{"product_id":"leadframe-and-substrate-package-assembly-proce","title":"Leadframe and Substrate Package Assembly Process","description":"\u003cp\u003e\u003cspan style=\"color:black;\"\u003e\u003ci\u003e\u003cstrong\u003eCourse Description\u003c\/strong\u003e \u003c\/i\u003e\u003c\/span\u003e\u003c\/p\u003e\u003cp\u003e\u003cspan style=\"color:black;\"\u003e\u003ci\u003eThis course provides an overview of the leadframe and substrate package assembly processes. It provides an overview of the leadframe and substrate material before diving into the package assembly processes. The assembly processes of QFP leadframe and flip chip BGA package from wire bond, die-attach, and flip chip to package singulation will be shared in this course. \u003c\/i\u003e\u003c\/span\u003e\u003c\/p\u003e\u003cp\u003e \u003c\/p\u003e\u003cp\u003e\u003cspan style=\"color:black;\"\u003e\u003ci\u003e\u003cstrong\u003eCourse Objectives\u003c\/strong\u003e \u003c\/i\u003e\u003c\/span\u003e\u003c\/p\u003e\u003cul\u003e\n\u003cli\u003e\u003cspan style=\"color:black;\"\u003e\u003ci\u003eIdentify the materials in the leadframe and rigid substrate structure \u003c\/i\u003e\u003c\/span\u003e\u003c\/li\u003e\n\u003cli\u003e\u003cspan style=\"color:black;\"\u003e\u003ci\u003eDescribe the front-of-line assembly processes and defects \u003c\/i\u003e\u003c\/span\u003e\u003c\/li\u003e\n\u003cli\u003e\u003cspan style=\"color:black;\"\u003e\u003ci\u003eExplain the end-of-line assembly processes and defects \u003c\/i\u003e\u003c\/span\u003e\u003c\/li\u003e\n\u003cli\u003e\u003cspan style=\"color:black;\"\u003e\u003ci\u003eDescribe the typical leadframe and substrate assembly processes \u003c\/i\u003e\u003c\/span\u003e\u003c\/li\u003e\n\u003cli\u003e\u003cspan style=\"color:black;\"\u003e\u003ci\u003eExplain how the materials affect the assembly processes  \u003c\/i\u003e\u003c\/span\u003e\u003c\/li\u003e\n\u003c\/ul\u003e\u003cp\u003e \u003c\/p\u003e\u003cp\u003e\u003cspan style=\"color:black;\"\u003e\u003ci\u003e\u003cstrong\u003eCourse Duration\u003c\/strong\u003e \u003c\/i\u003e\u003c\/span\u003e\u003c\/p\u003e\u003cp\u003e\u003cspan style=\"color:black;\"\u003e\u003ci\u003e70 minutes  \u003c\/i\u003e\u003c\/span\u003e\u003c\/p\u003e\u003cp\u003e \u003c\/p\u003e\u003cp\u003e\u003cspan style=\"color:black;\"\u003e\u003ci\u003e\u003cstrong\u003eTarget Audience\u003c\/strong\u003e\u003c\/i\u003e\u003c\/span\u003e\u003c\/p\u003e\u003cp\u003e\u003cspan style=\"color:black;\"\u003e\u003ci\u003eSales engineers\/business development executives, college students who are interested in joining the semiconductor industry, especially in OSAT, EMS, IDM (Package Assembly.) Materials and equipment from industry companies can take advantage of this curriculum to ensure their workforce is ready. \u003c\/i\u003e\u003c\/span\u003e\u003c\/p\u003e\u003cp\u003e \u003c\/p\u003e\u003cp\u003e\u003cspan style=\"color:black;\"\u003e\u003ci\u003e\u003cstrong\u003eRequisite Audience\u003c\/strong\u003e\u003c\/i\u003e\u003c\/span\u003e\u003c\/p\u003e\u003cp\u003e\u003cspan style=\"color:black;\"\u003e\u003ci\u003eAt least some college-level scientific knowledge\u003c\/i\u003e\u003c\/span\u003e\u003c\/p\u003e","brand":"semi.org","offers":[{"title":"Default Title","offer_id":43106838052931,"sku":"17946","price":19700.0,"currency_code":"JPY","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0567\/3402\/3747\/files\/231193d8-5b06-41b5-875d-2f87343ffdf1.jpg?v=1776701010","url":"https:\/\/store-dev2.semi.org\/ja-jp\/products\/leadframe-and-substrate-package-assembly-proce","provider":"SEMI Dev 2","version":"1.0","type":"link"}