{"product_id":"semi111-introduction-to-hybrid-bonding-for-advanced-packaging","title":"SEMI111 Introduction to Hybrid Bonding for Advanced Packaging","description":"\u003cp style=\"-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(65, 65, 65);font-family:sans-serif;font-size:14px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;margin-top:0px;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\" id=\"isPasted\"\u003e\u003cem style=\"box-sizing:border-box;\"\u003e\u003ci\u003e\u003cstrong style=\"box-sizing:border-box;\"\u003eCourse Description \u003c\/strong\u003e\u003c\/i\u003e\u003c\/em\u003e\u003c\/p\u003e\u003cp style=\"-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(65, 65, 65);font-family:sans-serif;font-size:14px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;line-height:normal;margin-bottom:0in;margin-top:0px;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e\u003cem style=\"box-sizing:border-box;\"\u003e\u003ci\u003eThis course will discuss the meaning and the need for advanced packaging such as Chiplets, and 3D Stacked Systems, with a deep dive into Hybrid Bonding For many generations of technology nodes, Moore's Law has reliably delivered the doubling of transistor density every 1.5 to 2 years while bringing down the cost per transistor. However, in recent advanced nodes, Moore's Law has slowed down the cost of advanced nodes causing chips to increase.\u003c\/i\u003e\u003c\/em\u003e\u003c\/p\u003e\u003cp style=\"-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(65, 65, 65);font-family:sans-serif;font-size:14px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;line-height:normal;margin-bottom:0in;margin-top:0px;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e\u003cem style=\"box-sizing:border-box;\"\u003e\u003ci\u003e​\u003c\/i\u003e\u003c\/em\u003e\u003cbr\u003e \u003c\/p\u003e\u003cp style=\"-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(65, 65, 65);font-family:sans-serif;font-size:14px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;line-height:normal;margin-bottom:0in;margin-top:0px;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e\u003cem style=\"box-sizing:border-box;\"\u003e\u003ci\u003eTo keep up with performance demands, manufacturers have continued to increase chip size to have large System on Chip (SoCs) causing chip sizes to reach the lithographic reticle limits. Moreover, increasing chip size beyond reticle limits also decreases chip yields and contributes to increasing the cost of manufacturing, thus increasing chip sizes beyond reticle limits.\u003c\/i\u003e\u003c\/em\u003e\u003c\/p\u003e\u003cp style=\"-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(65, 65, 65);font-family:sans-serif;font-size:14px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;line-height:normal;margin-bottom:0in;margin-top:0px;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e\u003cem style=\"box-sizing:border-box;\"\u003e\u003ci\u003eThe semiconductor industry needs to be on the path to deliver more performance and functionality at reasonable prices despite the slowing of Moore's Law.\u003c\/i\u003e\u003c\/em\u003e\u003c\/p\u003e\u003cp style=\"-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(65, 65, 65);font-family:sans-serif;font-size:14px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;line-height:normal;margin-bottom:0in;margin-top:0px;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e \u003c\/p\u003e\u003cp style=\"-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(65, 65, 65);font-family:sans-serif;font-size:14px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;line-height:normal;margin-bottom:0in;margin-top:0px;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e\u003cem style=\"box-sizing:border-box;\"\u003e\u003ci\u003eOne popular approach the industry is adopting to deliver is focusing on Advanced Packaging, including the use of Chiplets, Hybrid Bonding, and state-of-the-art 3D Stack Systems. This course will discuss the meaning and need for Advanced Packaging and dive into each one of these Advanced Packaging approaches. \u003c\/i\u003e\u003c\/em\u003e\u003c\/p\u003e\u003cp style=\"-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(65, 65, 65);font-family:sans-serif;font-size:14px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;line-height:normal;margin-bottom:0in;margin-top:0px;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e\u003cem style=\"box-sizing:border-box;\"\u003e\u003ci\u003e​\u003c\/i\u003e\u003c\/em\u003e\u003cbr\u003e \u003c\/p\u003e\u003cp style=\"-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(65, 65, 65);font-family:sans-serif;font-size:14px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;line-height:normal;margin-bottom:0in;margin-top:0px;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e\u003cem style=\"box-sizing:border-box;\"\u003e\u003ci\u003e​\u003cstrong style=\"box-sizing:border-box;\" id=\"isPasted\"\u003eCourse Objectives\u003c\/strong\u003e\u003c\/i\u003e\u003c\/em\u003e\u003c\/p\u003e\u003cul\u003e\n\u003cli style=\"box-sizing:border-box;\"\u003e\u003cem style=\"box-sizing:border-box;\"\u003e\u003ci\u003eRecognize the need for Advanced Packaging\u003c\/i\u003e\u003c\/em\u003e\u003c\/li\u003e\n\u003cli