{"product_id":"flexible-printed-electronics-bundle","title":"Flexible \u0026 Printed Electronics Bundle","description":"\u003cp\u003e\u003cstrong\u003e\u003cem\u003eCourse Description \u003c\/em\u003e\u003c\/strong\u003e\u003c\/p\u003e\n\u003cp\u003e\u003cem\u003eThis bundle consists of seven courses.  In this bundle will cover the following topics: 1. Flexible Power Sources: Challenges, Progress, and Integration, 2. Hybrid Integration Techniques for Flexible Electronics, 3. Flexible Batteries, 4. Flexible Hybrid Electronics 2.0 based on Fan-Out Wafer 5. Packaging, Printing, Curing and Characterization Methods for Printable Conductors, 6. FHE for Medical \u0026amp; Industrial Application, 7.Next Generation of Printed Electronics. Electronics. \u003c\/em\u003e\u003c\/p\u003e\n\u003cp\u003e\u003cem\u003eTopics covered include the following: Review challenges and programs for new power supplies, basics of battery terminology, chemistry and structures relevant to flexible electronics, how new packaging paradigms like chiplets and dielets are impacting flexible hybrid electronics (FHE), basics of using printable conductors for additive manufacture of circuits on polymer substrates, best-known methods for optimizing flexible electronics into medical devices and industrial products, and latest materials and equipment advancement for next-gen printed electronics.\u003c\/em\u003e\u003c\/p\u003e\n\u003cp\u003e\u003cstrong\u003e\u003cem\u003eCourse Objectives \u003c\/em\u003e\u003c\/strong\u003e\u003cem\u003e \u003c\/em\u003e\u003c\/p\u003e\n\u003cul\u003e\n\u003cli\u003e\u003cem\u003eReview challenges and programs for new power supplies that are emerging to meet the needs of the FHE community.\u003c\/em\u003e\u003c\/li\u003e\n\u003cli\u003e\u003cem\u003eLearn the basics of battery terminology and unique challenges related to using and manufacturing flexible batteries.\u003c\/em\u003e\u003c\/li\u003e\n\u003cli\u003e\u003cem\u003eUnderstand challenges associated with scaling FHE, including adopting dielet technology in advanced CMOS nodes. \u003c\/em\u003e\u003c\/li\u003e\n\u003cli\u003e\u003cem\u003eOverview of traditional and digital printing methods, drying, curing, sintering, and design and assembly differences compared to traditional printed circuit boards.\u003c\/em\u003e\u003c\/li\u003e\n\u003cli\u003e\u003cem\u003ePresents important considerations when designing flexible and printable parts and circuits.\u003c\/em\u003e\u003c\/li\u003e\n\u003cli\u003e\u003cem\u003eProvides basics of PFHE processing technologies from dispensing and inkjet printing to roll-to-roll printing and coating.\u003c\/em\u003e\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003cp\u003e \u003cstrong\u003e\u003cem\u003eCourse Duration\u003c\/em\u003e\u003c\/strong\u003e\u003c\/p\u003e\n\u003cp\u003e\u003cem\u003e5.25 hours\u003c\/em\u003e\u003c\/p\u003e\n\u003cp\u003e\u003cstrong\u003e\u003cem\u003eTarget Audience \u003c\/em\u003e\u003c\/strong\u003e\u003c\/p\u003e\n\u003cp\u003e\u003cem\u003eManagers, supervisors, engineers, technicians or any individual working directly with this equipment or product  \u003c\/em\u003e\u003c\/p\u003e\n\u003cp\u003e\u003cstrong\u003e\u003cem\u003eRequisite Knowledge \u003c\/em\u003e\u003c\/strong\u003e\u003c\/p\u003e\n\u003cp\u003e\u003cem\u003eNone\u003c\/em\u003e\u003c\/p\u003e","brand":"semi.org","offers":[{"title":"Default Title","offer_id":43106851520579,"sku":"16462","price":580.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0567\/3402\/3747\/files\/ShopifyTIle22048x2048_F_PE.png?v=1776701254","url":"https:\/\/store-dev2.semi.org\/products\/flexible-printed-electronics-bundle","provider":"SEMI Dev 2","version":"1.0","type":"link"}