, 0, 0);font-family:Aptos, Aptos_EmbeddedFont, Aptos_MSFontService, sans-serif;font-size:16px;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e\u003ci\u003eThe semiconductor industry provides critical enabling technology for many products and fields and has seen periods of rapid growth.  While electronic goods dominate the market, communications, medical devices, and the automotive industry show signs of increased potential.\u003c\/i\u003e\u003c\/em\u003e\u003c\/p\u003e\n\u003cp style=\"background-color:rgba(0, 0, 0, 0);box-sizing:border-box;color:rgb(0, 0, 0);font-style:normal;font-weight:normal;margin-top:0px;\"\u003e\u003cem style=\"background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(0, 0, 0);font-family:Aptos, Aptos_EmbeddedFont, Aptos_MSFontService, sans-serif;font-size:16px;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e\u003ci\u003eThis course provides an an in-depth understanding of interconnects such as wire-bonding, tape automated bonding, and different flip chip technologies for microelectronics packaging.  This is the 5th course of the IC Packaging curriculum and is for the intermediate learner. By learning about the concepts taught in this course, engineers can take more issues they encounter in their design and manufacturing operations. After all, IC Packaging requires interdisciplinary knowledge such as mechanical, materials, chemical, and electronics engineering. \u003c\/i\u003e\u003c\/em\u003e\u003c\/p\u003e\n\u003cp style=\"background-color:rgba(0, 0, 0, 0);box-sizing:border-box;color:rgb(0, 0, 0);font-style:normal;font-weight:normal;margin-top:0px;\"\u003e\u003cem style=\"background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(0, 0, 0);font-family:Aptos, Aptos_MSFontService, sans-serif;font-size:16px;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e\u003ci\u003e\u003cstrong style=\"box-sizing:border-box;\"\u003eTopics include:\u003c\/strong\u003e\u003c\/i\u003e\u003c\/em\u003e\u003c\/p\u003e\n\u003c\/div\u003e\u003c\/div\u003e\u003cdiv style=\"-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(0, 0, 0);font-family:sans-serif;font-size:14px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e\n\u003cp style=\"background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(0, 0, 0);font-style:normal;font-weight:normal;margin-top:0px;\"\u003e\u003cem style=\"box-sizing:border-box;\"\u003e\u003ci\u003eComparison between interconnects\u003c\/i\u003e\u003c\/em\u003e\u003c\/p\u003e\n\u003cp style=\"background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(0, 0, 0);font-style:normal;font-weight:normal;margin-top:0px;\"\u003e\u003cem style=\"box-sizing:border-box;\"\u003e\u003ci\u003eWirebond and its technologies\u003c\/i\u003e\u003c\/em\u003e\u003c\/p\u003e\n\u003cp style=\"background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(0, 0, 0);font-style:normal;font-weight:normal;margin-top:0px;\"\u003e\u003cem style=\"box-sizing:border-box;\"\u003e\u003ci\u003eTape automated bonding and its technologies\u003c\/i\u003e\u003c\/em\u003e\u003c\/p\u003e\n\u003cp style=\"background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(0, 0, 0);font-style:normal;font-weight:normal;margin-top:0px;\"\u003e\u003cem style=\"box-sizing:border-box;\"\u003e\u003ci\u003eFlip chip and its technologies\u003c\/i\u003e\u003c\/em\u003e\u003c\/p\u003e\n\u003cp style='background-color:rgba(0, 0, 0, 0);box-sizing:border-box;color:rgb(0, 0, 0);font-family:\"Segoe UI\", \"Segoe UI Web\", Arial, Verdana, sans-serif;font-size:12px;font-style:normal;font-weight:normal;margin-top:0px;'\u003e\u003cem style=\"background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(0, 0, 0);font-family:Aptos, Aptos_MSFontService, sans-serif;font-size:16px;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e\u003ci\u003e\u003cstrong