style=\"box-sizing:border-box;\"\u003e\u003cem style=\"box-sizing:border-box;\"\u003e\u003ci\u003eIdentify the types of Advanced Packaging\u003c\/i\u003e\u003c\/em\u003e\u003c\/li\u003e\n\u003cli style=\"box-sizing:border-box;\"\u003e\u003cem style=\"box-sizing:border-box;\"\u003e\u003ci\u003eExplain 3D Bonding and the basics of Hybrid Bonding for Advanced Packaging\u003c\/i\u003e\u003c\/em\u003e\u003c\/li\u003e\n\u003cli style=\"box-sizing:border-box;\"\u003e\n\u003cem style=\"box-sizing:border-box;\"\u003e\u003ci\u003eIdentify the types of Hybrid Bonding, the current status, and the challenges\u003c\/i\u003e\u003c\/em\u003e \u003c\/li\u003e\n\u003cli style=\"box-sizing:border-box;\"\u003e\u003cem style=\"box-sizing:border-box;\"\u003e\u003ci\u003eDiscuss future opportunities in Hybrid Bonding\u003c\/i\u003e\u003c\/em\u003e\u003c\/li\u003e\n\u003c\/ul\u003e\u003cp\u003e \u003c\/p\u003e\u003cp style=\"-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(65, 65, 65);font-family:sans-serif;font-size:14px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;line-height:normal;margin-bottom:0in;margin-top:0px;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e\u003cem style=\"box-sizing:border-box;\"\u003e\u003ci\u003e\u003cstrong style=\"box-sizing:border-box;\"\u003eCourse Duration\u003c\/strong\u003e\u003c\/i\u003e\u003c\/em\u003e\u003c\/p\u003e\u003cp style=\"-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(65, 65, 65);font-family:sans-serif;font-size:14px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;line-height:normal;margin-bottom:0in;margin-top:0px;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e\u003cem style=\"box-sizing:border-box;\"\u003e\u003ci\u003e95 minutes\u003c\/i\u003e\u003c\/em\u003e\u003c\/p\u003e\u003cp style=\"-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(65, 65, 65);font-family:sans-serif;font-size:14px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;line-height:normal;margin-bottom:0in;margin-top:0px;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e \u003c\/p\u003e\u003cp style=\"-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(65, 65, 65);font-family:sans-serif;font-size:14px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;line-height:normal;margin-bottom:0in;margin-top:0px;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e \u003c\/p\u003e\u003cp style=\"-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(65, 65, 65);font-family:sans-serif;font-size:14px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;line-height:normal;margin-bottom:0in;margin-top:0px;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e\u003cem style=\"box-sizing:border-box;\"\u003e\u003ci\u003e\u003cstrong style=\"box-sizing:border-box;\"\u003eTarget Audience \u003c\/strong\u003e\u003c\/i\u003e\u003c\/em\u003e\u003c\/p\u003e\u003cp style=\"-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(65, 65, 65);font-family:sans-serif;font-size:14px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;line-height:normal;margin-bottom:0in;margin-top:0px;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e\u003cem style=\"box-sizing:border-box;\"\u003e\u003ci\u003eManagers, supervisors, engineers, technicians, or any individual working directly with this equipment or product  \u003c\/i\u003e\u003c\/em\u003e\u003c\/p\u003e\u003cp style=\"-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(65, 65, 65);font-family:sans-serif;font-size:14px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;line-height:normal;margin-bottom:0in;margin-top:0px;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e \u003c\/p\u003e\u003cp style=\"-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(65, 65, 65);font-family:sans-serif;font-size:14px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;line-height:normal;margin-bottom:0in;margin-top:0px;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e \u003c\/p\u003e\u003cp style=\"-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(65, 65, 65);font-family:sans-serif;font-size:14px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;line-height:normal;margin-bottom:0in;margin-top:0px;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e\u003cem style=\"box-sizing:border-box;\"\u003e\u003ci\u003e\u003cstrong style=\"box-sizing:border-box;\"\u003eRequisite Knowledge \u003c\/strong\u003e\u003c\/i\u003e\u003c\/em\u003e\u003c\/p\u003e\u003cp style=\"-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(65, 65, 65);font-family:sans-serif;font-size:14px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;line-height:normal;margin-top:0px;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e\u003cem style=\"box-sizing:border-box;\"\u003e\u003ci\u003eNone\u003c\/i\u003e\u003c\/em\u003e\u003c\/p\u003e","brand":"semi.org","offers":[{"title":"Default Title","offer_id":43106836611139,"sku":"18122","price":68000.0,"currency_code":"KRW","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0567\/3402\/3747\/files\/800x800SU_AdvancedPkg_v1_1.png?v=1776700978","url":"https:\/\/store-dev2.semi.org\/ko-kr\/products\/semi111-introduction-to-hybrid-bonding-for-advanced-packaging","provider":"SEMI Dev 2","version":"1.0","type":"link"}