style=\"box-sizing:border-box;\"\u003eCourse Duration\u003c\/strong\u003e\u003c\/i\u003e\u003c\/em\u003e\u003c\/p\u003e\n\u003cp style='background-color:rgba(0, 0, 0, 0);box-sizing:border-box;color:rgb(0, 0, 0);font-family:\"Segoe UI\", \"Segoe UI Web\", Arial, Verdana, sans-serif;font-size:12px;font-style:normal;font-weight:normal;margin-top:0px;'\u003e\u003cem style=\"background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(0, 0, 0);font-family:Aptos, Aptos_EmbeddedFont, Aptos_MSFontService, sans-serif;font-size:16px;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e\u003ci\u003e60 minutes\u003c\/i\u003e\u003c\/em\u003e\u003c\/p\u003e\n\u003cp style='background-color:rgba(0, 0, 0, 0);box-sizing:border-box;color:rgb(0, 0, 0);font-family:\"Segoe UI\", \"Segoe UI Web\", Arial, Verdana, sans-serif;font-size:12px;font-style:normal;font-weight:normal;margin-top:0px;'\u003e\u003cem style=\"background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(0, 0, 0);font-family:Aptos, Aptos_MSFontService, sans-serif;font-size:16px;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e\u003ci\u003e\u003cstrong style=\"box-sizing:border-box;\"\u003eTarget Audience\u003c\/strong\u003e\u003c\/i\u003e\u003c\/em\u003e\u003c\/p\u003e\n\u003cp style='background-color:rgba(0, 0, 0, 0);box-sizing:border-box;color:rgb(0, 0, 0);font-family:\"Segoe UI\", \"Segoe UI Web\", Arial, Verdana, sans-serif;font-size:12px;font-style:normal;font-weight:normal;margin-top:0px;'\u003e\u003cem style=\"background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(0, 0, 0);font-family:Aptos, Aptos_EmbeddedFont, Aptos_MSFontService, sans-serif;font-size:16px;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e\u003ci\u003eSales engineers\/business development executives, college students who are interested in joining the semiconductor industry, especially in OSAT, EMS, and IDM (Package Assembly.) Materials and equipment from industry companies can take advantage of this curriculum to ensure their workforce is ready.\u003c\/i\u003e\u003c\/em\u003e\u003c\/p\u003e\n\u003cp style='background-color:rgba(0, 0, 0, 0);box-sizing:border-box;color:rgb(0, 0, 0);font-family:\"Segoe UI\", \"Segoe UI Web\", Arial, Verdana, sans-serif;font-size:12px;font-style:normal;font-weight:normal;margin-top:0px;'\u003e\u003cem style=\"background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(0, 0, 0);font-family:Aptos, Aptos_MSFontService, sans-serif;font-size:16px;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e\u003ci\u003e\u003cstrong style=\"box-sizing:border-box;\"\u003eRequisite Knowledge\u003c\/strong\u003e\u003c\/i\u003e\u003c\/em\u003e\u003c\/p\u003e\n\u003cp style='background-color:rgba(0, 0, 0, 0);box-sizing:border-box;color:rgb(0, 0, 0);font-family:\"Segoe UI\", \"Segoe UI Web\", Arial, Verdana, sans-serif;font-size:12px;font-style:normal;font-weight:normal;margin-top:0px;'\u003e\u003cem style=\"background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(0, 0, 0);font-family:Aptos, Aptos_EmbeddedFont, Aptos_MSFontService, sans-serif;font-size:16px;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e\u003ci\u003e\u003cstrong style=\"box-sizing:border-box;\"\u003eAt least some college-level scientific knowledge\u003c\/strong\u003e\u003c\/i\u003e\u003c\/em\u003e\u003c\/p\u003e\n\u003c\/div\u003e","brand":"Dr. Lee Teck Kheng","offers":[{"title":"Default Title","offer_id":43106835562563,"sku":"18247","price":119.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0567\/3402\/3747\/files\/800x800SU_Interposers_1.png?v=1776700957","url":"https:\/\/store-dev2.semi.org\/products\/interconnects-and-its-processes","provider":"SEMI Dev 2","version":"1.0","type":"link"}